JPWO2023139937A1 - - Google Patents
Info
- Publication number
- JPWO2023139937A1 JPWO2023139937A1 JP2023575104A JP2023575104A JPWO2023139937A1 JP WO2023139937 A1 JPWO2023139937 A1 JP WO2023139937A1 JP 2023575104 A JP2023575104 A JP 2023575104A JP 2023575104 A JP2023575104 A JP 2023575104A JP WO2023139937 A1 JPWO2023139937 A1 JP WO2023139937A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0054—Cooling means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
- H10P72/0454—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3311—Horizontal transfer of a batch of workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022006599 | 2022-01-19 | ||
| PCT/JP2022/044243 WO2023139937A1 (ja) | 2022-01-19 | 2022-11-30 | 基板搬送システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023139937A1 true JPWO2023139937A1 (https=) | 2023-07-27 |
| JPWO2023139937A5 JPWO2023139937A5 (https=) | 2025-10-01 |
Family
ID=87348067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023575104A Pending JPWO2023139937A1 (https=) | 2022-01-19 | 2022-11-30 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240222185A1 (https=) |
| JP (1) | JPWO2023139937A1 (https=) |
| KR (1) | KR20240137011A (https=) |
| CN (1) | CN118541786A (https=) |
| TW (1) | TW202343643A (https=) |
| WO (1) | WO2023139937A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230335423A1 (en) * | 2022-04-18 | 2023-10-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multi-chamber semiconductor processing system with transfer robot temperature adjustment |
| WO2024037704A1 (en) * | 2022-08-15 | 2024-02-22 | Abb Schweiz Ag | Hermetically closed industrial robot comprising a gas conducting structure |
| US12343865B1 (en) * | 2022-08-18 | 2025-07-01 | Amazon Technologies, Inc. | Active cooling system and method for robot manipulators |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04186860A (ja) * | 1990-11-21 | 1992-07-03 | Hitachi Ltd | 搬送機構 |
| JP3645492B2 (ja) * | 2000-02-01 | 2005-05-11 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP4617278B2 (ja) * | 2006-06-29 | 2011-01-19 | 日本電産サンキョー株式会社 | 産業用ロボット |
| US8430620B1 (en) * | 2008-03-24 | 2013-04-30 | Novellus Systems, Inc. | Dedicated hot and cold end effectors for improved throughput |
| JP5387444B2 (ja) * | 2010-02-25 | 2014-01-15 | 株式会社ニコン | 搬送装置および基板接合装置 |
| JP5454286B2 (ja) * | 2010-03-26 | 2014-03-26 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5614417B2 (ja) * | 2012-01-05 | 2014-10-29 | 株式会社安川電機 | 搬送システム |
| KR102236151B1 (ko) * | 2013-09-13 | 2021-04-05 | 니혼 덴산 산쿄 가부시키가이샤 | 산업용 로봇 |
| JP6837274B2 (ja) * | 2015-06-30 | 2021-03-03 | 東京エレクトロン株式会社 | 半導体製造装置及び基板搬送方法 |
| CN111095517B (zh) * | 2018-03-01 | 2024-07-09 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法和存储介质 |
| JP2020017645A (ja) * | 2018-07-26 | 2020-01-30 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 基板処理装置 |
| CN112740393B (zh) * | 2018-09-27 | 2024-06-14 | 株式会社国际电气 | 衬底处理装置、半导体器件的制造方法以及记录介质 |
| JP7458156B2 (ja) * | 2019-08-22 | 2024-03-29 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
| JP2021048242A (ja) | 2019-09-18 | 2021-03-25 | 東京エレクトロン株式会社 | 搬送装置及び搬送方法 |
-
2022
- 2022-11-30 WO PCT/JP2022/044243 patent/WO2023139937A1/ja not_active Ceased
- 2022-11-30 JP JP2023575104A patent/JPWO2023139937A1/ja active Pending
- 2022-11-30 KR KR1020247026742A patent/KR20240137011A/ko active Pending
- 2022-11-30 CN CN202280088398.1A patent/CN118541786A/zh active Pending
-
2023
- 2023-01-07 TW TW112100714A patent/TW202343643A/zh unknown
-
2024
- 2024-03-15 US US18/605,892 patent/US20240222185A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240137011A (ko) | 2024-09-19 |
| WO2023139937A1 (ja) | 2023-07-27 |
| CN118541786A (zh) | 2024-08-23 |
| TW202343643A (zh) | 2023-11-01 |
| US20240222185A1 (en) | 2024-07-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250219 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250922 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20260421 |