JP5806613B2 - 太陽電池を製造する方法および装置 - Google Patents
太陽電池を製造する方法および装置 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims description 138
- 239000003792 electrolyte Substances 0.000 claims description 30
- 239000004020 conductor Substances 0.000 claims description 27
- 238000009713 electroplating Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000012777 electrically insulating material Substances 0.000 claims description 5
- 239000008151 electrolyte solution Substances 0.000 description 19
- 238000009826 distribution Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229920001780 ECTFE Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D17/06—Suspending or supporting devices for articles to be coated
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- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Silicon Compounds (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
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Description
Claims (24)
- それぞれが少なくとも一面に導電性材料を備えるシリコン含有ガラス質基板を準備するステップと、
電解槽内に存在する電解液を通して各基板の少なくとも一部を連続的に搬送するステップと、
前記電解槽を通した基板の搬送中に前記導電性材料を陰極として機能するように接続し、搬送中に前記導電性材料上に前記電解液から材料を電着させるステップと、
を含み、
搬送中に前記基板がコンベヤー要素から懸架され、前記基板が搬送方向に延在し、
搬送方向と反対方向に傾斜するスロットである傾斜スロットが、前記電解槽の少なくとも一つの壁に設けられているか、または二つの相対する壁に設けられている
ことを特徴とする太陽電池の製造方法。 - 搬送中に前記基板が前記コンベヤー要素から自由に懸架されることを特徴とする請求項1に記載の方法。
- 前記導電性材料が少なくとも一つのトラックの形態で前記基板の少なくとも一面に付着することを特徴とする請求項1または2に記載の方法。
- 前記コンベヤー要素の一部を形成する少なくとも一つのクランプ要素によって、搬送中に前記基板がその上端で締め付けられることを特徴とする請求項3に記載の方法。
- 前記少なくとも一つのトラックが垂直方向に延び、前記少なくとも一つのクランプ要素が前記少なくとも一つのトラックの上端で前記基板と係合してこのトラックを陰極として接続することを特徴とする請求項4に記載の方法。
- 前記コンベヤー要素の一部を形成する二つのクランプ要素によって、搬送中に各基板がその上端で締め付けられることを特徴とする請求項4または5に記載の方法。
- 前記基板が前記少なくとも一つのクランプ要素によって保持された状態で搬送中に少なくとも一部が湾曲した経路に沿って移動することを特徴とする請求項4に記載の方法。
- 前記電解液の上方に位置する前記少なくとも一つのクランプ要素によって締め付けられる領域を前記基板が有していることを特徴とする請求項4に記載の方法。
- 電解液用の電解槽と、
前記電解液を通して搬送方向に基板を連続的に搬送する搬送手段と、
少なくとも一面に導電性材料が設けられた各基板と、
前記搬送の少なくとも一部の間にトラックを陰極として接続する接触手段と、
を備え、
前記搬送手段が、基板の上端をクランプ端部によって締め付けて基板を懸架するように設計されたクランプ要素と適合されたコンベヤー要素を備え、クランプ要素の少なくとも一部が前記接触手段と一体的であり、
搬送方向と反対方向に傾斜するスロットである傾斜スロットが、前記電解槽の少なくとも一つの壁に設けられているか、または二つの相対する壁に設けられている
ことを特徴とする太陽電池製造装置。 - 前記クランプ要素が前記基板を自由に懸架するように設計されることを特徴とする請求項9に記載の装置。
- 前記コンベヤー要素が連続的な水平トラックに沿って延びる導電性材料の柔軟なテープを備えることを特徴とする請求項9または10に記載の装置。
- 前記柔軟なテープに凹部が等間隔に設けられており、前記搬送手段が前記凹部と係合する歯を有する少なくとも一つの駆動ギヤをさらに備えることを特徴とする請求項11に記載の装置。
- 前記凹部が長方形であり、前記歯の水平断面が三角形状であることを特徴とする請求項12に記載の装置。
- 各クランプ要素が二つの部分を備え、二つの部分のそれぞれの最下端が前記クランプ端部を構成することを特徴とする請求項13に記載の装置。
- 前記二つの部分の一方が前記柔軟なテープと一体的であることを特徴とする請求項14に記載の装置。
- 前記二つの部分の一方が、前記柔軟なテープの下端から下方に延出するリップであることを特徴とする請求項15に記載の装置。
- 前記クランプ端部が前記柔軟なテープの下端の下方に延びることを特徴とする請求項11ないし16のいずれかに記載の装置。
- 前記二つの部分の一方が導電性材料で作られ、前記二つの部分の他方が電気絶縁材料で少なくとも部分的に作られることを特徴とする請求項14ないし16のいずれかに記載の装置。
- 前記二つの部分が自身のバネ力の影響で前記柔軟なテープにもたれかかることを特徴とする請求項14ないし16のいずれかに記載の装置。
- 前記電解槽を通る基板がたどる経路の相対する面に、内部に穴を有するパネルが設けられることを特徴とする請求項9ないし19のいずれかに記載の装置。
- 前記パネルの少なくとも一つと該少なくとも一つのパネルと平行に延びる前記電解槽の壁との間に陽極が設けられることを特徴とする請求項20に記載の装置。
- 前記電解槽の少なくとも一つの直立壁に、前記パネルの外側で電解液の排出端部を設けることを特徴とする請求項21に記載の装置。
- 電解液用の電解槽と、
前記電解液を通して搬送方向に基板を連続的に搬送する搬送手段であって、連続的な水平トラックに沿って延びる導電性材料の柔軟なテープと適合するコンベヤー要素と、基板の上端をクランプ端部を用いて締め付けて前記電解槽内の少なくとも一部で前記基板を懸架するように設計されたクランプ要素とを備える、搬送手段と、
を備え、
前記クランプ端部が前記柔軟なテープの下端の下方に延びており、
搬送方向と反対方向に傾斜するスロットである傾斜スロットが、前記電解槽の少なくとも一つの壁に設けられているか、または二つの相対する壁に設けられている
ことを特徴とする基板の電気めっき装置。 - 各クランプ要素が二つの部分を備え、該二つの部分のそれぞれの最下端が前記クランプ端部を構成し、該二つの部分の一方が導電性材料で作られ、該二つの部分の他方が少なくとも部分的に電気絶縁材料で作られることを特徴とする請求項23に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1035265A NL1035265C2 (nl) | 2008-04-07 | 2008-04-07 | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
NL1035265 | 2008-04-07 | ||
PCT/NL2009/000083 WO2009126021A2 (en) | 2008-04-07 | 2009-04-07 | Method and device for producing solar cells |
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Publication Number | Publication Date |
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JP2011516732A JP2011516732A (ja) | 2011-05-26 |
JP5806613B2 true JP5806613B2 (ja) | 2015-11-10 |
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JP2011503921A Active JP5806613B2 (ja) | 2008-04-07 | 2009-04-07 | 太陽電池を製造する方法および装置 |
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US (1) | US8871076B2 (ja) |
EP (1) | EP2262930B1 (ja) |
JP (1) | JP5806613B2 (ja) |
KR (1) | KR101696935B1 (ja) |
CN (1) | CN102057082B (ja) |
MY (1) | MY177402A (ja) |
NL (1) | NL1035265C2 (ja) |
TW (1) | TWI508312B (ja) |
WO (1) | WO2009126021A2 (ja) |
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CN103649379A (zh) * | 2011-07-07 | 2014-03-19 | 贝卡尔特公司 | 电解槽中的分布板 |
CN202297822U (zh) * | 2011-09-19 | 2012-07-04 | 亚洲电镀器材有限公司 | 用于电镀机的导板和具有该导板的电镀机 |
KR101422609B1 (ko) * | 2011-11-17 | 2014-07-24 | 한국생산기술연구원 | 텍스처 구조를 갖는 열팽창 제어형 플렉서블 금속 기판재 |
TW201330156A (zh) * | 2011-12-29 | 2013-07-16 | Ardenne Anlagentech Gmbh | 分批處理中基板處理裝置及方法 |
NL2011117C2 (nl) * | 2013-07-08 | 2015-01-12 | Meco Equip Eng | Transportorgaan voor het transporteren van in een bad elektrolytisch te galvaniseren plaat vormige substraten, en inrichting en werkwijze voor het elektrolytisch galvaniseren van dergelijke substraten. |
JP2016189358A (ja) * | 2013-08-30 | 2016-11-04 | 株式会社カネカ | 太陽電池の製造方法、めっき用治具、並びに、めっき装置 |
NL2015747B1 (nl) * | 2015-11-09 | 2017-05-26 | Meco Equipment Eng B V | Inrichting voor het galvaniseren van plaatvormige substraten. |
US11598018B2 (en) * | 2018-03-30 | 2023-03-07 | Sunpower Corporation | Dual wafer plating fixture for a continuous plating line |
EP3835461A1 (en) | 2019-12-13 | 2021-06-16 | CSEM Centre Suisse D'electronique Et De Microtechnique SA | Substrate carrier for metallic electroplating of substrates |
CN113400698B (zh) * | 2021-05-11 | 2022-12-20 | 重庆金美新材料科技有限公司 | 一种导电传动带及其制备方法、薄膜水电镀设备 |
NL2030054B1 (nl) | 2021-12-07 | 2023-06-22 | Meco Equipment Eng B V | Inrichting en werkwijze voor het elektrolytisch behandelen van substraten. |
CN115123781B (zh) * | 2022-06-30 | 2024-03-22 | 徐州德益智能装备制造有限公司 | 一种铝制吹胀均热板的自动送料系统 |
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Also Published As
Publication number | Publication date |
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KR20110008214A (ko) | 2011-01-26 |
WO2009126021A2 (en) | 2009-10-15 |
US8871076B2 (en) | 2014-10-28 |
CN102057082A (zh) | 2011-05-11 |
WO2009126021A3 (en) | 2009-11-26 |
MY177402A (en) | 2020-09-14 |
CN102057082B (zh) | 2016-04-27 |
NL1035265C2 (nl) | 2009-10-08 |
EP2262930B1 (en) | 2019-12-04 |
EP2262930A2 (en) | 2010-12-22 |
TWI508312B (zh) | 2015-11-11 |
TW201003937A (en) | 2010-01-16 |
JP2011516732A (ja) | 2011-05-26 |
US20110259751A1 (en) | 2011-10-27 |
KR101696935B1 (ko) | 2017-01-16 |
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