JP5816327B2 - 導電性ペースト - Google Patents

導電性ペースト Download PDF

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Publication number
JP5816327B2
JP5816327B2 JP2014091902A JP2014091902A JP5816327B2 JP 5816327 B2 JP5816327 B2 JP 5816327B2 JP 2014091902 A JP2014091902 A JP 2014091902A JP 2014091902 A JP2014091902 A JP 2014091902A JP 5816327 B2 JP5816327 B2 JP 5816327B2
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Japan
Prior art keywords
epoxy resin
conductive paste
treated
metal powder
fatty acid
Prior art date
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JP2014091902A
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English (en)
Japanese (ja)
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JP2014220238A (ja
JP2014220238A5 (enExample
Inventor
展立 薛
展立 薛
中斌 李
中斌 李
竹芸 鄭
竹芸 鄭
Original Assignee
奇美實業股▲分▼有限公司
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Publication of JP2014220238A publication Critical patent/JP2014220238A/ja
Publication of JP2014220238A5 publication Critical patent/JP2014220238A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2014091902A 2013-05-06 2014-04-25 導電性ペースト Active JP5816327B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW102116108 2013-05-06
TW102116108 2013-05-06
TW102138743A TWI500737B (zh) 2013-05-06 2013-10-25 導電性接著劑
TW102138743 2013-10-25

Publications (3)

Publication Number Publication Date
JP2014220238A JP2014220238A (ja) 2014-11-20
JP2014220238A5 JP2014220238A5 (enExample) 2015-08-06
JP5816327B2 true JP5816327B2 (ja) 2015-11-18

Family

ID=51840973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014091902A Active JP5816327B2 (ja) 2013-05-06 2014-04-25 導電性ペースト

Country Status (4)

Country Link
US (1) US9076572B2 (enExample)
JP (1) JP5816327B2 (enExample)
CN (1) CN104140781B (enExample)
TW (1) TWI500737B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5985785B1 (ja) * 2014-09-30 2016-09-06 タツタ電線株式会社 電子部品のパッケージのシールド用導電性塗料及びそれを用いたシールドパッケージの製造方法
CN107250292B (zh) * 2015-02-19 2020-09-22 株式会社大赛璐 银粒子涂料组合物
KR101764221B1 (ko) * 2015-10-08 2017-08-03 엘에스니꼬동제련 주식회사 레이저 식각용 전도성 페이스트 조성물
JP2017143163A (ja) * 2016-02-09 2017-08-17 Koa株式会社 抵抗ペースト組成物およびそれを用いた厚膜チップ抵抗器
JP6639951B2 (ja) * 2016-02-25 2020-02-05 京都エレックス株式会社 加熱硬化型導電性ペースト組成物およびその硬化物
TWI722136B (zh) * 2016-03-29 2021-03-21 拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI704196B (zh) * 2016-03-29 2020-09-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
TWI770013B (zh) * 2016-03-29 2022-07-11 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法
CN109563238B (zh) * 2016-08-10 2021-08-27 三键有限公司 环氧树脂组合物以及含有其的导电性胶粘剂
JP2018035286A (ja) * 2016-09-01 2018-03-08 パナソニックＩｐマネジメント株式会社 導電性樹脂組成物及びそれを用いた電子回路部材
EP3333230A1 (en) * 2016-12-08 2018-06-13 Henkel AG & Co. KGaA A composition suitable for application with laser induced forward transfer (lift)
WO2019073809A1 (ja) * 2017-10-13 2019-04-18 タツタ電線株式会社 シールドパッケージ
CN112236490B (zh) * 2018-06-12 2022-10-28 Dic株式会社 高导电性银油墨组合物和使用其的配线
JP7332129B2 (ja) * 2019-02-27 2023-08-23 ナミックス株式会社 導電性組成物および導電性接着剤
TWI813872B (zh) 2019-07-25 2023-09-01 日商拓自達電線股份有限公司 導電性塗料及使用其之屏蔽封裝體之製造方法、以及具有屏蔽層之樹脂成形品之製造方法
TWI706856B (zh) * 2019-09-23 2020-10-11 臻鼎科技股份有限公司 導電組合物及應用該導電組合物的導電層及電路板
CN112543548B (zh) * 2019-09-23 2022-05-10 臻鼎科技股份有限公司 导电组合物及应用该导电组合物的导电层及电路板
JP7021389B1 (ja) 2021-10-08 2022-02-16 京都エレックス株式会社 熱硬化型導電性ペースト組成物および太陽電池セル、並びに太陽電池モジュール
KR102726120B1 (ko) * 2023-05-09 2024-11-06 주식회사 희망나누기 납땜 접합부 특성 향상을 위한 솔더 페이스트

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080261049A1 (en) * 2004-08-03 2008-10-23 Hiroki Hayashi Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts
JP5030196B2 (ja) * 2004-12-16 2012-09-19 住友電気工業株式会社 回路接続用接着剤
US9011726B2 (en) * 2005-09-29 2015-04-21 Alpha Scientific, Corporation Electrically conductive powder and production thereof, paste of electrically conductive powder and production of paste of electrically conductive powder
TW200804557A (en) * 2006-07-07 2008-01-16 Ablestik Japan Co Ltd Conductive adhesive agent
JP2010044967A (ja) * 2008-08-13 2010-02-25 Sumitomo Electric Ind Ltd 導電性接着剤およびそれを用いたｌｅｄ基板
JP6018733B2 (ja) * 2010-04-14 2016-11-02 Ｄｏｗａエレクトロニクス株式会社 熱硬化型導電性ペーストおよびその製造方法
JP5916633B2 (ja) * 2011-01-26 2016-05-11 ナミックス株式会社 導電性ペースト及び導電膜の製造方法
PH12013501783A1 (en) * 2011-03-01 2013-10-14 Namics Corp Conductive composition

Also Published As

Publication number Publication date
US20140326929A1 (en) 2014-11-06
US9076572B2 (en) 2015-07-07
CN104140781A (zh) 2014-11-12
TWI500737B (zh) 2015-09-21
TW201502236A (zh) 2015-01-16
JP2014220238A (ja) 2014-11-20
CN104140781B (zh) 2016-05-25

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