JP5844101B2 - 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 - Google Patents

発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 Download PDF

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Publication number
JP5844101B2
JP5844101B2 JP2011202126A JP2011202126A JP5844101B2 JP 5844101 B2 JP5844101 B2 JP 5844101B2 JP 2011202126 A JP2011202126 A JP 2011202126A JP 2011202126 A JP2011202126 A JP 2011202126A JP 5844101 B2 JP5844101 B2 JP 5844101B2
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Japan
Prior art keywords
plating layer
layer
wiring pattern
plating
light emitting
Prior art date
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Application number
JP2011202126A
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English (en)
Japanese (ja)
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JP2013065621A5 (https=
JP2013065621A (ja
Inventor
小林　和貴
和貴 小林
貴司 片山
貴司 片山
崇 吉江
崇 吉江
清水　浩
浩 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011202126A priority Critical patent/JP5844101B2/ja
Publication of JP2013065621A publication Critical patent/JP2013065621A/ja
Publication of JP2013065621A5 publication Critical patent/JP2013065621A5/ja
Application granted granted Critical
Publication of JP5844101B2 publication Critical patent/JP5844101B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Led Device Packages (AREA)
JP2011202126A 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法 Active JP5844101B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011202126A JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011202126A JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Publications (3)

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JP2013065621A JP2013065621A (ja) 2013-04-11
JP2013065621A5 JP2013065621A5 (https=) 2014-09-11
JP5844101B2 true JP5844101B2 (ja) 2016-01-13

Family

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Family Applications (1)

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JP2011202126A Active JP5844101B2 (ja) 2011-09-15 2011-09-15 発光装置用の配線基板、発光装置及び発光装置用配線基板の製造方法

Country Status (1)

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JP (1) JP5844101B2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6266907B2 (ja) * 2013-07-03 2018-01-24 新光電気工業株式会社 配線基板及び配線基板の製造方法
KR102148845B1 (ko) * 2013-12-12 2020-08-27 엘지이노텍 주식회사 인쇄회로기판
KR20150074421A (ko) * 2013-12-24 2015-07-02 엘지이노텍 주식회사 인쇄회로기판 및 이를 포함하는 발광 장치
JP6316731B2 (ja) 2014-01-14 2018-04-25 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体パッケージ
EP3142159B1 (en) 2014-05-09 2018-10-24 Kyocera Corporation Substrate for mounting light-emitting element, and light-emitting device
JP2016051797A (ja) * 2014-08-29 2016-04-11 大日本印刷株式会社 積層体、積層体を用いた配線基板の製造方法、配線基板、および配線基板を備える実装基板の製造方法
JP6555907B2 (ja) 2015-03-16 2019-08-07 アルパッド株式会社 半導体発光装置
US10566103B2 (en) * 2016-01-08 2020-02-18 Lilotree, L.L.C. Printed circuit surface finish, method of use, and assemblies made therefrom
JP6924642B2 (ja) * 2017-07-19 2021-08-25 スタンレー電気株式会社 半導体発光素子アレイ、及び、半導体発光装置
JP2021092629A (ja) * 2019-12-09 2021-06-17 フコクインダストリー株式会社 表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5559795A (en) * 1978-10-30 1980-05-06 Nippon Electric Co Printed circuit board and method of manufacturing same
SG102588A1 (en) * 2000-08-03 2004-03-26 Inst Materials Research & Eng A process for modifying chip assembly substrates
JP2004055624A (ja) * 2002-07-16 2004-02-19 Murata Mfg Co Ltd 基板の製造方法
JP4674120B2 (ja) * 2005-06-06 2011-04-20 京セラＳｌｃテクノロジー株式会社 配線基板およびその製造方法
JP2010182865A (ja) * 2009-02-05 2010-08-19 Nitto Denko Corp 配線回路基板の製造方法
EP2455991B1 (en) * 2009-07-17 2017-05-10 Denka Company Limited Led chip assembly, led package, and manufacturing method of led package

Also Published As

Publication number Publication date
JP2013065621A (ja) 2013-04-11

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