JP5836507B2 - 再生電子部品の製造方法 - Google Patents

再生電子部品の製造方法 Download PDF

Info

Publication number
JP5836507B2
JP5836507B2 JP2014557265A JP2014557265A JP5836507B2 JP 5836507 B2 JP5836507 B2 JP 5836507B2 JP 2014557265 A JP2014557265 A JP 2014557265A JP 2014557265 A JP2014557265 A JP 2014557265A JP 5836507 B2 JP5836507 B2 JP 5836507B2
Authority
JP
Japan
Prior art keywords
electronic component
conductive
solder
particles
residue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014557265A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2015064440A1 (ja
Inventor
石澤　英亮
英亮 石澤
敬士 久保田
敬士 久保田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2014557265A priority Critical patent/JP5836507B2/ja
Application granted granted Critical
Publication of JP5836507B2 publication Critical patent/JP5836507B2/ja
Publication of JPWO2015064440A1 publication Critical patent/JPWO2015064440A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/582—Recycling of unreacted starting or intermediate materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
JP2014557265A 2013-10-29 2014-10-22 再生電子部品の製造方法 Active JP5836507B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014557265A JP5836507B2 (ja) 2013-10-29 2014-10-22 再生電子部品の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013224455 2013-10-29
JP2013224455 2013-10-29
PCT/JP2014/078066 WO2015064440A1 (ja) 2013-10-29 2014-10-22 再生電子部品の製造方法及び接続構造体
JP2014557265A JP5836507B2 (ja) 2013-10-29 2014-10-22 再生電子部品の製造方法

Publications (2)

Publication Number Publication Date
JP5836507B2 true JP5836507B2 (ja) 2015-12-24
JPWO2015064440A1 JPWO2015064440A1 (ja) 2017-03-09

Family

ID=53004048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014557265A Active JP5836507B2 (ja) 2013-10-29 2014-10-22 再生電子部品の製造方法

Country Status (5)

Country Link
JP (1) JP5836507B2 (zh)
KR (1) KR102228473B1 (zh)
CN (1) CN105379434B (zh)
TW (1) TWI607042B (zh)
WO (1) WO2015064440A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017051872A1 (ja) * 2015-09-25 2017-03-30 積水化学工業株式会社 接続構造体の製造方法、導電性粒子、導電フィルム及び接続構造体
TWI683844B (zh) * 2017-10-27 2020-02-01 瑋鋒科技股份有限公司 共晶式異方性導電膜及製作方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321416A (ja) * 1996-05-30 1997-12-12 Sony Chem Corp 液晶デバイスの再生方法、及び再生装置、並びに異方性導電膜の剥離装置、ｉｃ剥離装置
JPH10153789A (ja) * 1996-11-22 1998-06-09 Sharp Corp 液晶パネルのｔｃｐリペア方法
JP2000197856A (ja) * 1999-01-11 2000-07-18 Casio Comput Co Ltd 異方性導電接着剤の残渣除去方法
WO2011004542A1 (ja) * 2009-07-08 2011-01-13 パナソニック株式会社 電子部品ユニット及び補強用接着剤
JP2013172005A (ja) * 2012-02-21 2013-09-02 Sumitomo Electric Ind Ltd リペアカッターおよび修復方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3493280B2 (ja) 1997-05-30 2004-02-03 シャープ株式会社 Ｔｃｐのリペア方法
JPH11285814A (ja) * 1998-04-02 1999-10-19 Hitachi Ltd はんだ除去材および基板上の電子部品の交換方法
KR101058188B1 (ko) * 2009-04-30 2011-08-22 주식회사 에스에프에이 기판 세정장치
EP2368475A1 (en) * 2010-03-25 2011-09-28 The Procter & Gamble Company A cleaning implement comprising hybrid foam
JPWO2011132658A1 (ja) * 2010-04-22 2013-07-18 積水化学工業株式会社 異方性導電材料及び接続構造体
JP5654289B2 (ja) 2010-08-26 2015-01-14 デクセリアルズ株式会社 実装体の製造方法及び実装体並びに異方性導電膜

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321416A (ja) * 1996-05-30 1997-12-12 Sony Chem Corp 液晶デバイスの再生方法、及び再生装置、並びに異方性導電膜の剥離装置、ｉｃ剥離装置
JPH10153789A (ja) * 1996-11-22 1998-06-09 Sharp Corp 液晶パネルのｔｃｐリペア方法
JP2000197856A (ja) * 1999-01-11 2000-07-18 Casio Comput Co Ltd 異方性導電接着剤の残渣除去方法
WO2011004542A1 (ja) * 2009-07-08 2011-01-13 パナソニック株式会社 電子部品ユニット及び補強用接着剤
JP2013172005A (ja) * 2012-02-21 2013-09-02 Sumitomo Electric Ind Ltd リペアカッターおよび修復方法

Also Published As

Publication number Publication date
KR20160077013A (ko) 2016-07-01
KR102228473B1 (ko) 2021-03-16
TW201527370A (zh) 2015-07-16
WO2015064440A1 (ja) 2015-05-07
CN105379434B (zh) 2018-06-08
CN105379434A (zh) 2016-03-02
TWI607042B (zh) 2017-12-01
JPWO2015064440A1 (ja) 2017-03-09

Similar Documents

Publication Publication Date Title
KR101380454B1 (ko) 도전 재료 및 접속 구조체
JP5143967B2 (ja) 異方性導電材料及び接続構造体
KR102410173B1 (ko) 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
JP6152043B2 (ja) 導電材料及び接続構造体
JP7517384B2 (ja) 異方性導電フィルム及びその製造方法、並びに接続構造体及びその製造方法
JP6114627B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP6496431B2 (ja) 導電材料及び接続構造体
JP5596767B2 (ja) 異方性導電材料及び接続構造体
JP5613220B2 (ja) 電子部品接続材料及び接続構造体
JP5836507B2 (ja) 再生電子部品の製造方法
JP2013054851A (ja) 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP2013118181A (ja) 異方性導電材料及び接続構造体
JP6523105B2 (ja) 導電材料、接続構造体及び接続構造体の製造方法
JP2016004971A (ja) 接続構造体及び接続構造体の製造方法
JP6328996B2 (ja) 導電ペースト、接続構造体及び接続構造体の製造方法
JP2014026963A (ja) 接続構造体の製造方法
JP6329014B2 (ja) 接続構造体及び接続構造体の製造方法
TWI789395B (zh) 導電材料及連接構造體
JP5740173B2 (ja) 接続構造体及び接続構造体の製造方法
JP2013149468A (ja) 異方性導電材料、接続構造体及び接続構造体の製造方法
JP2018046004A (ja) 導電材料及び接続構造体
KR20240006491A (ko) 도전성 입자, 도전 재료 및 접속 구조체
JP2012174359A (ja) 接続構造体及び接続構造体の製造方法
JP2018046003A (ja) 導電材料及び接続構造体
JP2013037843A (ja) 接続構造体及び接続構造体の製造方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20151006

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20151102

R151 Written notification of patent or utility model registration

Ref document number: 5836507

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151