JP5806640B2 - プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法 - Google Patents

プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法 Download PDF

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Publication number
JP5806640B2
JP5806640B2 JP2012110924A JP2012110924A JP5806640B2 JP 5806640 B2 JP5806640 B2 JP 5806640B2 JP 2012110924 A JP2012110924 A JP 2012110924A JP 2012110924 A JP2012110924 A JP 2012110924A JP 5806640 B2 JP5806640 B2 JP 5806640B2
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JP
Japan
Prior art keywords
printed wiring
wiring board
piezoelectric element
electrode pair
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012110924A
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English (en)
Japanese (ja)
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JP2013033929A (ja
JP2013033929A5 (https=
Inventor
長崎　修
修 長崎
将道 飯田
将道 飯田
宏 真野
宏 真野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012110924A priority Critical patent/JP5806640B2/ja
Priority to EP12171430.7A priority patent/EP2542040B1/en
Priority to EP15153412.0A priority patent/EP2900042B1/en
Priority to US13/525,168 priority patent/US9918393B2/en
Priority to KR1020120066595A priority patent/KR101527631B1/ko
Priority to CN201610132812.0A priority patent/CN105555022B/zh
Priority to CN201210214787.2A priority patent/CN102858089B/zh
Publication of JP2013033929A publication Critical patent/JP2013033929A/ja
Publication of JP2013033929A5 publication Critical patent/JP2013033929A5/ja
Application granted granted Critical
Publication of JP5806640B2 publication Critical patent/JP5806640B2/ja
Priority to US15/886,465 priority patent/US10412839B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00—Apparatus for electrographic processes using a charge pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dc-Dc Converters (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Control Or Security For Electrophotography (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
JP2012110924A 2011-06-29 2012-05-14 プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法 Active JP5806640B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2012110924A JP5806640B2 (ja) 2011-06-29 2012-05-14 プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法
EP12171430.7A EP2542040B1 (en) 2011-06-29 2012-06-11 Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method
EP15153412.0A EP2900042B1 (en) 2011-06-29 2012-06-11 Printed circuit board, power supply apparatus, and image forming apparatus
US13/525,168 US9918393B2 (en) 2011-06-29 2012-06-15 Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method
KR1020120066595A KR101527631B1 (ko) 2011-06-29 2012-06-21 인쇄 회로 기판, 전원 장치, 화상 형성 장치 및 인쇄 회로 기판의 제조 방법
CN201610132812.0A CN105555022B (zh) 2011-06-29 2012-06-26 印刷电路板、电源装置、成像装置和印刷电路板制造方法
CN201210214787.2A CN102858089B (zh) 2011-06-29 2012-06-26 印刷电路板、电源装置、成像装置和印刷电路板制造方法
US15/886,465 US10412839B2 (en) 2011-06-29 2018-02-01 Printed circuit board, power supply apparatus, image forming apparatus, and printed circuit board manufacturing method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011144549 2011-06-29
JP2011144549 2011-06-29
JP2012110924A JP5806640B2 (ja) 2011-06-29 2012-05-14 プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015174986A Division JP6018677B2 (ja) 2011-06-29 2015-09-04 プリント配線基板、電源装置および画像形成装置

Publications (3)

Publication Number Publication Date
JP2013033929A JP2013033929A (ja) 2013-02-14
JP2013033929A5 JP2013033929A5 (https=) 2015-08-13
JP5806640B2 true JP5806640B2 (ja) 2015-11-10

Family

ID=46456341

Family Applications (1)

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JP2012110924A Active JP5806640B2 (ja) 2011-06-29 2012-05-14 プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法

Country Status (5)

Country Link
US (2) US9918393B2 (https=)
EP (2) EP2900042B1 (https=)
JP (1) JP5806640B2 (https=)
KR (1) KR101527631B1 (https=)
CN (2) CN102858089B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6057591B2 (ja) * 2012-08-03 2017-01-11 キヤノン株式会社 画像形成装置用の高圧電源
JP6143499B2 (ja) 2013-03-08 2017-06-07 キヤノン株式会社 電源装置及び画像形成装置
US9450493B2 (en) 2013-09-04 2016-09-20 Canon Kabushiki Kaisha Voltage generating apparatus for stably controlling voltage
DE102014007240A1 (de) 2014-05-16 2015-11-19 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kornmutatormaschine
DE102014007244B4 (de) * 2014-05-16 2024-08-29 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kommutatormaschine
DE102014007242B4 (de) 2014-05-16 2024-02-22 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kommutatormaschine
CN106934083B (zh) * 2015-12-30 2020-07-21 小米科技有限责任公司 电路设计方法和装置
US10671009B2 (en) 2017-02-13 2020-06-02 Canon Kabushiki Kaisha Printed circuit board mounting piezoelectric transformer

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JP3142426B2 (ja) 1993-10-29 2001-03-07 株式会社八幡電機製作所 定電圧・定電流電源装置
EP0730312B1 (en) * 1995-02-28 2003-07-30 Nec Corporation Packaged piezoelectric transformer unit
JP3548309B2 (ja) 1996-01-09 2004-07-28 キヤノン株式会社 フォトセンサ
JP2885188B2 (ja) * 1996-06-19 1999-04-19 日本電気株式会社 圧電トランス
DE19627585A1 (de) * 1996-07-09 1998-01-15 Thomson Brandt Gmbh Hochspannungstransformator für einen Fernsehempfänger
JPH11252931A (ja) 1998-02-27 1999-09-17 Canon Inc 高圧電源装置
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
JP2000307166A (ja) 1999-04-21 2000-11-02 Tdk Corp 圧電トランスおよびそのための駆動安定化装置
JP2003033017A (ja) 2001-07-06 2003-01-31 Sharp Corp スイッチング電源装置
US7034652B2 (en) * 2001-07-10 2006-04-25 Littlefuse, Inc. Electrostatic discharge multifunction resistor
US7062212B2 (en) * 2003-04-17 2006-06-13 Ricoh Company, Ltd. Cleaning apparatus, image forming apparatus, and process cartridge
JP2004328948A (ja) 2003-04-28 2004-11-18 Noritz Corp スイッチング電源回路およびこれを備えたスイッチングレギュレータ
JP4332528B2 (ja) 2005-03-31 2009-09-16 キヤノン株式会社 電源装置、電源装置を有する画像形成装置
US7548708B2 (en) 2005-04-01 2009-06-16 Canon Kabushiki Kaisha Power supply unit in image forming apparatus
JP4420458B2 (ja) 2005-06-06 2010-02-24 キヤノン株式会社 高圧電源装置、画像形成装置
US7579749B2 (en) * 2005-07-08 2009-08-25 Canon Kabushiki Kaisha Power supply device and image forming apparatus using the power supply device
JP5352471B2 (ja) * 2007-11-28 2013-11-27 株式会社タムラ製作所 圧電トランス
JP5433148B2 (ja) 2007-11-28 2014-03-05 株式会社タムラ製作所 圧電トランスの実装方法及び圧電トランス
JP5622395B2 (ja) * 2007-12-05 2014-11-12 株式会社タムラ製作所 圧電トランス装置の製造方法及び圧電トランス装置
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JP5281478B2 (ja) * 2009-05-15 2013-09-04 キヤノン株式会社 電子装置、回路基板、高圧電源装置、および、電子部品と圧電素子とを回路基板に半田付けする方法
JP5864845B2 (ja) 2009-10-27 2016-02-17 キヤノン株式会社 高圧電源装置および画像形成装置

Also Published As

Publication number Publication date
JP2013033929A (ja) 2013-02-14
EP2542040A3 (en) 2013-07-10
EP2542040A2 (en) 2013-01-02
CN105555022A (zh) 2016-05-04
EP2542040B1 (en) 2015-02-25
CN105555022B (zh) 2020-07-28
EP2900042A1 (en) 2015-07-29
KR20130007445A (ko) 2013-01-18
US10412839B2 (en) 2019-09-10
KR101527631B1 (ko) 2015-06-09
CN102858089A (zh) 2013-01-02
EP2900042B1 (en) 2016-12-21
US20180160544A1 (en) 2018-06-07
US20130004196A1 (en) 2013-01-03
CN102858089B (zh) 2016-03-30
US9918393B2 (en) 2018-03-13

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