JP5826160B2 - 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 - Google Patents
圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 Download PDFInfo
- Publication number
- JP5826160B2 JP5826160B2 JP2012286124A JP2012286124A JP5826160B2 JP 5826160 B2 JP5826160 B2 JP 5826160B2 JP 2012286124 A JP2012286124 A JP 2012286124A JP 2012286124 A JP2012286124 A JP 2012286124A JP 5826160 B2 JP5826160 B2 JP 5826160B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- ingot
- rolled
- total
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 283
- 239000011889 copper foil Substances 0.000 title claims description 174
- 238000004519 manufacturing process Methods 0.000 title claims description 33
- 229910052802 copper Inorganic materials 0.000 claims description 109
- 239000010949 copper Substances 0.000 claims description 109
- 238000005452 bending Methods 0.000 claims description 94
- 238000000137 annealing Methods 0.000 claims description 34
- 238000005097 cold rolling Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 26
- 239000013078 crystal Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 21
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 229910052718 tin Inorganic materials 0.000 claims description 17
- 238000012545 processing Methods 0.000 claims description 15
- 229910052796 boron Inorganic materials 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 14
- 229910052742 iron Inorganic materials 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 229910052758 niobium Inorganic materials 0.000 claims description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- 229910052720 vanadium Inorganic materials 0.000 claims description 14
- 229910052725 zinc Inorganic materials 0.000 claims description 14
- 229910052726 zirconium Inorganic materials 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 8
- 238000005098 hot rolling Methods 0.000 claims description 7
- 238000005266 casting Methods 0.000 claims description 5
- -1 and further Substances 0.000 claims 3
- 238000005096 rolling process Methods 0.000 description 21
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000010410 layer Substances 0.000 description 13
- 229920001721 polyimide Polymers 0.000 description 13
- 238000012360 testing method Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000000635 electron micrograph Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012286124A JP5826160B2 (ja) | 2012-04-10 | 2012-12-27 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012089363 | 2012-04-10 | ||
JP2012089363 | 2012-04-10 | ||
JP2012286124A JP5826160B2 (ja) | 2012-04-10 | 2012-12-27 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014219690A Division JP2015061950A (ja) | 2012-04-10 | 2014-10-28 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013234383A JP2013234383A (ja) | 2013-11-21 |
JP5826160B2 true JP5826160B2 (ja) | 2015-12-02 |
Family
ID=49363761
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012286124A Active JP5826160B2 (ja) | 2012-04-10 | 2012-12-27 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
JP2014219690A Pending JP2015061950A (ja) | 2012-04-10 | 2014-10-28 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014219690A Pending JP2015061950A (ja) | 2012-04-10 | 2014-10-28 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP5826160B2 (zh) |
KR (1) | KR20130115140A (zh) |
CN (1) | CN103361509B (zh) |
TW (1) | TWI491325B (zh) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
JP6294257B2 (ja) * | 2015-03-30 | 2018-03-14 | Jx金属株式会社 | フレキシブルプリント基板用銅合金箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
KR101721314B1 (ko) * | 2015-05-21 | 2017-03-29 | 제이엑스금속주식회사 | 압연 동박, 구리 피복 적층판, 그리고 플렉시블 프린트 기판 및 전자 기기 |
CN106304689A (zh) * | 2015-06-05 | 2017-01-04 | Jx日矿日石金属株式会社 | 压延铜箔、覆铜层叠板、以及柔性印刷基板和电子设备 |
JP7016603B2 (ja) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | タッチパネル用ハードコートフィルム、及び、折り畳み式画像表示装置 |
JP7016605B2 (ja) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | タッチパネル用積層体、及び、折り畳み式画像表示装置 |
JP7016604B2 (ja) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | タッチパネル用積層体、折り畳み式画像表示装置 |
JP7016602B2 (ja) * | 2015-07-17 | 2022-02-07 | 大日本印刷株式会社 | タッチパネル用ハードコートフィルム、及び、折り畳み式画像表示装置 |
JP6578780B2 (ja) * | 2015-07-17 | 2019-09-25 | 大日本印刷株式会社 | タッチパネル用積層体、及び、折り畳み式画像表示装置 |
TWI702415B (zh) | 2015-07-17 | 2020-08-21 | 日商大日本印刷股份有限公司 | 光學構件用積層體及影像顯示裝置 |
JP6392268B2 (ja) * | 2016-02-05 | 2018-09-19 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6294376B2 (ja) * | 2016-02-05 | 2018-03-14 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6328679B2 (ja) * | 2016-03-28 | 2018-05-23 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6617313B2 (ja) * | 2017-08-03 | 2019-12-11 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6774457B2 (ja) * | 2018-05-16 | 2020-10-21 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6827022B2 (ja) * | 2018-10-03 | 2021-02-10 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
KR20210107699A (ko) * | 2018-12-28 | 2021-09-01 | 덴카 주식회사 | 세라믹스-구리 복합체, 세라믹스 회로 기판, 파워 모듈 및 세라믹스-구리 복합체의 제조 방법 |
CN114269957B (zh) * | 2019-09-27 | 2022-07-29 | 三菱综合材料株式会社 | 纯铜板 |
JP7238872B2 (ja) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | タッチパネル用ハードコートフィルム、及び、折り畳み式画像表示装置 |
JP7238869B2 (ja) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | タッチパネル用積層体、折り畳み式画像表示装置 |
JP7238871B2 (ja) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | タッチパネル用ハードコートフィルム、及び、折り畳み式画像表示装置 |
JP7238870B2 (ja) * | 2020-09-09 | 2023-03-14 | 大日本印刷株式会社 | タッチパネル用積層体、及び、折り畳み式画像表示装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3009383B2 (ja) * | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | 圧延銅箔およびその製造方法 |
KR100792653B1 (ko) * | 2005-07-15 | 2008-01-09 | 닛코킨조쿠 가부시키가이샤 | 전기 전자기기용 동합금 및 그의 제조 방법 |
JP4916206B2 (ja) * | 2006-03-31 | 2012-04-11 | Jx日鉱日石金属株式会社 | 電気・電子部品用Cu−Cr−Si系合金およびCu−Cr−Si系合金箔 |
JP5057932B2 (ja) * | 2007-10-31 | 2012-10-24 | Jx日鉱日石金属株式会社 | 圧延銅箔及びフレキシブルプリント配線板 |
JP4972115B2 (ja) * | 2009-03-27 | 2012-07-11 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP4992940B2 (ja) * | 2009-06-22 | 2012-08-08 | 日立電線株式会社 | 圧延銅箔 |
JP2011094200A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
JP5094834B2 (ja) * | 2009-12-28 | 2012-12-12 | Jx日鉱日石金属株式会社 | 銅箔の製造方法、銅箔及び銅張積層板 |
CN103080347A (zh) * | 2010-08-27 | 2013-05-01 | 古河电气工业株式会社 | 铜合金板材及其制造方法 |
EP2612934A1 (en) * | 2010-08-31 | 2013-07-10 | Furukawa Electric Co., Ltd. | Copper alloy sheet material and process for producing same |
JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
-
2012
- 2012-12-27 JP JP2012286124A patent/JP5826160B2/ja active Active
-
2013
- 2013-01-30 TW TW102103460A patent/TWI491325B/zh active
- 2013-04-05 KR KR1020130037696A patent/KR20130115140A/ko not_active Application Discontinuation
- 2013-04-10 CN CN201310122528.1A patent/CN103361509B/zh active Active
-
2014
- 2014-10-28 JP JP2014219690A patent/JP2015061950A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI491325B (zh) | 2015-07-01 |
CN103361509B (zh) | 2015-10-28 |
KR20130115140A (ko) | 2013-10-21 |
CN103361509A (zh) | 2013-10-23 |
JP2015061950A (ja) | 2015-04-02 |
JP2013234383A (ja) | 2013-11-21 |
TW201343014A (zh) | 2013-10-16 |
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