JP2012251964A5 - - Google Patents

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Publication number
JP2012251964A5
JP2012251964A5 JP2011126954A JP2011126954A JP2012251964A5 JP 2012251964 A5 JP2012251964 A5 JP 2012251964A5 JP 2011126954 A JP2011126954 A JP 2011126954A JP 2011126954 A JP2011126954 A JP 2011126954A JP 2012251964 A5 JP2012251964 A5 JP 2012251964A5
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JP
Japan
Prior art keywords
temperature
heating
pair
temperature detection
heat insulating
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JP2011126954A
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English (en)
Japanese (ja)
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JP5824886B2 (ja
JP2012251964A (ja
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Priority to JP2011126954A priority Critical patent/JP5824886B2/ja
Priority claimed from JP2011126954A external-priority patent/JP5824886B2/ja
Publication of JP2012251964A publication Critical patent/JP2012251964A/ja
Publication of JP2012251964A5 publication Critical patent/JP2012251964A5/ja
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Publication of JP5824886B2 publication Critical patent/JP5824886B2/ja
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JP2011126954A 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置 Active JP5824886B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011126954A JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011126954A JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Publications (3)

Publication Number Publication Date
JP2012251964A JP2012251964A (ja) 2012-12-20
JP2012251964A5 true JP2012251964A5 (https=) 2014-08-07
JP5824886B2 JP5824886B2 (ja) 2015-12-02

Family

ID=47524892

Family Applications (1)

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JP2011126954A Active JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Country Status (1)

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JP (1) JP5824886B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6260645B2 (ja) * 2016-05-27 2018-01-17 住友電気工業株式会社 ヒータユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249911B2 (ja) * 1996-01-08 2002-01-28 東京エレクトロン株式会社 温度測定装置、処理装置及び処理方法
DE19711702C1 (de) * 1997-03-20 1998-06-25 Siemens Ag Anordnung zur Bearbeitung einer Substratscheibe und Verfahren zu deren Betrieb
JP4805773B2 (ja) * 2006-09-20 2011-11-02 シチズンホールディングス株式会社 電子温度計
JP2009244174A (ja) * 2008-03-31 2009-10-22 Tokyo Electron Ltd ウェハ型温度計、温度測定装置、熱処理装置および温度測定方法
JP2011109040A (ja) * 2009-11-20 2011-06-02 Nikon Corp 半導体基板ホルダ及び温度検出装置

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