JP5845618B2 - 基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板 - Google Patents

基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板 Download PDF

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JP5845618B2
JP5845618B2 JP2011099368A JP2011099368A JP5845618B2 JP 5845618 B2 JP5845618 B2 JP 5845618B2 JP 2011099368 A JP2011099368 A JP 2011099368A JP 2011099368 A JP2011099368 A JP 2011099368A JP 5845618 B2 JP5845618 B2 JP 5845618B2
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substrate
stage
unit
decompression
decompression chamber
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JP2012231063A5 (enrdf_load_stackoverflow
JP2012231063A (ja
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白数　廣
廣 白数
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Nikon Corp
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JP2011099368A 2011-04-27 2011-04-27 基板貼り合わせ装置、基板貼り合わせ方法および重ね合わせ基板 Active JP5845618B2 (ja)

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JP2012231063A JP2012231063A (ja) 2012-11-22
JP2012231063A5 JP2012231063A5 (enrdf_load_stackoverflow) 2014-05-29
JP5845618B2 true JP5845618B2 (ja) 2016-01-20

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9837295B2 (en) 2010-04-15 2017-12-05 Suss Microtec Lithography Gmbh Apparatus and method for semiconductor wafer leveling, force balancing and contact sensing
JP6160077B2 (ja) * 2012-12-25 2017-07-12 株式会社ニコン 基板処理装置
JP6184843B2 (ja) 2013-11-18 2017-08-23 東芝メモリ株式会社 基板接合方法、及び基板接合装置
US9923273B2 (en) * 2013-12-02 2018-03-20 A.K. Stamping Company, Inc. System for manufacturing and tuning an NFC antenna
JP5971367B2 (ja) * 2015-03-04 2016-08-17 株式会社ニコン 基板重ね合わせ装置および基板重ね合わせ方法
JP6731805B2 (ja) * 2016-07-12 2020-07-29 東京エレクトロン株式会社 接合システム
US12106993B2 (en) 2019-12-10 2024-10-01 Ev Group E. Thallner Gmbh Method and device for aligning substrates
JP7495151B2 (ja) * 2022-10-03 2024-06-04 ボンドテック株式会社 アライメント装置およびアライメント方法
CN118692931B (zh) * 2024-08-28 2024-10-29 成都天波微电科技有限公司 一种电路芯片用金丝自动键合装置及生产工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08199118A (ja) * 1995-01-19 1996-08-06 Mitsubishi Materials Corp シリコン―シリコン接合方法
JP3296973B2 (ja) * 1995-08-11 2002-07-02 株式会社荏原製作所 磁気浮上除振装置
JP4370924B2 (ja) * 2003-08-27 2009-11-25 株式会社ニコン 真空装置、真空装置の運転方法、露光装置、及び露光装置の運転方法
JP3790995B2 (ja) * 2004-01-22 2006-06-28 有限会社ボンドテック 接合方法及びこの方法により作成されるデバイス並びに接合装置
JP2005294824A (ja) * 2004-03-12 2005-10-20 Bondotekku:Kk 真空中での超音波接合方法及び装置
JP2010080861A (ja) * 2008-09-29 2010-04-08 Nikon Corp 転写装置及びデバイス製造方法
NL2003854A (en) * 2008-12-22 2010-06-23 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP5540605B2 (ja) * 2009-08-28 2014-07-02 株式会社ニコン 位置合わせ装置および基板貼り合わせ装置

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