JP5740535B1 - 半導体装置の製造方法、及び、半導体装置 - Google Patents
半導体装置の製造方法、及び、半導体装置 Download PDFInfo
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- JP5740535B1 JP5740535B1 JP2014536016A JP2014536016A JP5740535B1 JP 5740535 B1 JP5740535 B1 JP 5740535B1 JP 2014536016 A JP2014536016 A JP 2014536016A JP 2014536016 A JP2014536016 A JP 2014536016A JP 5740535 B1 JP5740535 B1 JP 5740535B1
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 232
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 140
- 239000002184 metal Substances 0.000 claims abstract description 140
- 238000000034 method Methods 0.000 claims abstract description 28
- 238000005530 etching Methods 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 226
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 42
- 229920005591 polysilicon Polymers 0.000 claims description 40
- 238000009792 diffusion process Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 13
- 239000011229 interlayer Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 79
- 229910052710 silicon Inorganic materials 0.000 description 79
- 239000010703 silicon Substances 0.000 description 79
- 150000004767 nitrides Chemical class 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- POFVJRKJJBFPII-UHFFFAOYSA-N N-cyclopentyl-5-[2-[[5-[(4-ethylpiperazin-1-yl)methyl]pyridin-2-yl]amino]-5-fluoropyrimidin-4-yl]-4-methyl-1,3-thiazol-2-amine Chemical compound C1(CCCC1)NC=1SC(=C(N=1)C)C1=NC(=NC=C1F)NC1=NC=C(C=C1)CN1CCN(CC1)CC POFVJRKJJBFPII-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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Abstract
Description
すなわち、3つのマスクを用いてシリコン柱、平面状シリコン層、ゲート配線を形成している。
シリコン基板101上に形成されたフィン状シリコン層103と、前記フィン状シリコン層103の周囲に形成された第1の絶縁膜104と、前記フィン状シリコン層103上に形成された柱状シリコン層109と、前記柱状シリコン層109の周囲に形成された第1のゲート絶縁膜120と、前記第1のゲート絶縁膜120の周囲に形成された金属からなるゲート電極121aと、前記ゲート電極121aに接続された前記フィン状シリコン層103に直交する方向に延在する金属からなるゲート配線121bと、前記ゲート電極121aと前記ゲート配線121bの周囲と底部に形成された前記第1のゲート絶縁膜120と、ここで前記ゲート電極121aの外側の幅と前記ゲート配線121bの幅は同じであり、前記フィン状シリコン層103の上部と前記柱状シリコン層109の下部に形成された第2の拡散層115と、前記柱状シリコン層109の上部側壁の周囲に形成された第2のゲート絶縁膜123と、前記第2のゲート絶縁膜123の周囲に形成された第2の金属からなる第1のコンタクト125aと、前記第1のコンタクト125aの上部と前記柱状シリコン層109上部とを接続する第3の金属からなる第2のコンタクト126bと、前記ゲート配線121b上に形成された前記第2の金属と前記第3の金属からなる第3のコンタクト137を有することを特徴とする
102.第1のレジスト
103.フィン状シリコン層
104.第1の絶縁膜
105.第2の絶縁膜
106.第1のポリシリコン、第1のダミーゲート
107.第3の絶縁膜
108.第2のレジスト
109.柱状シリコン層
110.第4の絶縁膜
113.第2のポリシリコン、第2のダミーゲート
114.第5の絶縁膜、第5の絶縁膜からなるサイドウォール
115.第2の拡散層
116.金属と半導体の化合物
117.金属と半導体の化合物
118.コンタクトストッパ膜
119.層間絶縁膜
120.第1のゲート絶縁膜
121.第1の金属
121a.ゲート電極
121b.ゲート配線
123.第2のゲート絶縁膜
124.第3のレジスト
125.第2の金属
125a.第1のコンタクト
125b.第2の金属
126.第3の金属
126a.第2のコンタクト
126b.第3の金属
127.第4のレジスト
128.コンタクト孔
129.コンタクト
130.第4の金属
131.第5のレジスト
132.第5のレジスト
133.第5のレジスト
134.金属配線
135.金属配線
136.金属配線
137.第3のコンタクト
Claims (18)
- 半導体基板上にフィン状半導体層を形成し、前記フィン状半導体層の周囲に第1の絶縁膜を形成する第1工程と、
前記第1工程の後、柱状半導体層と第1のポリシリコンによる第1のダミーゲートを形成する第2工程と、
前記第2工程の後、前記第1のダミーゲートと前記柱状半導体層の側壁に第2のダミーゲートを形成する第3工程と、
前記第3工程の後、前記第2のダミーゲートの周囲に、サイドウォール状に残存させ、第5の絶縁膜からなるサイドウォールを形成し、前記フィン状半導体層上部と前記柱状半導体層下部に第2の拡散層を形成し、前記第2の拡散層上に金属と半導体の化合物を形成する第4工程と、
前記第4工程の後、層間絶縁膜を堆積し、前記第2のダミーゲートと前記第1のダミーゲートの上部を露出し、前記第2のダミーゲートと前記第1のダミーゲートを除去し、第1のゲート絶縁膜を前記柱状半導体層の周囲と前記第5の絶縁膜の内側に形成し、第1の金属を堆積し、ゲート電極及びゲート配線を形成する第5工程と、
前記第5工程の後、前記柱状半導体層周囲と前記ゲート電極と前記ゲート配線上に第2のゲート絶縁膜を堆積し、前記ゲート配線上の一部の前記第2のゲート絶縁膜を除去し、第2の金属を堆積し、エッチバックを行い、前記柱状半導体層上の前記第2のゲート絶縁膜を除去し、第3の金属を堆積し、前記第3の金属と前記第2の金属の一部をエッチングすることで、第2の金属が前記柱状半導体層上部側壁を取り囲む第1のコンタクトと、前記第1のコンタクトの上部と前記柱状半導体層上部とを接続する第2のコンタクトと、前記ゲート配線上に形成された前記第2の金属と前記第3の金属からなる第3のコンタクトを形成する第6工程を有することを特徴とする半導体装置の製造方法。 - 前記第2工程は、
前記フィン状半導体層の周囲に第2の絶縁膜を形成し、
前記第2の絶縁膜の上に前記第1のポリシリコンを堆積し平坦化し、
前記ゲート配線と前記柱状半導体層を形成するための第2のレジストを、前記フィン状半導体層の方向に対して垂直の方向に形成し、
前記第1のポリシリコンと前記第2の絶縁膜と前記フィン状半導体層をエッチングすることにより、前記柱状半導体層と前記第1のポリシリコンによる前記第1のダミーゲートを形成することを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記第3工程は、前記柱状半導体層と前記第1のダミーゲートの周囲に第4の絶縁膜を形成し、前記第4の絶縁膜の周囲に第2のポリシリコンを堆積し、エッチングをすることにより、前記第1のダミーゲートと前記柱状半導体層の側壁に残存させ、前記第2のダミーゲートを形成することを特徴とする請求項1又は2に記載の半導体装置の製造方法。
- 前記第4工程は、前記第2のダミーゲートの周囲に、前記第5の絶縁膜を形成し、エッチングをし、サイドウォール状に残存させ、前記第5の絶縁膜からなるサイドウォールを形成し、前記フィン状半導体層上部と前記柱状半導体層下部に前記第2の拡散層を形成し、前記第2の拡散層上に前記金属と半導体の化合物を形成することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第5工程は、層間絶縁膜を堆積し化学機械研磨し、前記第2のダミーゲートと前記第1のダミーゲートの上部を露出し、前記第2のダミーゲートと前記第1のダミーゲートを除去し、前記第4の絶縁膜を除去し、第1のゲート絶縁膜を前記柱状半導体層の周囲と前記第5の絶縁膜の内側に形成し、第1の金属を堆積し、エッチバックを行い、前記ゲート電極及び前記ゲート配線を形成することを特徴とする請求項3に記載の半導体装置の製造方法。
- 前記第2の絶縁膜の上に前記第1のポリシリコンを堆積し平坦化後、前記第1のポリシリコン上に第3の絶縁膜を形成することをさらに含むことを特徴とする請求項2に記載の半導体装置の製造方法。
- 前記第4工程の後、コンタクトストッパ膜を堆積することをさらに有することを特徴とする請求項5に記載の半導体装置の製造方法。
- 前記第5工程の後、前記第1のゲート絶縁膜を除去する工程をさらに有することを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第1のコンタクトの金属の仕事関数は、4.0eVから4.2eVの間であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第1のコンタクトの金属の仕事関数は、5.0eVから5.2eVの間であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 半導体基板上に形成されたフィン状半導体層と、
前記フィン状半導体層の周囲に形成された第1の絶縁膜と、
前記フィン状半導体層上に形成された柱状半導体層と、
前記柱状半導体層の周囲に形成された第1のゲート絶縁膜と、
前記第1のゲート絶縁膜の周囲に形成された金属からなるゲート電極と、
前記ゲート電極に接続された前記フィン状半導体層に直交する方向に延在する金属からなるゲート配線と、
前記ゲート電極と前記ゲート配線の周囲と底部に形成された前記第1のゲート絶縁膜と、
前記フィン状半導体層の上部と前記柱状半導体層の下部に形成された第2の拡散層と、
前記柱状半導体層の上部側壁の周囲に形成された第2のゲート絶縁膜と、
前記第2のゲート絶縁膜の周囲に形成された第2の金属からなる第1のコンタクトと、
前記第1のコンタクトの上部と前記柱状半導体層上部とを接続する第3の金属からなる第2のコンタクトと、
前記ゲート配線上に形成された前記第2の金属と前記第3の金属からなる第3のコンタクト
を有することを特徴とする半導体装置。 - 前記第1のコンタクトのゲート配線に直交する方向の幅は、前記第3のコンタクトのゲート配線に直交する方向の幅と等しいことを特徴とする請求項11に記載の半導体装置。
- 前記第1のコンタクトのゲート配線に直交する方向の幅は、前記ゲート配線のゲート配線に直交する方向の幅と等しいことを特徴とする請求項11に記載の半導体装置。
- 前記第3のコンタクトのゲート配線に直交する方向の幅は、前記ゲート配線のゲート配線に直交する方向の幅と等しいことを特徴とする請求項11に記載の半導体装置。
- 前記第1のコンタクトのゲート配線に直交する方向の幅は、前記第2のコンタクトのゲート配線に直交する方向の幅と等しいことを特徴とする請求項11に記載の半導体装置。
- 前記第1のコンタクトの周囲と底部に形成された前記第2のゲート絶縁膜をさらに有することを特徴とする請求項11に記載の半導体装置。
- 前記第1のコンタクトの第2の金属の仕事関数は、4.0eVから4.2eVの間であることを特徴とする請求項11に記載の半導体装置。
- 前記第1のコンタクトの第2の金属の仕事関数は、5.0eVから5.2eVの間であることを特徴とする請求項11に記載の半導体装置。
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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LAPS | Cancellation because of no payment of annual fees |