JP2012204774A5 - - Google Patents

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Publication number
JP2012204774A5
JP2012204774A5 JP2011070379A JP2011070379A JP2012204774A5 JP 2012204774 A5 JP2012204774 A5 JP 2012204774A5 JP 2011070379 A JP2011070379 A JP 2011070379A JP 2011070379 A JP2011070379 A JP 2011070379A JP 2012204774 A5 JP2012204774 A5 JP 2012204774A5
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JP
Japan
Prior art keywords
section bar
lead frame
frame according
along
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011070379A
Other languages
English (en)
Japanese (ja)
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JP2012204774A (ja
JP5762078B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011070379A priority Critical patent/JP5762078B2/ja
Priority claimed from JP2011070379A external-priority patent/JP5762078B2/ja
Priority to US13/418,770 priority patent/US8558358B2/en
Priority to TW101110139A priority patent/TWI590402B/zh
Publication of JP2012204774A publication Critical patent/JP2012204774A/ja
Publication of JP2012204774A5 publication Critical patent/JP2012204774A5/ja
Application granted granted Critical
Publication of JP5762078B2 publication Critical patent/JP5762078B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011070379A 2011-03-28 2011-03-28 リードフレーム Active JP5762078B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011070379A JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム
US13/418,770 US8558358B2 (en) 2011-03-28 2012-03-13 Lead frame
TW101110139A TWI590402B (zh) 2011-03-28 2012-03-23 導線架

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011070379A JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム

Publications (3)

Publication Number Publication Date
JP2012204774A JP2012204774A (ja) 2012-10-22
JP2012204774A5 true JP2012204774A5 (enExample) 2014-01-30
JP5762078B2 JP5762078B2 (ja) 2015-08-12

Family

ID=46926105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011070379A Active JP5762078B2 (ja) 2011-03-28 2011-03-28 リードフレーム

Country Status (3)

Country Link
US (1) US8558358B2 (enExample)
JP (1) JP5762078B2 (enExample)
TW (1) TWI590402B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587099B1 (en) * 2012-05-02 2013-11-19 Texas Instruments Incorporated Leadframe having selective planishing
CN103066047B (zh) * 2012-12-28 2016-09-07 日月光封装测试(上海)有限公司 半导体封装用导线架条及封装方法
JP6146732B2 (ja) * 2013-01-18 2017-06-14 Ｓｈマテリアル株式会社 半導体素子搭載用基板及びその製造方法
CN106415831B (zh) * 2014-05-09 2020-04-28 三菱电机株式会社 半导体模块
DE102015100025A1 (de) 2015-01-05 2016-07-07 Osram Opto Semiconductors Gmbh Leiterrahmen
JP1537979S (enExample) * 2015-04-20 2015-11-16
JP1537980S (enExample) * 2015-04-20 2015-11-16
JP2017005005A (ja) * 2015-06-05 2017-01-05 Ｓｈマテリアル株式会社 リードフレームの製造方法、およびリードフレーム
US9741643B2 (en) * 2016-01-22 2017-08-22 Texas Instruments Incorporated Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns
JP6772087B2 (ja) * 2017-02-17 2020-10-21 新光電気工業株式会社 リードフレーム及びその製造方法
US11908705B2 (en) * 2021-10-18 2024-02-20 Texas Instruments Incorporated Interconnect singulation

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3839782A (en) * 1972-03-15 1974-10-08 M Lincoln Method for using a lead frame for the manufacture of electric devices having semiconductor chips placed in a face-to-face relation
JPH0498858A (ja) * 1990-08-16 1992-03-31 Nec Kyushu Ltd 半導体装置用リードフレーム
JPH04180665A (ja) * 1990-11-15 1992-06-26 Nec Kyushu Ltd 半導体装置用リードフレーム
JPH04337659A (ja) * 1991-05-15 1992-11-25 Mitsubishi Electric Corp リードフレーム
JPH05326800A (ja) 1992-05-25 1993-12-10 Hitachi Ltd リードフレーム
JPH06252319A (ja) 1993-02-25 1994-09-09 Shinko Electric Ind Co Ltd リードフレーム
JP4337659B2 (ja) 2004-07-06 2009-09-30 カシオ計算機株式会社 図形描画制御装置及びプログラム
JP2007134584A (ja) * 2005-11-11 2007-05-31 Mitsui High Tec Inc 積層リードフレームの製造方法及びこの方法によって製造された積層リードフレーム
JP2007305619A (ja) * 2006-05-08 2007-11-22 Mitsui High Tec Inc リードフレーム連設体およびその製造方法
JP4878580B2 (ja) * 2007-05-30 2012-02-15 ルネサスエレクトロニクス株式会社 リードフレームおよびその製造方法、半導体装置およびその製造方法
US20120223423A1 (en) * 2011-03-02 2012-09-06 Texas Instruments Incorporated Lead Frame Strip with Rails Having Bow Reducing Ribs

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