JP5841726B2 - 窒化ガリウム系半導体装置の製造方法 - Google Patents
窒化ガリウム系半導体装置の製造方法 Download PDFInfo
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- JP5841726B2 JP5841726B2 JP2011013425A JP2011013425A JP5841726B2 JP 5841726 B2 JP5841726 B2 JP 5841726B2 JP 2011013425 A JP2011013425 A JP 2011013425A JP 2011013425 A JP2011013425 A JP 2011013425A JP 5841726 B2 JP5841726 B2 JP 5841726B2
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- 239000004065 semiconductor Substances 0.000 title claims description 198
- 229910002601 GaN Inorganic materials 0.000 title claims description 59
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims description 59
- 238000004519 manufacturing process Methods 0.000 title claims description 56
- 238000000034 method Methods 0.000 title claims description 56
- 239000012535 impurity Substances 0.000 claims description 39
- 238000000137 annealing Methods 0.000 claims description 26
- 239000007787 solid Substances 0.000 claims description 14
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 11
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052794 bromium Inorganic materials 0.000 claims description 11
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 238000001020 plasma etching Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 2
- 230000008021 deposition Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 33
- 239000007789 gas Substances 0.000 description 24
- 238000005530 etching Methods 0.000 description 20
- 229910004298 SiO 2 Inorganic materials 0.000 description 17
- 238000004458 analytical method Methods 0.000 description 15
- 230000005669 field effect Effects 0.000 description 14
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 12
- 238000001312 dry etching Methods 0.000 description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 239000000460 chlorine Substances 0.000 description 10
- 125000004429 atom Chemical group 0.000 description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 7
- 150000002367 halogens Chemical class 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 3
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 3
- 238000000089 atomic force micrograph Methods 0.000 description 3
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910001195 gallium oxide Inorganic materials 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000005533 two-dimensional electron gas Effects 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- -1 Cesium ions Chemical class 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- USZGMDQWECZTIQ-UHFFFAOYSA-N [Mg](C1C=CC=C1)C1C=CC=C1 Chemical compound [Mg](C1C=CC=C1)C1C=CC=C1 USZGMDQWECZTIQ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- Chemical Kinetics & Catalysis (AREA)
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- Materials Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
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Description
[項目1]
第1の半導体層と、
前記第1の半導体層の一部が除去されたリセス部と、
前記第1の半導体層の下に形成され、窒化ガリウム系半導体からなる第2の半導体層と、を備え、
前記リセス部における、前記第2の半導体層のリセス面に存在するハロゲンが3atom%以下である、
窒化ガリウム系半導体装置。
[項目2]
前記第2の半導体層の、前記リセス面の算術平均粗さRaが1nm以下、前記リセス面の断面曲線の最大山高さと最大谷深さの差P−Vが15nm以下、および、前記リセス面の二乗平均粗さRMSが1.4nm以下のいずれかである項目1に記載の窒化ガリウム系半導体装置。
[項目3]
前記第2の半導体層の、前記リセス面の算術平均粗さRaが0.5nm以下、前記リセス面の断面曲線の最大山高さと最大谷深さの差P−Vが10nm以下、および、前記リセス面の二乗平均粗さRMSが1.1nm以下のいずれかである項目2に記載の窒化ガリウム系半導体装置。
[項目4]
前記第2の半導体層の前記リセス面に接して、絶縁層が形成された項目1から3のいずれか一項に記載の窒化ガリウム系半導体装置。
[項目5]
前記第2の半導体層がチャネル層であり、前記絶縁層がゲート絶縁膜である項目4に記載の窒化ガリウム系半導体装置。
[項目6]
窒化ガリウム系半導体からなる第1の半導体層を形成する第1半導体層形成工程と、
前記第1の半導体層の一部を、臭素系ガスを用いて、マイクロ波プラズマプロセスでドライエッチングして、リセス部を形成するリセス部形成工程と、を備える、
窒化ガリウム系半導体装置を製造する半導体装置の製造方法。
[項目7]
前記マイクロ波プラズマプロセスが、プラズマを用いた処理を行う処理室と、マイクロ波を導入する誘電体と、前記誘電体と前記第1の半導体層との間にエッチング用ガスを導入するシャワーヘッドとを備えたマイクロ波プラズマ装置で行われる、項目6に記載の半導体装置の製造方法。
[項目8]
前記第1の半導体層に接して、前記第1の半導体層に含まれる不純物の固溶度が、前記第1の半導体層より高い、第1の犠牲層を形成する第1犠牲層形成工程と、
前記第1の犠牲層および前記第1の半導体層をアニールする第1アニール工程と、
前記第1の犠牲層をウェットプロセスで除去する第1除去工程と、を更に備え、
前記第1の犠牲層が除去された領域を、前記リセス部形成工程において、前記マイクロ波プラズマプロセスでエッチングする項目6または7に記載の半導体装置の製造方法。
[項目9]
前記第1の犠牲層が500℃以下で形成される項目8に記載の半導体装置の製造方法。
[項目10]
前記第1の犠牲層が、SiO X (0<X≦2)、AlO X (0<X≦1.5)、SiN X (0<X≦4/3)、GaO X (0<X≦1.5)、HfO X (0<X≦2)、GdO X (0<X≦1.5)、MgO X (0<X≦1)、ScO X (0<X≦1.5)、ZrO X (0<X≦2)、TaO X (0≦X≦2.5)、TiO X (0≦X≦2)、NiO X (0≦X≦1.5)、およびVのいずれか一つ以上からなる項目8または9に記載の半導体装置の製造方法。
[項目11]
前記第1の半導体層の下に第2の半導体層を形成する第2半導体層形成工程を更に備え、
前記リセス部形成工程で形成される前記リセス部が、前記第1の半導体層を深さ方向に貫通し、前記第2の半導体層が前記リセス部で部分的に露出し、
前記リセス部における、前記第2の半導体層の露出面に接して、前記第2の半導体層に含まれる不純物の固溶度が、前記第2の半導体層より高い第2の犠牲層を形成する第2犠牲層形成工程と、
前記第2の犠牲層および前記第2の半導体層をアニールする第2アニール工程と、
前記第2の犠牲層をウェットプロセスで除去する第2除去工程と、を更に備える項目6から10のいずれか一項に記載の半導体装置の製造方法。
[項目12]
前記第2の半導体層が、窒化ガリウム系半導体からなる項目11に記載の半導体装置の製造方法。
[項目13]
前記第1の半導体層に電気的に接続された、ソース電極、およびドレイン電極を形成する電極層形成工程を更に備える項目12に記載の半導体装置の製造方法。
[項目14]
前記第2の犠牲層が500℃以下で形成される項目12または13に記載の半導体装置の製造方法。
[項目15]
前記第2の犠牲層が、SiO X (0<X≦2)、AlO X (0<X≦1.5)、SiN X (0<X≦4/3)、GaO X (0<X≦1.5)、HfO X (0<X≦2)、GdO X (0<X≦1.5)、MgO X (0<X≦1)、ScO X (0<X≦1.5)、ZrO X (0<X≦2)、TaO X (0≦X≦2.5)、TiO X (0≦X≦2)、NiO X (0≦X≦1.5)、およびVのいずれか一つ以上からなる項目12から14のいずれか一項に記載の半導体装置の製造方法。
[項目16]
前記第2の犠牲層を形成する工程において、CVD法、スパッタリング、又は蒸着によりにより、前記第2の犠牲層を成膜する項目11から15のいずれか一項に記載の半導体装置の製造方法。
Claims (9)
- 窒化ガリウム系半導体からなる第1の半導体層を形成する第1半導体層形成工程と、
前記第1の半導体層に接して、前記第1の半導体層に含まれる不純物の固溶度が前記第1の半導体層より高い、第1の犠牲層を形成する第1犠牲層形成工程と、
前記第1の犠牲層および前記第1の半導体層をアニールする第1アニール工程と、
前記第1の犠牲層をウエットプロセスで除去する第1除去工程と、
前記第1除去工程の後に前記第1の半導体層の一部を、臭素系ガスを用いてプラズマエッチングしてリセス部を形成するリセス部形成工程と
を備える
窒化ガリウム系半導体装置の製造方法。 - 前記第1の犠牲層が500℃以下で形成される請求項1に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第1の犠牲層が、SiOX(0<X≦2)、AlOX(0<X≦1.5)、SiNX(0<X≦4/3)、GaOX(0<X≦1.5)、HfOX(0<X≦2)、GdOX(0<X≦1.5)、MgOX(0<X≦1)、ScOX(0<X≦1.5)、ZrOX(0<X≦2)、TaOX(0≦X≦2.5)、TiOX(0≦X≦2)、NiOX(0≦X≦1.5)、およびVのいずれか一つ以上からなる請求項1に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第1の半導体層の下に第2の半導体層を形成する第2半導体層形成工程を更に備え、
前記リセス部形成工程で形成される前記リセス部が、前記第1の半導体層を深さ方向に貫通し、前記第2の半導体層が前記リセス部で部分的に露出し、
前記リセス部における、前記第2の半導体層の露出面に接して、前記第2の半導体層に含まれる不純物の固溶度が、前記第2の半導体層より高い第2の犠牲層を形成する第2犠牲層形成工程と、
前記第2の犠牲層および前記第2の半導体層をアニールする第2アニール工程と、
前記第2の犠牲層をウェットプロセスで除去する第2除去工程と、を更に備える請求項1に記載の窒化ガリウム系半導体装置の製造方法。 - 前記第2の半導体層が、窒化ガリウム系半導体からなる請求項4に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第1の半導体層に電気的に接続された、ソース電極、およびドレイン電極を形成する電極層形成工程を更に備える請求項5に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第2の犠牲層が500℃以下で形成される請求項5または6に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第2の犠牲層が、SiOX(0<X≦2)、AlOX(0<X≦1.5)、SiNX(0<X≦4/3)、GaOX(0<X≦1.5)、HfOX(0<X≦2)、GdOX(0<X≦1.5)、MgOX(0<X≦1)、ScOX(0<X≦1.5)、ZrOX(0<X≦2)、TaOX(0≦X≦2.5)、TiOX(0≦X≦2)、NiOX(0≦X≦1.5)、およびVのいずれか一つ以上からなる請求項5から7のいずれか一項に記載の窒化ガリウム系半導体装置の製造方法。
- 前記第2の犠牲層を形成する工程において、CVD法、スパッタリング、又は蒸着によりにより、前記第2の犠牲層を成膜する請求項4から8のいずれか一項に記載の窒化ガリウム系半導体装置の製造方法。
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