JP5819026B1 - 接続構造体の製造方法 - Google Patents
接続構造体の製造方法 Download PDFInfo
- Publication number
- JP5819026B1 JP5819026B1 JP2015512417A JP2015512417A JP5819026B1 JP 5819026 B1 JP5819026 B1 JP 5819026B1 JP 2015512417 A JP2015512417 A JP 2015512417A JP 2015512417 A JP2015512417 A JP 2015512417A JP 5819026 B1 JP5819026 B1 JP 5819026B1
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connection
- target member
- conductive paste
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Manufacturing Of Electric Cables (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015512417A JP5819026B1 (ja) | 2014-02-24 | 2015-02-17 | 接続構造体の製造方法 |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014033213 | 2014-02-24 | ||
JP2014033213 | 2014-02-24 | ||
JP2014047147 | 2014-03-11 | ||
JP2014047147 | 2014-03-11 | ||
PCT/JP2015/054299 WO2015125779A1 (ja) | 2014-02-24 | 2015-02-17 | 接続構造体の製造方法 |
JP2015512417A JP5819026B1 (ja) | 2014-02-24 | 2015-02-17 | 接続構造体の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015189610A Division JP2015233162A (ja) | 2014-02-24 | 2015-09-28 | 接続構造体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5819026B1 true JP5819026B1 (ja) | 2015-11-18 |
JPWO2015125779A1 JPWO2015125779A1 (ja) | 2017-03-30 |
Family
ID=53878281
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015512417A Active JP5819026B1 (ja) | 2014-02-24 | 2015-02-17 | 接続構造体の製造方法 |
JP2015189610A Pending JP2015233162A (ja) | 2014-02-24 | 2015-09-28 | 接続構造体の製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015189610A Pending JP2015233162A (ja) | 2014-02-24 | 2015-09-28 | 接続構造体の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP5819026B1 (ko) |
KR (1) | KR102360487B1 (ko) |
CN (1) | CN105493207B (ko) |
TW (1) | TWI647709B (ko) |
WO (1) | WO2015125779A1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105086902B (zh) * | 2015-09-01 | 2017-10-03 | 烟台德邦科技有限公司 | 一种非流动环氧底部填充材料及其制备方法 |
JP7011892B2 (ja) * | 2015-11-17 | 2022-02-10 | 積水化学工業株式会社 | はんだ接合材料及び接続構造体の製造方法 |
JP6752669B2 (ja) * | 2016-09-28 | 2020-09-09 | エルジー ディスプレイ カンパニー リミテッド | 電子部品の実装方法、電子部品の接合構造、基板装置、ディスプレイ装置、ディスプレイシステム |
JP7271312B2 (ja) * | 2018-05-30 | 2023-05-11 | 積水化学工業株式会社 | 導電材料、接続構造体及び接続構造体の製造方法 |
JP2020045463A (ja) * | 2018-09-21 | 2020-03-26 | 株式会社タムラ製作所 | 異方導電性接着剤およびそれを用いた電子基板の製造方法 |
JP7220558B2 (ja) | 2018-12-26 | 2023-02-10 | エルジー ディスプレイ カンパニー リミテッド | 表示装置及び表示装置の製造方法 |
KR20230110912A (ko) | 2022-01-17 | 2023-07-25 | 주식회사 에스켐 | 유기 발광 재료용 나프토 싸이오펜계 화합물의 제조 방법 |
WO2023189611A1 (ja) * | 2022-03-29 | 2023-10-05 | 日東電工株式会社 | 接続構造体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007280999A (ja) * | 2006-04-03 | 2007-10-25 | Matsushita Electric Ind Co Ltd | 部品接合方法ならびに部品接合構造 |
WO2011115105A1 (ja) * | 2010-03-17 | 2011-09-22 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体 |
JP2012216770A (ja) * | 2011-03-30 | 2012-11-08 | Tamura Seisakusho Co Ltd | 異方性導電性ペーストおよびそれを用いた電子部品の接続方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2403601A (en) * | 1999-12-27 | 2001-07-09 | Sumitomo Bakelite Company Limited | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
CN100442468C (zh) * | 2004-09-15 | 2008-12-10 | 松下电器产业株式会社 | 倒装片安装方法 |
EP1830399A4 (en) * | 2004-12-17 | 2012-07-11 | Panasonic Corp | RESIN COMPOSITION FOR FLIP CHIP CAPSULATION AND RESIN COMPOSITION FOR FORMING A BULB |
KR101084777B1 (ko) * | 2005-02-03 | 2011-11-21 | 파나소닉 주식회사 | 플립 칩 실장체와 그 실장 방법 및 범프 형성 방법 |
JPWO2008023452A1 (ja) | 2006-08-25 | 2010-01-07 | 住友ベークライト株式会社 | 接着テープ、接合体および半導体パッケージ |
JP4432949B2 (ja) * | 2006-09-15 | 2010-03-17 | パナソニック株式会社 | 電気部品の接続方法 |
CN102559072B (zh) * | 2007-08-08 | 2016-04-20 | 日立化成株式会社 | 粘接剂组合物、膜状粘接剂和电路部件的连接结构 |
JP2010272514A (ja) * | 2009-04-20 | 2010-12-02 | Idemitsu Kosan Co Ltd | 導電性酸化物微粒子分散組成物、導電性塗料組成物、及び導電性膜 |
US8070043B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
JP5741188B2 (ja) * | 2011-04-27 | 2015-07-01 | デクセリアルズ株式会社 | 接続構造体の製造方法 |
WO2012173059A1 (ja) * | 2011-06-13 | 2012-12-20 | 千住金属工業株式会社 | ソルダペースト |
-
2015
- 2015-02-17 CN CN201580001667.6A patent/CN105493207B/zh active Active
- 2015-02-17 JP JP2015512417A patent/JP5819026B1/ja active Active
- 2015-02-17 KR KR1020167004486A patent/KR102360487B1/ko active IP Right Grant
- 2015-02-17 WO PCT/JP2015/054299 patent/WO2015125779A1/ja active Application Filing
- 2015-02-24 TW TW104105916A patent/TWI647709B/zh active
- 2015-09-28 JP JP2015189610A patent/JP2015233162A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007280999A (ja) * | 2006-04-03 | 2007-10-25 | Matsushita Electric Ind Co Ltd | 部品接合方法ならびに部品接合構造 |
WO2011115105A1 (ja) * | 2010-03-17 | 2011-09-22 | 積水化学工業株式会社 | 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体 |
JP2012216770A (ja) * | 2011-03-30 | 2012-11-08 | Tamura Seisakusho Co Ltd | 異方性導電性ペーストおよびそれを用いた電子部品の接続方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105493207B (zh) | 2018-05-25 |
TWI647709B (zh) | 2019-01-11 |
CN105493207A (zh) | 2016-04-13 |
JP2015233162A (ja) | 2015-12-24 |
TW201535418A (zh) | 2015-09-16 |
KR20160125343A (ko) | 2016-10-31 |
KR102360487B1 (ko) | 2022-02-10 |
WO2015125779A1 (ja) | 2015-08-27 |
JPWO2015125779A1 (ja) | 2017-03-30 |
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