JP2011176197A5 - - Google Patents

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JP2011176197A5
JP2011176197A5 JP2010040111A JP2010040111A JP2011176197A5 JP 2011176197 A5 JP2011176197 A5 JP 2011176197A5 JP 2010040111 A JP2010040111 A JP 2010040111A JP 2010040111 A JP2010040111 A JP 2010040111A JP 2011176197 A5 JP2011176197 A5 JP 2011176197A5
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Japan
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semiconductor substrate
temperature
mounting
substrate
holding member
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JP2010040111A
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Japanese (ja)
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JP5387444B2 (ja
JP2011176197A (ja
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JP2010040111A 2010-02-25 2010-02-25 搬送装置および基板接合装置 Active JP5387444B2 (ja)

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Application Number Priority Date Filing Date Title
JP2010040111A JP5387444B2 (ja) 2010-02-25 2010-02-25 搬送装置および基板接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010040111A JP5387444B2 (ja) 2010-02-25 2010-02-25 搬送装置および基板接合装置

Publications (3)

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JP2011176197A JP2011176197A (ja) 2011-09-08
JP2011176197A5 true JP2011176197A5 (https=) 2013-07-25
JP5387444B2 JP5387444B2 (ja) 2014-01-15

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JP2010040111A Active JP5387444B2 (ja) 2010-02-25 2010-02-25 搬送装置および基板接合装置

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9442482B2 (en) 2013-04-29 2016-09-13 GlobalFoundries, Inc. System and method for monitoring wafer handling and a wafer handling machine
JP2020017645A (ja) 2018-07-26 2020-01-30 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置
JP7175151B2 (ja) * 2018-09-28 2022-11-18 東京エレクトロン株式会社 搬送方法
WO2020184231A1 (ja) * 2019-03-14 2020-09-17 東京エレクトロン株式会社 接合システム、および接合方法
WO2022196063A1 (ja) * 2021-03-15 2022-09-22 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
JPWO2023139937A1 (https=) * 2022-01-19 2023-07-27
CN116031195A (zh) * 2023-01-31 2023-04-28 北京北方华创微电子装备有限公司 传输装置、半导体工艺设备及晶圆传输方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288506A (ja) * 2007-05-21 2008-11-27 Nikon Corp 調整方法、露光装置、及びデバイス製造方法
JP2009182235A (ja) * 2008-01-31 2009-08-13 Tokyo Electron Ltd ロードロック装置および基板冷却方法

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