JP2012251964A5 - - Google Patents

Download PDF

Info

Publication number
JP2012251964A5
JP2012251964A5 JP2011126954A JP2011126954A JP2012251964A5 JP 2012251964 A5 JP2012251964 A5 JP 2012251964A5 JP 2011126954 A JP2011126954 A JP 2011126954A JP 2011126954 A JP2011126954 A JP 2011126954A JP 2012251964 A5 JP2012251964 A5 JP 2012251964A5
Authority
JP
Japan
Prior art keywords
temperature
heating
pair
temperature detection
heat insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011126954A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012251964A (ja
JP5824886B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011126954A priority Critical patent/JP5824886B2/ja
Priority claimed from JP2011126954A external-priority patent/JP5824886B2/ja
Publication of JP2012251964A publication Critical patent/JP2012251964A/ja
Publication of JP2012251964A5 publication Critical patent/JP2012251964A5/ja
Application granted granted Critical
Publication of JP5824886B2 publication Critical patent/JP5824886B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011126954A 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置 Active JP5824886B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011126954A JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011126954A JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Publications (3)

Publication Number Publication Date
JP2012251964A JP2012251964A (ja) 2012-12-20
JP2012251964A5 true JP2012251964A5 (https=) 2014-08-07
JP5824886B2 JP5824886B2 (ja) 2015-12-02

Family

ID=47524892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011126954A Active JP5824886B2 (ja) 2011-06-07 2011-06-07 基板貼り合わせ方法および温度検出装置

Country Status (1)

Country Link
JP (1) JP5824886B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6260645B2 (ja) * 2016-05-27 2018-01-17 住友電気工業株式会社 ヒータユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249911B2 (ja) * 1996-01-08 2002-01-28 東京エレクトロン株式会社 温度測定装置、処理装置及び処理方法
DE19711702C1 (de) * 1997-03-20 1998-06-25 Siemens Ag Anordnung zur Bearbeitung einer Substratscheibe und Verfahren zu deren Betrieb
JP4805773B2 (ja) * 2006-09-20 2011-11-02 シチズンホールディングス株式会社 電子温度計
JP2009244174A (ja) * 2008-03-31 2009-10-22 Tokyo Electron Ltd ウェハ型温度計、温度測定装置、熱処理装置および温度測定方法
JP2011109040A (ja) * 2009-11-20 2011-06-02 Nikon Corp 半導体基板ホルダ及び温度検出装置

Similar Documents

Publication Publication Date Title
JP2014092428A5 (https=)
WO2013042027A3 (en) Thermal plate with planar thermal zones for semiconductor processing
JP2013524236A5 (https=)
WO2009111357A3 (en) Multilayer heat tracing insulation device and method
WO2010112386A3 (de) Vorrichtung zur thermischen anbindung eines energiespeichers
EP2511793A3 (en) Temperature feedback motion controller
EP2584603A4 (en) HEAT TRANSFER FOIL, MANUFACTURING METHOD FOR THE HEAT TRANSFER FILM AND HEAT RADIATOR
EP3409728A4 (en) HEAT-RELATED FOIL, METHOD FOR PRODUCING A HEAT-RELATED FOIL, HEAT DISTRIBUTION ELEMENT AND SEMICONDUCTOR ELEMENT
WO2008110922A3 (en) Device and method for temperature management of heating pad systems
WO2012103294A3 (en) Substrate support with heater and rapid temperature change
WO2010008433A3 (en) Stator coil with improved heat dissipation
JP2009003434A5 (https=)
JP2015014586A5 (https=)
JP2014143304A5 (https=)
WO2009099284A3 (en) Substrate supporting unit, substrate processing apparatus, and method of manufacturing substrate supporting unit
EP2628176A4 (en) RADIATION HEAT LIGHT BOARD, METHOD FOR THE PRODUCTION THEREOF, PACKAGE WITH A HEAT GENERATING DEVICE THEREFOR AND BACKGROUND LIGHTING
JP2012118055A5 (https=)
EP3723145A4 (en) INSULATING HEAT TRANSFER SUBSTRATE, THERMOELECTRIC CONVERSION MODULE AND METHOD FOR MANUFACTURING AN INSULATING HEAT TRANSFER SUBSTRATE
JP2011066090A5 (ja) 基板接合装置、基板接合方法およびデバイスの製造方法
EP3404708A4 (en) HEAT-RELATED FOIL, METHOD FOR PRODUCING THE HEAT-RELATED FOIL, HEAT DISTRIBUTION ELEMENT AND SEMICONDUCTOR ELEMENT
WO2013079728A3 (en) Phase change material pack
WO2013048016A3 (ko) 기판지지유닛 및 기판처리장치, 그리고 기판지지유닛을 제조하는 방법
KR101593833B1 (ko) 기판 히팅 유닛 및 이를 포함하는 다이 본딩 장치
EP3344020B1 (en) Electronic device
JP2012251964A5 (https=)