JP2013157432A5 - - Google Patents

Download PDF

Info

Publication number
JP2013157432A5
JP2013157432A5 JP2012016387A JP2012016387A JP2013157432A5 JP 2013157432 A5 JP2013157432 A5 JP 2013157432A5 JP 2012016387 A JP2012016387 A JP 2012016387A JP 2012016387 A JP2012016387 A JP 2012016387A JP 2013157432 A5 JP2013157432 A5 JP 2013157432A5
Authority
JP
Japan
Prior art keywords
groove
substrate assembly
substrate
assembly according
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012016387A
Other languages
English (en)
Japanese (ja)
Other versions
JP5838832B2 (ja
JP2013157432A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012016387A priority Critical patent/JP5838832B2/ja
Priority claimed from JP2012016387A external-priority patent/JP5838832B2/ja
Publication of JP2013157432A publication Critical patent/JP2013157432A/ja
Publication of JP2013157432A5 publication Critical patent/JP2013157432A5/ja
Application granted granted Critical
Publication of JP5838832B2 publication Critical patent/JP5838832B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2012016387A 2012-01-30 2012-01-30 基板集合体、電子デバイス、及び基板集合体の製造方法 Expired - Fee Related JP5838832B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012016387A JP5838832B2 (ja) 2012-01-30 2012-01-30 基板集合体、電子デバイス、及び基板集合体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012016387A JP5838832B2 (ja) 2012-01-30 2012-01-30 基板集合体、電子デバイス、及び基板集合体の製造方法

Publications (3)

Publication Number Publication Date
JP2013157432A JP2013157432A (ja) 2013-08-15
JP2013157432A5 true JP2013157432A5 (https=) 2015-02-26
JP5838832B2 JP5838832B2 (ja) 2016-01-06

Family

ID=49052340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012016387A Expired - Fee Related JP5838832B2 (ja) 2012-01-30 2012-01-30 基板集合体、電子デバイス、及び基板集合体の製造方法

Country Status (1)

Country Link
JP (1) JP5838832B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017195318A (ja) * 2016-04-22 2017-10-26 株式会社明電舎 集合基板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01100989A (ja) * 1987-10-14 1989-04-19 Matsushita Electric Ind Co Ltd セラミック基板の構造
JPH0249162U (https=) * 1988-09-30 1990-04-05
JPH0275765U (https=) * 1988-11-29 1990-06-11
JPH03252191A (ja) * 1990-03-01 1991-11-11 Matsushita Electric Ind Co Ltd 金属基材絶縁基板
JPH05226794A (ja) * 1992-02-17 1993-09-03 Horiba Ltd プリント配線基板およびプリント配線基板用母材
JP2566288Y2 (ja) * 1992-02-21 1998-03-25 昭和電工株式会社 回路用基板
JP3878871B2 (ja) * 2002-03-19 2007-02-07 京セラ株式会社 多数個取りセラミック基板
JP2003304038A (ja) * 2002-04-11 2003-10-24 Fuji Photo Film Co Ltd 配線基板
JP2004221514A (ja) * 2002-11-22 2004-08-05 Kyocera Corp 多数個取り配線基板
JP2005340541A (ja) * 2004-05-27 2005-12-08 Kyocera Corp 多数個取り配線基板
JP2006270083A (ja) * 2005-02-25 2006-10-05 Kyocera Corp 集合基板及びその製造方法
JP2007318035A (ja) * 2006-05-29 2007-12-06 Kyocera Corp 多数個取り配線基板、電子部品収納用パッケージおよび電子装置
JP5052398B2 (ja) * 2008-04-24 2012-10-17 京セラ株式会社 多数個取り配線基板および配線基板ならびに電子装置

Similar Documents

Publication Publication Date Title
USD851829S1 (en) Personal carrying case for electronic vaping devices
USD781861S1 (en) Overlay
USD764893S1 (en) Surface mount electronic cam lock
USD749555S1 (en) Electronic device case
USD745311S1 (en) Double oven
USD685195S1 (en) Sheet material
WO2015022341A3 (en) Data processing
WO2016137555A3 (en) Polymer microwedges and methods of manufacturing same
USD765010S1 (en) Aircraft with applied surface pattern
USD717342S1 (en) Electronic device
IN2015DN01579A (https=)
USD720201S1 (en) Rotatable knob for an electronic cam lock
CA150429S (en) Case for an electronic device
MY176541A (en) Mold release film and process for producing semiconductor package
CA156416S (en) Electronic card
EP2778830A3 (en) Electronic device and method for manufacturing the same
JP2017520899A5 (https=)
USD720202S1 (en) Rotatable knob for an electronic cam lock
JP2016125927A5 (ja) 電子デバイス、電子機器、移動体、及び電子デバイスの製造方法
JP2014228489A5 (https=)
EP2905097A3 (en) Article produced by additive manufacturing
USD746344S1 (en) Emulsion plate
PT3875248T (pt) Método para produzir uma estrutura tridimensional numa superfície de um substrato plano
USD740280S1 (en) Electronic device
JP2013098209A5 (https=)