JP5744018B2 - 接着力改善用変性ポリアルキレンテレフタレート樹脂、接着力改善用変性ポリアルキレンテレフタレート樹脂組成物、樹脂成形体、及び接合体 - Google Patents
接着力改善用変性ポリアルキレンテレフタレート樹脂、接着力改善用変性ポリアルキレンテレフタレート樹脂組成物、樹脂成形体、及び接合体 Download PDFInfo
- Publication number
- JP5744018B2 JP5744018B2 JP2012519342A JP2012519342A JP5744018B2 JP 5744018 B2 JP5744018 B2 JP 5744018B2 JP 2012519342 A JP2012519342 A JP 2012519342A JP 2012519342 A JP2012519342 A JP 2012519342A JP 5744018 B2 JP5744018 B2 JP 5744018B2
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- Japan
- Prior art keywords
- resin
- polyalkylene terephthalate
- terephthalate resin
- modified
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims description 110
- 239000011347 resin Substances 0.000 title claims description 110
- 229920001283 Polyalkylene terephthalate Polymers 0.000 title claims description 38
- 239000000853 adhesive Substances 0.000 title description 40
- 230000001070 adhesive effect Effects 0.000 title description 39
- 239000011342 resin composition Substances 0.000 title description 14
- -1 polybutylene terephthalate Polymers 0.000 claims description 33
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 29
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 26
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 23
- 239000013464 silicone adhesive Substances 0.000 claims description 21
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 238000000034 method Methods 0.000 description 26
- 229920001296 polysiloxane Polymers 0.000 description 20
- 238000000465 moulding Methods 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 230000007423 decrease Effects 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 238000005304 joining Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- YZPOQCQXOSEMAZ-UHFFFAOYSA-N pbt2 Chemical class ClC1=CC(Cl)=C(O)C2=NC(CN(C)C)=CC=C21 YZPOQCQXOSEMAZ-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- KYMJFFKSZQFHFA-UHFFFAOYSA-N 4-(4-hydroxyphenyl)benzene-1,2,3-triol Chemical class C1=CC(O)=CC=C1C1=CC=C(O)C(O)=C1O KYMJFFKSZQFHFA-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 238000012696 Interfacial polycondensation Methods 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229920006465 Styrenic thermoplastic elastomer Polymers 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
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- 239000000523 sample Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Classifications
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Description
本発明の接着力改善用変性ポリアルキレンテレフタレート樹脂(本明細書において「本発明のポリアルキレンテレフタレート樹脂」という場合がある。)は、テレフタル酸を除く芳香族ジカルボン酸及び/又はそのエステル化物を変性成分として含み、全ジカルボン酸成分に対する上記変性成分の含有量が13モル%以上35モル%以下である。上記変性成分は、折れ曲がり構造を高分子に付与する。高分子に折れ曲がり構造が付与されると、結晶化度が低下し、機械的強度等の一部の物性も低下する場合もあるが、後述するシリコーン系接着剤との接着性は大幅に向上する。
上記の通り、変性ポリブチレンテレフタレート樹脂は、全ジカルボン酸成分に対して、上記変性成分を13モル%以上35モル%以下含む。上述の通り、変性成分を含有すると結晶化度が低下し、物性等を低下させる傾向にある。しかしながら、ポリブチレンテレフタレート樹脂はポリアルキレンテレフタレート樹脂の中でも非常に優れた物性を有するため、上記結晶化度低下により物性が少し低下しても、樹脂成形体に対して非常に優れた機械的強度、電気的性質、その他物理的、化学的性質を付与することができる。また、得られる樹脂成形体に対して、シリコーン接着剤との高い接着性も付与できる。
本発明の接着力改善用変性ポリアルキレンテレフタレート樹脂組成物(以下、「本発明の樹脂組成物」という場合がある)は、上記接着力改善用変性ポリアルキレンテレフタレート樹脂を含み、変性ポリアルキレンテレフタレート以外のシリコーン系接着剤との接着性を向上させるための接着性向上剤を含有してもかまわない。接着力改善用変性ポリアルキレンテレフタレート樹脂については、上記の説明と同様であるため、説明を省略する。
接着性向上剤とは、変性ポリアルキレンテレフタレート以外のシリコーン接着剤との接着性を向上させるための成分である。例えば、スチレン系熱可塑性エラストマー、ケイ素原子に結合した水素原子とトリアルコキシシリルアルキル基を有するポリシロキサン、アクリロキシアルキル基を有するシランまたはシロキサンと有機過酸化物、ケイ素原子にエポキシ基及び/又はエステル基とケイ素原子に直接結合した水素原子とを有するポリシロキサン等のケイ素を含む化合物が挙げられる。また、これらの化合物以外に、シリコーン系接着剤との接着性を向上させる成分として従来公知である化合物、シリコーン系接着剤との接着性向上に寄与する構造を有する化合物も接着性向上剤である。
本発明の樹脂組成物には、本発明の効果を害さない範囲でその他の樹脂を含有してもよく、また、本発明の効果を害さない範囲で、核剤、着色剤、酸化防止剤、安定剤、可塑剤、滑剤、離型剤及び難燃剤等の従来公知の添加剤を含有してもよい。
上記本発明の樹脂組成物は、従来から樹脂組成物の調製に用いられる一般的な設備、方法を用いて容易に調製することができる。
本発明の樹脂成形体とは、上記本発明の樹脂組成物を成形してなる。本発明の成形体は後述するとおり、シリコーン系接着剤との接着性に優れる。シリコーン接着剤についても後述する。
本発明の接合体とは、一対の成形体がシリコーン接着剤を介して接合した接合体であり、上記一対の成形体の少なくとも一方が本発明の樹脂成形体である。本発明の樹脂成形体は、シリコーン系接着剤との接着性に優れるため、本発明の樹脂成形体とシリコーン系接着剤とが接着する箇所は、接着不良の問題がほとんど生じない。
ここでは、第一の樹脂成形体と第二の樹脂成形体とを接合する場合について説明する。接合される成形体の数は2以上であってもよい。
先ず、第一の樹脂成形体にシリコーン系接着剤を配置する。配置方法は特に限定されず、例えば、刷毛塗り、ポッティング等の方法が挙げられる。次いで、第一の樹脂成形体上に配置されたシリコーン系接着剤上に第二の樹脂成形体を載せ、必要に応じて、第一の樹脂成形体と第二の樹脂成形体とが密着するように、第一の樹脂成形体と第二の樹脂成形体が重なる方向に圧力を加える。最後に、室温又は加熱によりシリコーン系接着剤を硬化させる。
未変性ポリブチレンテレフタレート樹脂1(未変性PBT1):ポリプラスチックス社製、商品名「ジュラネックス400FP」(メルトインデックス(MI):45g/10min)
未変性ポリブチレンテレフタレート樹脂2(未変性PBT2):ポリプラスチックス社製、商品名「ジュラネックス500FP」(メルトインデックス(MI):20g/10min)
なお、メルトインデックスは、ASTM D−1238に準拠した方法で、235℃、荷重2160gの条件で測定した。
変性ポリブチレンテレフタレート樹脂2(変性PBT2):15モル% イソフタル酸変性ポリブチレンテレフタレート(メルトインデックス(MI):46g/10min)
変性ポリブチレンテレフタレート樹脂3(変性PBT3):17モル% イソフタル酸変性ポリブチレンテレフタレート(メルトインデックス(MI):30g/10min)
変性ポリブチレンテレフタレート樹脂4(変性PBT4):30モル% イソフタル酸変性ポリブチレンテレフタレート(メルトインデックス(MI):46g/10min)
シリコーン系接着剤:東レダウコーニングシリコーン社製、商品名「SE1714」
エポキシ系接着剤:ナガセケムテックス社製、商品名「XNR3503」
未変性ポリブチレンテレフタレート樹脂1、2及び変性ポリブチレンテレフタレート樹脂1〜4のそれぞれを射出成形機(ファナック社製S2000i 100B)に投入し、後述する接着強度の測定に使用する樹脂試験片(ISO3167に準拠した多目的試験片)を作製した。実施例1〜3の樹脂成形体、比較例1〜3の樹脂成形体が得られた。
ISO3167に準拠した多目的試験片の中央部を切断し、一方の樹脂試験片に7mm×7mmの穴を開けた日東電工株式会社製ニトフロン粘着テープ(厚み0.18mm)を貼り付け、穴の部分にシリコーン系接着剤を塗布した。塗布後、他方の樹脂試験片を重ね合わせ、クリップで固定し、120℃×1時間の条件で接着を行った。シリコーン系接着剤を用いて作製した実施例1〜3接合体及び比較例1〜3の接合体が得られた。
接合体を23℃、50%RHの環境に24時間以上放置し、オリエンテック製万能試験機テンシロンRTC−1325PLを用いて押し剥がし試験速度5mm/minの条件で接着した他方の樹脂試験片を押し剥がし、押し剥がし強度の最高値を測定した。測定結果は表1に示した。
<結晶化度の測定>
参考値として、未変性ポリブチレンテレフタレート樹脂1、2及び変性ポリブチレンテレフタレート樹脂1〜4の各樹脂の結晶化度を測定した。各樹脂の密度は水中置換法(JIS K7112に準拠)で測定した。上記数式(I)に従い、飽和ポリエステル樹脂ハンドブック(日刊工業新聞社)より、ポリブチレンテレフタレートの結晶密度ρc=1.40、非晶密度ρa=1.28として、結晶化度を算出した。
実施例の結果から明らかなように、上記接合体の接着強度が向上する効果は、シリコーン系接着剤を使用する場合に確認された。エポキシ系接着剤を使用する場合においては、変性PBTでも、未変性PBTと同等の接着強度であることが確認された。
実施例の結果から明らかなように、変性成分の含有量が多くなり、結晶化度の低い樹脂ほど、シリコーン接着強度が向上することが確認された。
Claims (3)
- テレフタル酸を除く芳香族ジカルボン酸、及び/又はそのエステル化物を、変性成分として共重合させ、
全ジカルボン酸成分に対する前記変性成分の含有量が13モル%以上35モル%以下である、
シリコーン系接着剤に対する接着力改善のための変性ポリアルキレンテレフタレート樹脂の使用。 - 前記変性ポリアルキレンテレフタレート樹脂が変性ポリブチレンテレフタレート樹脂である請求項1記載の使用。
- 前記芳香族ジカルボン酸及び/又はそのエステル化物が、イソフタル酸及び/又はそのエステル化物である請求項1又は2に記載の使用。
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Citations (5)
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JPH07126496A (ja) * | 1993-10-28 | 1995-05-16 | Polyplastics Co | ポリエステル樹脂組成物及び成形品 |
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JPWO2011155366A1 (ja) | 2013-08-01 |
MY160890A (en) | 2017-03-31 |
US11124602B2 (en) | 2021-09-21 |
WO2011155366A1 (ja) | 2011-12-15 |
CN103025790A (zh) | 2013-04-03 |
CN103025790B (zh) | 2014-12-03 |
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