JP5650496B2 - 一体成形体 - Google Patents
一体成形体 Download PDFInfo
- Publication number
- JP5650496B2 JP5650496B2 JP2010242501A JP2010242501A JP5650496B2 JP 5650496 B2 JP5650496 B2 JP 5650496B2 JP 2010242501 A JP2010242501 A JP 2010242501A JP 2010242501 A JP2010242501 A JP 2010242501A JP 5650496 B2 JP5650496 B2 JP 5650496B2
- Authority
- JP
- Japan
- Prior art keywords
- molded body
- phosphorus compound
- addition reaction
- reaction type
- type silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- -1 polybutylene terephthalate Polymers 0.000 claims description 101
- 229920005989 resin Polymers 0.000 claims description 64
- 239000011347 resin Substances 0.000 claims description 64
- 239000000203 mixture Substances 0.000 claims description 47
- 238000007259 addition reaction Methods 0.000 claims description 46
- 229920001296 polysiloxane Polymers 0.000 claims description 42
- 239000011574 phosphorus Substances 0.000 claims description 39
- 229910052698 phosphorus Inorganic materials 0.000 claims description 39
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 36
- 229920005992 thermoplastic resin Polymers 0.000 claims description 34
- 239000011342 resin composition Substances 0.000 claims description 7
- 239000000654 additive Substances 0.000 claims description 5
- 239000003963 antioxidant agent Substances 0.000 claims description 4
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 2
- 239000000088 plastic resin Substances 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 20
- 239000013464 silicone adhesive Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- 150000003018 phosphorus compounds Chemical class 0.000 description 12
- 238000004382 potting Methods 0.000 description 10
- 238000005304 joining Methods 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000005907 alkyl ester group Chemical group 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- DCTMXCOHGKSXIZ-UHFFFAOYSA-N (R)-1,3-Octanediol Chemical compound CCCCCC(O)CCO DCTMXCOHGKSXIZ-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000007429 general method Methods 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- PHJMLWHPHSYYQI-UHFFFAOYSA-N 1,1-bis(2,6-ditert-butyl-4-ethylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C(=CC(=C1)CC)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1C(C)(C)C)CC)C(C)(C)C PHJMLWHPHSYYQI-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- NYHNVHGFPZAZGA-UHFFFAOYSA-N 2-hydroxyhexanoic acid Chemical compound CCCCC(O)C(O)=O NYHNVHGFPZAZGA-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical group O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- HRMCXDSWURAYFR-UHFFFAOYSA-N 3-phenoxyphthalic acid Chemical compound OC(=O)C1=CC=CC(OC=2C=CC=CC=2)=C1C(O)=O HRMCXDSWURAYFR-UHFFFAOYSA-N 0.000 description 1
- JTGCXYYDAVPSFD-UHFFFAOYSA-N 4-(4-hydroxyphenyl)benzoic acid Chemical group C1=CC(C(=O)O)=CC=C1C1=CC=C(O)C=C1 JTGCXYYDAVPSFD-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 1
- PSOUDVKNXQIEGW-UHFFFAOYSA-N CC(C)(C)C1=CC(=C(C=C1)C2=C(C=CC(=C2)C3=CC=CC=C3)P(O)O)C(C)(C)C Chemical compound CC(C)(C)C1=CC(=C(C=C1)C2=C(C=CC(=C2)C3=CC=CC=C3)P(O)O)C(C)(C)C PSOUDVKNXQIEGW-UHFFFAOYSA-N 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- XAQKFOUWWAKVCH-UHFFFAOYSA-N OP(O)OP(O)O.C(C)(C)(C1=CC=CC=C1)C1=C(C=CC(=C1)C(C)(C)C1=CC=CC=C1)C(O)C(CO)(CO)CO Chemical compound OP(O)OP(O)O.C(C)(C)(C1=CC=CC=C1)C1=C(C=CC(=C1)C(C)(C)C1=CC=CC=C1)C(O)C(CO)(CO)CO XAQKFOUWWAKVCH-UHFFFAOYSA-N 0.000 description 1
- QAEPIAHUOVJOOM-UHFFFAOYSA-N OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC Chemical compound OP(O)OP(O)O.C(CCCCCCCC)C1=C(C=CC=C1)C(O)(C(CO)(CO)CO)C1=C(C=CC=C1)CCCCCCCCC QAEPIAHUOVJOOM-UHFFFAOYSA-N 0.000 description 1
- NTQJRZWGBUJHKP-UHFFFAOYSA-N OP(O)OP(O)O.C1(CCCCC1)C(O)(C(CO)(CO)CO)C1CCCCC1 Chemical compound OP(O)OP(O)O.C1(CCCCC1)C(O)(C(CO)(CO)CO)C1CCCCC1 NTQJRZWGBUJHKP-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- RYZNTUSGTWZGEC-UHFFFAOYSA-N [2,3-bis(2,6-ditert-butylphenyl)-4-phenylphenyl]phosphonous acid Chemical compound CC(C)(C)C1=C(C(=CC=C1)C(C)(C)C)C2=C(C=CC(=C2C3=C(C=CC=C3C(C)(C)C)C(C)(C)C)P(O)O)C4=CC=CC=C4 RYZNTUSGTWZGEC-UHFFFAOYSA-N 0.000 description 1
- IZMPAOFESFSUKJ-UHFFFAOYSA-N [2,4-bis(2,4-ditert-butylphenyl)-3-phenylphenyl]phosphonous acid Chemical compound CC(C)(C)C1=CC(=C(C=C1)C2=C(C(=C(C=C2)P(O)O)C3=C(C=C(C=C3)C(C)(C)C)C(C)(C)C)C4=CC=CC=C4)C(C)(C)C IZMPAOFESFSUKJ-UHFFFAOYSA-N 0.000 description 1
- BNHVSHVDYVQSNW-UHFFFAOYSA-N [3-[3-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound C(C)(C)(C)C1=C(OP(C=2C=C(C=CC=2)C=2C=C(C=CC=2)P(OC2=C(C=C(C=C2)C(C)(C)C)C(C)(C)C)OC2=C(C=C(C=C2)C(C)(C)C)C(C)(C)C)OC2=C(C=C(C=C2)C(C)(C)C)C(C)(C)C)C=CC(=C1)C(C)(C)C BNHVSHVDYVQSNW-UHFFFAOYSA-N 0.000 description 1
- XTFOCTHEHOLWKC-UHFFFAOYSA-N [3-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=C(C=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C XTFOCTHEHOLWKC-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- UELGRCOBOPRCQU-UHFFFAOYSA-N biphenylene;hydroxyphosphanyloxyphosphinous acid Chemical compound OPOPO.C1=CC=C2C3=CC=CC=C3C2=C1 UELGRCOBOPRCQU-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- ZWRWUGGYDBHANL-UHFFFAOYSA-N butyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCC)OC1=CC=CC=C1 ZWRWUGGYDBHANL-UHFFFAOYSA-N 0.000 description 1
- 229930188620 butyrolactone Natural products 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 229940125782 compound 2 Drugs 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001924 cycloalkanes Chemical class 0.000 description 1
- GLOQRSIADGSLRX-UHFFFAOYSA-N decyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCCCC)OC1=CC=CC=C1 GLOQRSIADGSLRX-UHFFFAOYSA-N 0.000 description 1
- 150000001470 diamides Chemical class 0.000 description 1
- RLMOMHNXIWBGTF-UHFFFAOYSA-N diaminophosphinoamine Chemical class NP(N)N RLMOMHNXIWBGTF-UHFFFAOYSA-N 0.000 description 1
- ZLRAAUUPULJGTL-UHFFFAOYSA-N diaminophosphinous acid Chemical class NP(N)O ZLRAAUUPULJGTL-UHFFFAOYSA-N 0.000 description 1
- NMAKPIATXQEXBT-UHFFFAOYSA-N didecyl phenyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OC1=CC=CC=C1 NMAKPIATXQEXBT-UHFFFAOYSA-N 0.000 description 1
- MKZVQIIAAIPNGH-UHFFFAOYSA-N dioctyl phenyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OC1=CC=CC=C1 MKZVQIIAAIPNGH-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
- 235000019414 erythritol Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- SMIZARYCGYRDGF-UHFFFAOYSA-N phenyl dipropan-2-yl phosphite Chemical compound CC(C)OP(OC(C)C)OC1=CC=CC=C1 SMIZARYCGYRDGF-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 125000005538 phosphinite group Chemical group 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- DCAFJGSRSBLEPX-UHFFFAOYSA-N tris(2,3-dibutylphenyl) phosphite Chemical compound CCCCC1=CC=CC(OP(OC=2C(=C(CCCC)C=CC=2)CCCC)OC=2C(=C(CCCC)C=CC=2)CCCC)=C1CCCC DCAFJGSRSBLEPX-UHFFFAOYSA-N 0.000 description 1
- OOZKMYBQDPXENQ-UHFFFAOYSA-N tris(2,3-diethylphenyl) phosphite Chemical compound CCC1=CC=CC(OP(OC=2C(=C(CC)C=CC=2)CC)OC=2C(=C(CC)C=CC=2)CC)=C1CC OOZKMYBQDPXENQ-UHFFFAOYSA-N 0.000 description 1
- AJHKJOCIGPIJFZ-UHFFFAOYSA-N tris(2,6-ditert-butylphenyl) phosphite Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1OP(OC=1C(=CC=CC=1C(C)(C)C)C(C)(C)C)OC1=C(C(C)(C)C)C=CC=C1C(C)(C)C AJHKJOCIGPIJFZ-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- QFGXDXGDZKTYFD-UHFFFAOYSA-N tris[2,3-di(propan-2-yl)phenyl] phosphite Chemical compound CC(C)C1=CC=CC(OP(OC=2C(=C(C(C)C)C=CC=2)C(C)C)OC=2C(=C(C(C)C)C=CC=2)C(C)C)=C1C(C)C QFGXDXGDZKTYFD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/527—Cyclic esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5393—Phosphonous compounds, e.g. R—P(OR')2
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31786—Of polyester [e.g., alkyd, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Description
単一成形体の場合は、部材とその成形体とがシリコーン系組成物とで接着されていたり、部材と熱可塑性樹脂成形体はネジ止め等で結合され周囲をシリコーン系組成物で覆われていたり、容器状の成形体中に部材が収納されシリコーン系組成物でポッティングされていても良い。
先ず、本発明の第一実施形態の概略について図を用いて説明する。
熱可塑性樹脂成形体は、ポリブチレンテレフタレート樹脂、リン化合物、その他の含有可能な成分(その他の成分)を含む。
付加反応型シリコーン系組成物の特徴の一つとして、耐熱性に優れることが挙げられる。熱可塑性樹脂として、耐熱性の高いものを選択すれば、耐熱性に優れた一体成形体になり、付加反応型シリコーン系組成物の特徴も充分に活かすことができる。このような観点から、熱可塑性樹脂としては、耐熱性に優れ、難燃剤等の様々な添加剤と好適に組み合わせ可能なポリブチレンテレフタレート樹脂を用いる。
リン化合物の中でも、5価以外のリン化合物は、付加反応型シリコーン系接着剤の硬化を特に阻害しやすい。5価以外のリン化合物としては、3価のリン化合物が用いられる場合が多い。3価のリン化合物は、例えば酸化防止剤として熱可塑性樹脂に添加され、樹脂成形体の酸化劣化を防止することができる。また、ポリブチレンテレフタレート等のポリエステル樹脂のエステル交換を抑制する効果が高く、3価のリン化合物を添加して得られた組成物はより高い熱安定性を示す。
樹脂成形体は、上記の熱可塑性樹脂、リン化合物以外に、無機充填剤、酸化防止剤、顔料等の従来公知の添加剤を、本発明の効果を害さない範囲で添加できる。特に、無機充填剤の一種であるガラス繊維を使用すると、樹脂成形体の機械強度や耐熱性が高まるため好ましい。
付加反応型シリコーン系組成物は、室温又は加熱により硬化する組成物であり、従来公知のものを使用することができる。硬化は、白金系触媒による付加反応で進行する。
部材は特に限定されず、センサー、自動車用・家電用のハイブリッドIC、半導体部品等の電子部品の他に、他の樹脂成形体であってもよい。部材が電子部品の場合には、接着、ポッティングのいずれの用途も一般的である。樹脂成形体の場合には、主に上記熱可塑性樹脂成形体との接合のために、付加反応型シリコーン系組成物が使用される。ここで、樹脂成形体は、どのような樹脂からなるものであってもよく、具体的には、熱可塑性樹脂、熱硬化性樹脂のいずれからなるものであってもよい。
ポリブチレンテレフタレート樹脂(PBT):ウィンテックポリマー社製、商品名「ジュラネックス300FP」(固有粘度0.69)
リン化合物2:ビス(2,4−ジ−t−ブチルフェニル)ペンタエリスリトールジホスファイト、ADEKA社製、商品名「アデカステブPEP−24G」
表1に示す配合(単位は質量%)で、PBT、リン化合物及びガラス繊維を二軸押出機にて溶融混練(シリンダー温度260℃、スクリュー回転数130rpm、押出量15kg/hr)しペレットを作製後、得られたペレットを140℃、3時間乾燥した後に、射出成形機(ファナック社製S2000i 100B)に投入し、後述する接着強度の測定に使用する樹脂試験片(ISO3167に準拠した多目的試験片)を作製した。このISO3167に準拠した試験片の中央部を切断し、一方を第一熱可塑性樹脂成形体とし、他方を第二熱可塑性樹脂成形体とした。
図3(a)に示すように、第一樹脂成形体に7mm×7mmの穴を開けた日東電工株式会社製ニトフロン粘着テープ(厚み0.18mm)を貼り付け、穴の部分にシリコーン系接着剤を塗布した。塗布後、第二樹脂成形体を重ね合わせ、クリップで固定し、120℃×0.5時間の条件で接着を行った。実施例及び比較例の一体成形体が得られた。
接合体を23℃、50%RHの環境に24時間以上放置し、オリエンテック製万能試験機テンシロンRTC−1325PLを用いて押し剥がし試験速度5mm/minの条件で接着した第二樹脂成形体を押し剥がし(具体的には、図3(b)の白抜き矢印の方向に圧力を加えて押し剥がした。)、押し剥がし強度の最高値を測定した。測定結果は表1に示した。
10 ケース
101 第一接合面
11 カバー
111 第二接合面
12 付加反応型シリコーン系組成物
Claims (4)
- ポリブチレンテレフタレート樹脂と、リン化合物とを含み、前記ポリブチレンテレフタレート樹脂の含有量が40質量%以上69.9質量%以下であり、前記リン化合物の含有量が0.5質量%以下である熱可塑性樹脂組成物からなる熱可塑性樹脂成形体と、
付加反応型シリコーン系組成物と、
部材と、を備え、
前記熱可塑性樹脂成形体と前記付加反応型シリコーン系組成物とが接触する一体成形体。 - 前記リン化合物が3価のリン化合物である請求項1に記載の一体成形体。
- 前記3価のリン化合物は、ホスホナイト系化合物及び/又はホスファイト系化合物である請求項2に記載の一体成形体。
- 前記熱可塑性樹脂組成物は、無機充填剤、酸化防止剤、及び顔料からなる群から選択される1種以上の添加剤を含有する請求項1から3のいずれか一項記載の一体成形体。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010242501A JP5650496B2 (ja) | 2010-10-28 | 2010-10-28 | 一体成形体 |
MX2013004700A MX2013004700A (es) | 2010-10-28 | 2011-10-28 | Articulo moldeado integralmente. |
US13/880,996 US8906988B2 (en) | 2010-10-28 | 2011-10-28 | Integrated molded product |
PCT/JP2011/074937 WO2012057318A1 (ja) | 2010-10-28 | 2011-10-28 | 一体成形体 |
CN201180051922.XA CN103180370B (zh) | 2010-10-28 | 2011-10-28 | 一体成形体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010242501A JP5650496B2 (ja) | 2010-10-28 | 2010-10-28 | 一体成形体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012092267A JP2012092267A (ja) | 2012-05-17 |
JP5650496B2 true JP5650496B2 (ja) | 2015-01-07 |
Family
ID=45994021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010242501A Active JP5650496B2 (ja) | 2010-10-28 | 2010-10-28 | 一体成形体 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8906988B2 (ja) |
JP (1) | JP5650496B2 (ja) |
CN (1) | CN103180370B (ja) |
MX (1) | MX2013004700A (ja) |
WO (1) | WO2012057318A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5744018B2 (ja) * | 2010-06-10 | 2015-07-01 | ウィンテックポリマー株式会社 | 接着力改善用変性ポリアルキレンテレフタレート樹脂、接着力改善用変性ポリアルキレンテレフタレート樹脂組成物、樹脂成形体、及び接合体 |
JP5654300B2 (ja) * | 2010-09-17 | 2015-01-14 | ポリプラスチックス株式会社 | 一体成形体 |
EP2942367B1 (de) * | 2014-05-05 | 2018-07-11 | LANXESS Deutschland GmbH | Polyester Zusammensetzungen |
JP6704189B2 (ja) * | 2015-08-03 | 2020-06-03 | パナソニックIpマネジメント株式会社 | Ledモジュール |
KR20200055754A (ko) * | 2017-09-21 | 2020-05-21 | 코닝 인코포레이티드 | 높은 파괴 인성을 갖는 투명한 이온-교환 실리케이트 유리 |
US11070632B2 (en) | 2018-10-17 | 2021-07-20 | Servicenow, Inc. | Identifying computing devices in a managed network that are involved in blockchain-based mining |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS536016B2 (ja) * | 1974-10-17 | 1978-03-03 | ||
JP3495165B2 (ja) * | 1995-12-14 | 2004-02-09 | 帝人株式会社 | シリコーンゴムとの接着性に優れたポリエステル樹脂組成物 |
JP3581484B2 (ja) * | 1996-03-12 | 2004-10-27 | 帝人株式会社 | 熱可塑性樹脂とシリコーンゴムとの一体成形体 |
JPH10338846A (ja) * | 1997-06-06 | 1998-12-22 | Sekisui Chem Co Ltd | 粘着シート |
US6762235B2 (en) * | 2001-04-24 | 2004-07-13 | Mitsubishi Engineering-Plastics Corporation | Polybutylene terephthalate resin and compositions and molded articles comprising the resin |
JP2005008736A (ja) * | 2003-06-18 | 2005-01-13 | Mitsubishi Engineering Plastics Corp | ポリブチレンテレフタレートフィルム及び複合化フィルム |
JP3972900B2 (ja) | 2003-04-23 | 2007-09-05 | 株式会社村田製作所 | 表面実装型電子部品の筐体構造 |
JP2007077205A (ja) * | 2005-09-12 | 2007-03-29 | Mitsubishi Engineering Plastics Corp | ポリブチレンテレフタレート樹脂組成物及び一体成形品 |
CN102850730B (zh) * | 2007-06-13 | 2014-10-15 | 胜技高分子株式会社 | 激光透射性树脂成形品及其复合成形品 |
JP2009149736A (ja) | 2007-12-19 | 2009-07-09 | Momentive Performance Materials Inc | 熱伝導性シリコーンゲル組成物 |
JP5351415B2 (ja) | 2007-12-26 | 2013-11-27 | ウィンテックポリマー株式会社 | ポリブチレンテレフタレート樹脂組成物 |
CN102056988B (zh) | 2008-06-11 | 2014-12-17 | 胜技高分子株式会社 | 聚对苯二甲酸丁二醇酯树脂组合物及成形品 |
-
2010
- 2010-10-28 JP JP2010242501A patent/JP5650496B2/ja active Active
-
2011
- 2011-10-28 US US13/880,996 patent/US8906988B2/en not_active Expired - Fee Related
- 2011-10-28 CN CN201180051922.XA patent/CN103180370B/zh active Active
- 2011-10-28 MX MX2013004700A patent/MX2013004700A/es active IP Right Grant
- 2011-10-28 WO PCT/JP2011/074937 patent/WO2012057318A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2012092267A (ja) | 2012-05-17 |
US8906988B2 (en) | 2014-12-09 |
US20130324649A1 (en) | 2013-12-05 |
CN103180370A (zh) | 2013-06-26 |
MX2013004700A (es) | 2013-08-29 |
CN103180370B (zh) | 2016-08-10 |
WO2012057318A1 (ja) | 2012-05-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5650496B2 (ja) | 一体成形体 | |
JP6038429B2 (ja) | ポリブチレンテレフタレート樹脂組成物及び成形品 | |
US8142888B2 (en) | Integrated molded product of a polybutylene terephthalate resin composition having silicone rubber excellently adhered thereto which concomitantly displays superior heat shock resistance | |
JP5377869B2 (ja) | 難燃性樹脂組成物及び被覆電線 | |
US20220275199A1 (en) | Polyester resin composition and molded product thereof | |
CN110753729B (zh) | 聚对苯二甲酸丁二酯树脂组合物 | |
JP2002356611A (ja) | ポリエステル系樹脂組成物およびその成形品 | |
JP5005204B2 (ja) | 電子部品を収容するケース、カバー又はハウジング成形品 | |
JP2007131692A (ja) | レーザー溶着用樹脂組成物およびそれを用いた複合成形体 | |
JP6192200B2 (ja) | 耐熱および耐光性ポリマー組成物 | |
JP6117190B2 (ja) | 電子機器用筐体 | |
JP5654300B2 (ja) | 一体成形体 | |
JP2021095484A (ja) | レーザー溶着用成形品、レーザー溶着用成形品のレーザー透過率のばらつき抑制剤 | |
JP6506806B2 (ja) | ポリブチレンテレフタレート樹脂組成物、成形品及び複合体 | |
WO2018021002A1 (ja) | ポリブチレンテレフタレート樹脂組成物の製造方法、及びそれを用いた成形品の製造方法 | |
JP2022071438A (ja) | レーザー溶着用成形品、レーザー溶着用成形品のレーザー透過率のばらつき抑制剤、レーザー溶着用成形品の耐アルカリ性向上剤 | |
JP6255545B1 (ja) | ポリブチレンテレフタレート樹脂組成物の製造方法、及びそれを用いた成形品の製造方法 | |
JPH08176418A (ja) | ポリブチレンテレフタレート系樹脂組成物 | |
JP3390539B2 (ja) | 熱可塑性樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20131002 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140812 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140918 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20141021 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20141113 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5650496 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R360 | Written notification for declining of transfer of rights |
Free format text: JAPANESE INTERMEDIATE CODE: R360 |
|
R371 | Transfer withdrawn |
Free format text: JAPANESE INTERMEDIATE CODE: R371 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |