JP5794840B2 - 積層セラミック電子部品 - Google Patents

積層セラミック電子部品 Download PDF

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Publication number
JP5794840B2
JP5794840B2 JP2011143739A JP2011143739A JP5794840B2 JP 5794840 B2 JP5794840 B2 JP 5794840B2 JP 2011143739 A JP2011143739 A JP 2011143739A JP 2011143739 A JP2011143739 A JP 2011143739A JP 5794840 B2 JP5794840 B2 JP 5794840B2
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external electrode
thickness
concave portion
face
ceramic body
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JP2011143739A
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English (en)
Japanese (ja)
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JP2013012561A5 (enExample
JP2013012561A (ja
Inventor
智彰 中村
智彰 中村
幹夫 田原
幹夫 田原
貴久 福田
貴久 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
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Taiyo Yuden Co Ltd
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Priority to JP2011143739A priority Critical patent/JP5794840B2/ja
Publication of JP2013012561A publication Critical patent/JP2013012561A/ja
Publication of JP2013012561A5 publication Critical patent/JP2013012561A5/ja
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Publication of JP5794840B2 publication Critical patent/JP5794840B2/ja
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  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2011143739A 2011-06-29 2011-06-29 積層セラミック電子部品 Active JP5794840B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011143739A JP5794840B2 (ja) 2011-06-29 2011-06-29 積層セラミック電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011143739A JP5794840B2 (ja) 2011-06-29 2011-06-29 積層セラミック電子部品

Publications (3)

Publication Number Publication Date
JP2013012561A JP2013012561A (ja) 2013-01-17
JP2013012561A5 JP2013012561A5 (enExample) 2014-06-05
JP5794840B2 true JP5794840B2 (ja) 2015-10-14

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Family Applications (1)

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JP2011143739A Active JP5794840B2 (ja) 2011-06-29 2011-06-29 積層セラミック電子部品

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JP (1) JP5794840B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6330484B2 (ja) * 2013-07-10 2018-05-30 株式会社村田製作所 セラミック電子部品
JP6910773B2 (ja) * 2016-09-16 2021-07-28 Tdk株式会社 電子部品
JP7052259B2 (ja) * 2017-08-31 2022-04-12 Tdk株式会社 電子部品
JP7562249B2 (ja) 2019-11-18 2024-10-07 太陽誘電株式会社 セラミック電子部品およびその製造方法
JP2021174856A (ja) * 2020-04-24 2021-11-01 太陽誘電株式会社 積層セラミック電子部品、回路基板及び積層セラミック電子部品の製造方法
JP7683815B2 (ja) * 2022-03-28 2025-05-27 株式会社村田製作所 電子部品およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4096661B2 (ja) * 2002-08-22 2008-06-04 株式会社村田製作所 セラミック電子部品、およびセラミック電子部品の製造方法
JP2006278162A (ja) * 2005-03-29 2006-10-12 Kyocera Corp 導体ペースト及びそれを用いた電子部品
JP4299292B2 (ja) * 2005-11-08 2009-07-22 Ｔｄｋ株式会社 電子部品
JP4653647B2 (ja) * 2005-11-28 2011-03-16 積水化学工業株式会社 セラミックコンデンサ、セラミックコンデンサの製造方法及びセラミックグリーンシート
JP2009239204A (ja) * 2008-03-28 2009-10-15 Tdk Corp 電子部品の製造方法
JP5217584B2 (ja) * 2008-04-07 2013-06-19 株式会社村田製作所 積層セラミック電子部品
JP5136389B2 (ja) * 2008-12-19 2013-02-06 Ｔｄｋ株式会社 電子部品の製造方法

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JP2013012561A (ja) 2013-01-17

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