JP5838832B2 - 基板集合体、電子デバイス、及び基板集合体の製造方法 - Google Patents
基板集合体、電子デバイス、及び基板集合体の製造方法 Download PDFInfo
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- JP5838832B2 JP5838832B2 JP2012016387A JP2012016387A JP5838832B2 JP 5838832 B2 JP5838832 B2 JP 5838832B2 JP 2012016387 A JP2012016387 A JP 2012016387A JP 2012016387 A JP2012016387 A JP 2012016387A JP 5838832 B2 JP5838832 B2 JP 5838832B2
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012016387A JP5838832B2 (ja) | 2012-01-30 | 2012-01-30 | 基板集合体、電子デバイス、及び基板集合体の製造方法 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012016387A JP5838832B2 (ja) | 2012-01-30 | 2012-01-30 | 基板集合体、電子デバイス、及び基板集合体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013157432A JP2013157432A (ja) | 2013-08-15 |
| JP2013157432A5 JP2013157432A5 (https=) | 2015-02-26 |
| JP5838832B2 true JP5838832B2 (ja) | 2016-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012016387A Expired - Fee Related JP5838832B2 (ja) | 2012-01-30 | 2012-01-30 | 基板集合体、電子デバイス、及び基板集合体の製造方法 |
Country Status (1)
| Country | Link |
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| JP (1) | JP5838832B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017195318A (ja) * | 2016-04-22 | 2017-10-26 | 株式会社明電舎 | 集合基板 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100989A (ja) * | 1987-10-14 | 1989-04-19 | Matsushita Electric Ind Co Ltd | セラミック基板の構造 |
| JPH0249162U (https=) * | 1988-09-30 | 1990-04-05 | ||
| JPH0275765U (https=) * | 1988-11-29 | 1990-06-11 | ||
| JPH03252191A (ja) * | 1990-03-01 | 1991-11-11 | Matsushita Electric Ind Co Ltd | 金属基材絶縁基板 |
| JPH05226794A (ja) * | 1992-02-17 | 1993-09-03 | Horiba Ltd | プリント配線基板およびプリント配線基板用母材 |
| JP2566288Y2 (ja) * | 1992-02-21 | 1998-03-25 | 昭和電工株式会社 | 回路用基板 |
| JP3878871B2 (ja) * | 2002-03-19 | 2007-02-07 | 京セラ株式会社 | 多数個取りセラミック基板 |
| JP2003304038A (ja) * | 2002-04-11 | 2003-10-24 | Fuji Photo Film Co Ltd | 配線基板 |
| JP2004221514A (ja) * | 2002-11-22 | 2004-08-05 | Kyocera Corp | 多数個取り配線基板 |
| JP2005340541A (ja) * | 2004-05-27 | 2005-12-08 | Kyocera Corp | 多数個取り配線基板 |
| JP2006270083A (ja) * | 2005-02-25 | 2006-10-05 | Kyocera Corp | 集合基板及びその製造方法 |
| JP2007318035A (ja) * | 2006-05-29 | 2007-12-06 | Kyocera Corp | 多数個取り配線基板、電子部品収納用パッケージおよび電子装置 |
| JP5052398B2 (ja) * | 2008-04-24 | 2012-10-17 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
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- 2012-01-30 JP JP2012016387A patent/JP5838832B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JP2013157432A (ja) | 2013-08-15 |
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