JP5824886B2 - 基板貼り合わせ方法および温度検出装置 - Google Patents

基板貼り合わせ方法および温度検出装置 Download PDF

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JP5824886B2
JP5824886B2 JP2011126954A JP2011126954A JP5824886B2 JP 5824886 B2 JP5824886 B2 JP 5824886B2 JP 2011126954 A JP2011126954 A JP 2011126954A JP 2011126954 A JP2011126954 A JP 2011126954A JP 5824886 B2 JP5824886 B2 JP 5824886B2
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temperature
substrate
heating
temperature detection
pair
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JP2012251964A5 (https=
JP2012251964A (ja
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菅谷　功
功 菅谷
尚彦 倉田
尚彦 倉田
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Nikon Corp
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JP2011126954A 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置 Active JP5824886B2 (ja)

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JP2012251964A JP2012251964A (ja) 2012-12-20
JP2012251964A5 JP2012251964A5 (https=) 2014-08-07
JP5824886B2 true JP5824886B2 (ja) 2015-12-02

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JP6260645B2 (ja) * 2016-05-27 2018-01-17 住友電気工業株式会社 ヒータユニット

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* Cited by examiner, † Cited by third party
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JP3249911B2 (ja) * 1996-01-08 2002-01-28 東京エレクトロン株式会社 温度測定装置、処理装置及び処理方法
DE19711702C1 (de) * 1997-03-20 1998-06-25 Siemens Ag Anordnung zur Bearbeitung einer Substratscheibe und Verfahren zu deren Betrieb
JP4805773B2 (ja) * 2006-09-20 2011-11-02 シチズンホールディングス株式会社 電子温度計
JP2009244174A (ja) * 2008-03-31 2009-10-22 Tokyo Electron Ltd ウェハ型温度計、温度測定装置、熱処理装置および温度測定方法
JP2011109040A (ja) * 2009-11-20 2011-06-02 Nikon Corp 半導体基板ホルダ及び温度検出装置

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