JP5816327B2 - 導電性ペースト - Google Patents

導電性ペースト Download PDF

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Publication number
JP5816327B2
JP5816327B2 JP2014091902A JP2014091902A JP5816327B2 JP 5816327 B2 JP5816327 B2 JP 5816327B2 JP 2014091902 A JP2014091902 A JP 2014091902A JP 2014091902 A JP2014091902 A JP 2014091902A JP 5816327 B2 JP5816327 B2 JP 5816327B2
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JP
Japan
Prior art keywords
epoxy resin
conductive paste
treated
metal powder
fatty acid
Prior art date
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JP2014091902A
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English (en)
Japanese (ja)
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JP2014220238A (ja
JP2014220238A5 (enExample
Inventor
展立 薛
展立 薛
中斌 李
中斌 李
竹芸 鄭
竹芸 鄭
Original Assignee
奇美實業股▲分▼有限公司
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Publication of JP2014220238A publication Critical patent/JP2014220238A/ja
Publication of JP2014220238A5 publication Critical patent/JP2014220238A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
JP2014091902A 2013-05-06 2014-04-25 導電性ペースト Active JP5816327B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW102116108 2013-05-06
TW102116108 2013-05-06
TW102138743A TWI500737B (zh) 2013-05-06 2013-10-25 導電性接著劑
TW102138743 2013-10-25

Publications (3)

Publication Number Publication Date
JP2014220238A JP2014220238A (ja) 2014-11-20
JP2014220238A5 JP2014220238A5 (enExample) 2015-08-06
JP5816327B2 true JP5816327B2 (ja) 2015-11-18

Family

ID=51840973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014091902A Active JP5816327B2 (ja) 2013-05-06 2014-04-25 導電性ペースト

Country Status (4)

Country Link
US (1) US9076572B2 (enExample)
JP (1) JP5816327B2 (enExample)
CN (1) CN104140781B (enExample)
TW (1) TWI500737B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106232745B (zh) * 2014-09-30 2018-05-11 拓自达电线株式会社 用于屏蔽电子部件的封装体的导电性涂料及使用其的屏蔽封装体的制造方法
CN107250292B (zh) * 2015-02-19 2020-09-22 株式会社大赛璐 银粒子涂料组合物
KR101764221B1 (ko) * 2015-10-08 2017-08-03 엘에스니꼬동제련 주식회사 레이저 식각용 전도성 페이스트 조성물
JP2017143163A (ja) * 2016-02-09 2017-08-17 Koa株式会社 抵抗ペースト組成物およびそれを用いた厚膜チップ抵抗器
JP6639951B2 (ja) * 2016-02-25 2020-02-05 京都エレックス株式会社 加熱硬化型導電性ペースト組成物およびその硬化物
TWI704196B (zh) 2016-03-29 2020-09-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI770013B (zh) * 2016-03-29 2022-07-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI722136B (zh) * 2016-03-29 2021-03-21 拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
CN109563238B (zh) * 2016-08-10 2021-08-27 三键有限公司 环氧树脂组合物以及含有其的导电性胶粘剂
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材
EP3333230A1 (en) * 2016-12-08 2018-06-13 Henkel AG & Co. KGaA A composition suitable for application with laser induced forward transfer (lift)
KR102428873B1 (ko) * 2017-10-13 2022-08-02 타츠타 전선 주식회사 차폐 패키지
EP3808826A4 (en) * 2018-06-12 2022-03-16 DIC Corporation HIGHLY ELECTRICALLY CONDUCTIVE SILVER INK COMPOSITION AND WIRING MADE WITH IT
JP7332129B2 (ja) * 2019-02-27 2023-08-23 ナミックス株式会社 導電性組成物および導電性接着剤
TWI813872B (zh) 2019-07-25 2023-09-01 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法、以及具有屏蔽層之樹脂成形品之製造方法
CN112543548B (zh) * 2019-09-23 2022-05-10 臻鼎科技股份有限公司 导电组合物及应用该导电组合物的导电层及电路板
TWI706856B (zh) * 2019-09-23 2020-10-11 臻鼎科技股份有限公司 導電組合物及應用該導電組合物的導電層及電路板
JP7021389B1 (ja) 2021-10-08 2022-02-16 京都エレックス株式会社 熱硬化型導電性ペースト組成物および太陽電池セル、並びに太陽電池モジュール
KR102726120B1 (ko) * 2023-05-09 2024-11-06 주식회사 희망나누기 납땜 접합부 특성 향상을 위한 솔더 페이스트

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006013793A1 (ja) * 2004-08-03 2006-02-09 Hitachi Chemical Company, Ltd. 導電ペーストおよびそれを用いた電子部品搭載基板
JP5030196B2 (ja) * 2004-12-16 2012-09-19 住友電気工業株式会社 回路接続用接着剤
EP1947654B1 (en) * 2005-09-29 2013-07-10 Alpha Scientific, Corporation Conductive powder and process for producing the same, conductive powder paste, and process for producing the conductive powder paste
TW200804557A (en) * 2006-07-07 2008-01-16 Ablestik Japan Co Ltd Conductive adhesive agent
JP2010044967A (ja) * 2008-08-13 2010-02-25 Sumitomo Electric Ind Ltd 導電性接着剤およびそれを用いたｌｅｄ基板
JP6018733B2 (ja) * 2010-04-14 2016-11-02 Ｄｏｗａエレクトロニクス株式会社 熱硬化型導電性ペーストおよびその製造方法
WO2012102304A1 (ja) * 2011-01-26 2012-08-02 ナミックス株式会社 導電性ペースト及びその製造方法
PH12013501783A1 (en) * 2011-03-01 2013-10-14 Namics Corp Conductive composition

Also Published As

Publication number Publication date
TW201502236A (zh) 2015-01-16
TWI500737B (zh) 2015-09-21
JP2014220238A (ja) 2014-11-20
US20140326929A1 (en) 2014-11-06
CN104140781A (zh) 2014-11-12
US9076572B2 (en) 2015-07-07
CN104140781B (zh) 2016-05-25

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