JP5727625B2 - 電子デバイス及び電子デバイスの製造方法 - Google Patents
電子デバイス及び電子デバイスの製造方法 Download PDFInfo
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- JP5727625B2 JP5727625B2 JP2013546642A JP2013546642A JP5727625B2 JP 5727625 B2 JP5727625 B2 JP 5727625B2 JP 2013546642 A JP2013546642 A JP 2013546642A JP 2013546642 A JP2013546642 A JP 2013546642A JP 5727625 B2 JP5727625 B2 JP 5727625B2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/105—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
ここで積層部80を成す層のうち少なくとも幾つかは導電性も持ち、従って高周波を遮蔽するように出来ていてもよい。積層部80を成す層は、印刷法により施されるエポキシ材料を有していてもよく、導電性を持たせる場合は金属で出来ていてもよい。
20 第二電極
30 圧電層
40 基板
51 第一反射層
52 第二反射層
60 キャビティ
70 第一安定化層
80 積層部
81 安定化層
82 安定化層
83 安定化層
100 パッケージ
Claims (13)
- 第一電極(10)、第二電極(20)、前記第一電極(10)と前記第二電極(20)とに電気的に連結された活性領域(30)、及び、パッケージ(100)を有する電子デバイスにおいて、
前記パッケージ(100)が少なくとも一部の領域に複数の平面状単原子炭素層を含み、
前記複数の平面状単原子炭素層は、複数の単層または積層として配設されており、分離された複数の層あるいは上下に重なった複数の層として、前記パッケージ中に存在する、ことを特徴とする、電子デバイス。 - 電気音響素子であって、前記活性領域(30)が圧電層を含んでいることを特徴とする、請求項1に記載の電子デバイス。
- 第一及び第二電極(10,20)が、圧電層(30)の一つの面に配置され、または相対する面にそれぞれ配設されていることを特徴とする、請求項2に記載の電子デバイス。
- パッケージ(100)が、活性領域(30)上に配されたキャビティ(60)を有していることを特徴とする、請求項1乃至3のいずれかに記載の電子デバイス。
- 前記キャビティ(60)上に、キャビティにまたがる積層部(80)が配設されていることを特徴とする、請求項4に記載の電子デバイス。
- 前記キャビティ(60)と前記積層部(80)との間に第一安定化層(70)が配設されていることを特徴とする、請求項5に記載の電子デバイス。
- 前記積層部80が、複数の平面状単原子炭素層を含む少なくとも一つの安定化層(81,82,83)を有していることを特徴とする、請求項5または6に記載の電子デバイス。
- 前記第一安定化層(70)が複数の平面状単原子炭素層を含んでいることを特徴とする、請求項6または7に記載の電子デバイス。
- 前記安定化層(81,82,83)が、前記積層部(80)の内部に配設され、または前記キャビティ(60)を完全に取り囲む層(81)として、または前記積層部(80)を外に向かって閉ざす層(83)として配設されていることを特徴とする、請求項7に記載の電子デバイス。
- 前記安定化層(81,83)が更に高周波遮蔽性及び/または熱伝導性をもつことを特徴とする、請求項7または9に記載の電子デバイス。
- 表面波素子または体積波素子または微小電気機械素子として構成されていることを特徴とする、請求項1乃至10のいずれかに記載の電子デバイス。
- 請求項9または10に記載の電子デバイスの製造方法であって、
A) 前記第一電極(10)、前記第二電極(20)及び前記活性領域(30)を含む構造部分の上に仮設層を設けるステップ、
B) 開口を有する第一安定化層(70)を前記仮設層上に配設するステップ、
C) 開口を通じて前記仮設層を除くステップ、及び、
D) 第一安定化層(70)上に積層部(80)を設けるステップ
を有し、
前記複数の平面状単原子炭素層を含む層が、前記キャビティのすぐ上、または前記積層部中に設けられ、あるいは前記積層部を閉ざす層として設けられることを特徴とする、電子デバイスの製造方法。 - 前記ステップB)及び/または前記ステップD)が、化学蒸着、物理蒸着、溶液塗布、及び、表面化学反応を含む群から選ばれた方法によって実施されることを特徴とする、請求項12に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010056562.8A DE102010056562B4 (de) | 2010-12-30 | 2010-12-30 | Elektroakustisches Bauelement und Verfahren zur Herstellung des elektroakustischen Bauelements |
DE102010056562.8 | 2010-12-30 | ||
PCT/EP2011/071761 WO2012089443A1 (de) | 2010-12-30 | 2011-12-05 | Elektronisches bauelement und verfahren zur herstellung des elektronischen bauelements |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014502815A JP2014502815A (ja) | 2014-02-03 |
JP5727625B2 true JP5727625B2 (ja) | 2015-06-03 |
Family
ID=45315763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013546642A Expired - Fee Related JP5727625B2 (ja) | 2010-12-30 | 2011-12-05 | 電子デバイス及び電子デバイスの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9807917B2 (ja) |
JP (1) | JP5727625B2 (ja) |
CN (1) | CN103283146B (ja) |
DE (1) | DE102010056562B4 (ja) |
WO (1) | WO2012089443A1 (ja) |
Families Citing this family (8)
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US10303227B2 (en) * | 2013-02-27 | 2019-05-28 | Dell Products L.P. | Information handling system housing heat spreader |
DE102013102217B4 (de) * | 2013-03-06 | 2015-11-12 | Epcos Ag | Mikroakustisches Bauelement und Verfahren zur Herstellung |
DE102013102223B4 (de) * | 2013-03-06 | 2014-09-18 | Epcos Ag | Miniaturisiertes Mehrkomponentenbauelement und Verfahren zur Herstellung |
JP6130757B2 (ja) * | 2013-09-04 | 2017-05-17 | 本田技研工業株式会社 | 光電変換材料及びその製造方法と、それを用いた有機薄膜太陽電池 |
DE102014117238B4 (de) * | 2014-11-25 | 2017-11-02 | Snaptrack, Inc. | BAW-Resonator mit verringerter Eigenerwärmung, HF-Filter mit BAW-Resonator, Duplexer mit HF-Filter und Verfahren zur Herstellung |
DE102016111911A1 (de) * | 2016-06-29 | 2018-01-04 | Snaptrack, Inc. | Bauelement mit Dünnschicht-Abdeckung und Verfahren zur Herstellung |
DE102017129160B3 (de) * | 2017-12-07 | 2019-01-31 | RF360 Europe GmbH | Elektroakustisches Resonatorbauelement und Verfahren zu dessen Herstellung |
CN109474254B (zh) * | 2018-10-31 | 2020-12-08 | 武汉衍熙微器件有限公司 | 一种声波器件及其制作方法 |
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-
2010
- 2010-12-30 DE DE102010056562.8A patent/DE102010056562B4/de not_active Expired - Fee Related
-
2011
- 2011-12-05 US US13/977,000 patent/US9807917B2/en not_active Expired - Fee Related
- 2011-12-05 CN CN201180063794.0A patent/CN103283146B/zh active Active
- 2011-12-05 JP JP2013546642A patent/JP5727625B2/ja not_active Expired - Fee Related
- 2011-12-05 WO PCT/EP2011/071761 patent/WO2012089443A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN103283146B (zh) | 2019-11-19 |
JP2014502815A (ja) | 2014-02-03 |
DE102010056562A1 (de) | 2012-07-05 |
US9807917B2 (en) | 2017-10-31 |
CN103283146A (zh) | 2013-09-04 |
US20130343028A1 (en) | 2013-12-26 |
WO2012089443A1 (de) | 2012-07-05 |
DE102010056562B4 (de) | 2018-10-11 |
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