KR102228473B1 - 재생 전자 부품의 제조 방법 및 접속 구조체 - Google Patents
재생 전자 부품의 제조 방법 및 접속 구조체 Download PDFInfo
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- KR102228473B1 KR102228473B1 KR1020157023039A KR20157023039A KR102228473B1 KR 102228473 B1 KR102228473 B1 KR 102228473B1 KR 1020157023039 A KR1020157023039 A KR 1020157023039A KR 20157023039 A KR20157023039 A KR 20157023039A KR 102228473 B1 KR102228473 B1 KR 102228473B1
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- Prior art keywords
- electronic component
- solder
- particles
- residue
- peeling
- Prior art date
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- MSYLJRIXVZCQHW-UHFFFAOYSA-N formaldehyde;6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound O=C.NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 MSYLJRIXVZCQHW-UHFFFAOYSA-N 0.000 description 1
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- 150000004820 halides Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910001502 inorganic halide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 150000003903 lactic acid esters Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- 230000000704 physical effect Effects 0.000 description 1
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- 229920002492 poly(sulfone) Polymers 0.000 description 1
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- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
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- 239000004814 polyurethane Substances 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
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- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
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- 150000003377 silicon compounds Chemical class 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
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- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013224455 | 2013-10-29 | ||
| JPJP-P-2013-224455 | 2013-10-29 | ||
| PCT/JP2014/078066 WO2015064440A1 (ja) | 2013-10-29 | 2014-10-22 | 再生電子部品の製造方法及び接続構造体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160077013A KR20160077013A (ko) | 2016-07-01 |
| KR102228473B1 true KR102228473B1 (ko) | 2021-03-16 |
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| JP (1) | JP5836507B2 (zh) |
| KR (1) | KR102228473B1 (zh) |
| CN (1) | CN105379434B (zh) |
| TW (1) | TWI607042B (zh) |
| WO (1) | WO2015064440A1 (zh) |
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| CN107615466B (zh) * | 2015-09-25 | 2021-04-30 | 积水化学工业株式会社 | 连接结构体的制造方法、导电性粒子、导电膜及连接结构体 |
| TWI683844B (zh) * | 2017-10-27 | 2020-02-01 | 瑋鋒科技股份有限公司 | 共晶式異方性導電膜及製作方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012190804A (ja) * | 2010-04-22 | 2012-10-04 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
| JP2013172005A (ja) * | 2012-02-21 | 2013-09-02 | Sumitomo Electric Ind Ltd | リペアカッターおよび修復方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09321416A (ja) * | 1996-05-30 | 1997-12-12 | Sony Chem Corp | 液晶デバイスの再生方法、及び再生装置、並びに異方性導電膜の剥離装置、ｉｃ剥離装置 |
| JP3824362B2 (ja) * | 1996-11-22 | 2006-09-20 | シャープ株式会社 | 液晶パネルのｔｃｐリペア方法 |
| JP3493280B2 (ja) | 1997-05-30 | 2004-02-03 | シャープ株式会社 | Ｔｃｐのリペア方法 |
| JPH11285814A (ja) * | 1998-04-02 | 1999-10-19 | Hitachi Ltd | はんだ除去材および基板上の電子部品の交換方法 |
| JP2000197856A (ja) * | 1999-01-11 | 2000-07-18 | Casio Comput Co Ltd | 異方性導電接着剤の残渣除去方法 |
| KR101058188B1 (ko) * | 2009-04-30 | 2011-08-22 | 주식회사 에스에프에이 | 기판 세정장치 |
| JP5115524B2 (ja) * | 2009-07-08 | 2013-01-09 | パナソニック株式会社 | 電子部品ユニット及び補強用接着剤 |
| EP2368475A1 (en) * | 2010-03-25 | 2011-09-28 | The Procter & Gamble Company | A cleaning implement comprising hybrid foam |
| JP5654289B2 (ja) | 2010-08-26 | 2015-01-14 | デクセリアルズ株式会社 | 実装体の製造方法及び実装体並びに異方性導電膜 |
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- 2014-10-22 JP JP2014557265A patent/JP5836507B2/ja active Active
- 2014-10-22 KR KR1020157023039A patent/KR102228473B1/ko active IP Right Grant
- 2014-10-22 CN CN201480032746.9A patent/CN105379434B/zh active Active
- 2014-10-29 TW TW103137476A patent/TWI607042B/zh active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012190804A (ja) * | 2010-04-22 | 2012-10-04 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
| JP2013172005A (ja) * | 2012-02-21 | 2013-09-02 | Sumitomo Electric Ind Ltd | リペアカッターおよび修復方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5836507B2 (ja) | 2015-12-24 |
| JPWO2015064440A1 (ja) | 2017-03-09 |
| WO2015064440A1 (ja) | 2015-05-07 |
| TW201527370A (zh) | 2015-07-16 |
| KR20160077013A (ko) | 2016-07-01 |
| CN105379434A (zh) | 2016-03-02 |
| CN105379434B (zh) | 2018-06-08 |
| TWI607042B (zh) | 2017-12-01 |
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