JP5762078B2 - リードフレーム - Google Patents

リードフレーム Download PDF

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Publication number
JP5762078B2
JP5762078B2 JP2011070379A JP2011070379A JP5762078B2 JP 5762078 B2 JP5762078 B2 JP 5762078B2 JP 2011070379 A JP2011070379 A JP 2011070379A JP 2011070379 A JP2011070379 A JP 2011070379A JP 5762078 B2 JP5762078 B2 JP 5762078B2
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JP
Japan
Prior art keywords
lead frame
section bar
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section
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Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011070379A
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English (en)
Japanese (ja)
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JP2012204774A (ja
JP2012204774A5 (enExample
Inventor
直樹 山辺
直樹 山辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011070379A priority Critical patent/JP5762078B2/ja
Priority to US13/418,770 priority patent/US8558358B2/en
Priority to TW101110139A priority patent/TWI590402B/zh
Publication of JP2012204774A publication Critical patent/JP2012204774A/ja
Publication of JP2012204774A5 publication Critical patent/JP2012204774A5/ja
Application granted granted Critical
Publication of JP5762078B2 publication Critical patent/JP5762078B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49565—Side rails of the lead frame, e.g. with perforations, sprocket holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2011070379A 2011-03-28 2011-03-28 リードフレーム Active JP5762078B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011070379A JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム
US13/418,770 US8558358B2 (en) 2011-03-28 2012-03-13 Lead frame
TW101110139A TWI590402B (zh) 2011-03-28 2012-03-23 導線架

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011070379A JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム

Publications (3)

Publication Number Publication Date
JP2012204774A JP2012204774A (ja) 2012-10-22
JP2012204774A5 JP2012204774A5 (enExample) 2014-01-30
JP5762078B2 true JP5762078B2 (ja) 2015-08-12

Family

ID=46926105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011070379A Active JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム

Country Status (3)

Country Link
US (1) US8558358B2 (enExample)
JP (1) JP5762078B2 (enExample)
TW (1) TWI590402B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
CN103066047B (zh) * 2012-12-28 2016-09-07 日月光封装测试(上海)有限公司 半导体封装用导线架条及封装方法
JP6146732B2 (ja) * 2013-01-18 2017-06-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
CN106415831B (zh) * 2014-05-09 2020-04-28 三菱电机株式会社 半导体模块
DE102015100025A1 (de) 2015-01-05 2016-07-07 Osram Opto Semiconductors Gmbh Leiterrahmen
JP1537979S (enExample) * 2015-04-20 2015-11-16
JP1537980S (enExample) * 2015-04-20 2015-11-16
JP2017005005A (ja) * 2015-06-05 2017-01-05 Ｓｈマテリアル株式会社 リードフレームの製造方法、およびリードフレーム
US9741643B2 (en) * 2016-01-22 2017-08-22 Texas Instruments Incorporated Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
JP6772087B2 (ja) * 2017-02-17 2020-10-21 新光電気工業株式会社 リードフレーム及びその製造方法
US11908705B2 (en) * 2021-10-18 2024-02-20 Texas Instruments Incorporated Interconnect singulation

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation
JPH0498858A (ja) * 1990-08-16 1992-03-31 Nec Kyushu Ltd 半導体装置用リードフレーム
JPH04180665A (ja) * 1990-11-15 1992-06-26 Nec Kyushu Ltd 半導体装置用リードフレーム
JPH04337659A (ja) * 1991-05-15 1992-11-25 Mitsubishi Electric Corp リードフレーム
JPH05326800A (ja) 1992-05-25 1993-12-10 Hitachi Ltd リードフレーム
JPH06252319A (ja) 1993-02-25 1994-09-09 Shinko Electric Ind Co Ltd リードフレーム
JP4337659B2 (ja) 2004-07-06 2009-09-30 カシオ計算機株式会社 図形描画制御装置及びプログラム
JP2007134584A (ja) * 2005-11-11 2007-05-31 Mitsui High Tec Inc 積層リードフレームの製造方法及びこの方法によって製造された積層リードフレーム
JP2007305619A (ja) * 2006-05-08 2007-11-22 Mitsui High Tec Inc リードフレーム連設体およびその製造方法
JP4878580B2 (ja) * 2007-05-30 2012-02-15 ルネサスエレクトロニクス株式会社 リードフレームおよびその製造方法、半導体装置およびその製造方法
US20120223423A1 (en) * 2011-03-02 2012-09-06 Texas Instruments Incorporated Lead Frame Strip with Rails Having Bow Reducing Ribs

Also Published As

Publication number Publication date
JP2012204774A (ja) 2012-10-22
US20120248588A1 (en) 2012-10-04
TWI590402B (zh) 2017-07-01
US8558358B2 (en) 2013-10-15
TW201246491A (en) 2012-11-16

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