JP5725465B2 - ポリマー材料表面相互作用を変えるための方法及びプロセス - Google Patents

ポリマー材料表面相互作用を変えるための方法及びプロセス Download PDF

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Publication number
JP5725465B2
JP5725465B2 JP2009283148A JP2009283148A JP5725465B2 JP 5725465 B2 JP5725465 B2 JP 5725465B2 JP 2009283148 A JP2009283148 A JP 2009283148A JP 2009283148 A JP2009283148 A JP 2009283148A JP 5725465 B2 JP5725465 B2 JP 5725465B2
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ips
photocurable
resist
providing
substrate
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Japanese (ja)
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JP2010183064A (ja
JP2010183064A5 (OSRAM
Inventor
ヤコブ・ニルソン
マティアス・カイル
ヨハン・リング
ババク・ハイダリ
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オブダカット・アーベー
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
JP2009283148A 2008-12-19 2009-12-14 ポリマー材料表面相互作用を変えるための方法及びプロセス Active JP5725465B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US13903008P 2008-12-19 2008-12-19
US61/139,030 2008-12-19
EP08172342.1A EP2199855B1 (en) 2008-12-19 2008-12-19 Methods and processes for modifying polymer material surface interactions
EP08172342.1 2008-12-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015022431A Division JP5838002B2 (ja) 2008-12-19 2015-02-06 ポリマー材料表面相互作用を変えるための方法及びプロセス

Publications (3)

Publication Number Publication Date
JP2010183064A JP2010183064A (ja) 2010-08-19
JP2010183064A5 JP2010183064A5 (OSRAM) 2014-04-24
JP5725465B2 true JP5725465B2 (ja) 2015-05-27

Family

ID=40521956

Family Applications (2)

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JP2009283148A Active JP5725465B2 (ja) 2008-12-19 2009-12-14 ポリマー材料表面相互作用を変えるための方法及びプロセス
JP2015022431A Active JP5838002B2 (ja) 2008-12-19 2015-02-06 ポリマー材料表面相互作用を変えるための方法及びプロセス

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JP2015022431A Active JP5838002B2 (ja) 2008-12-19 2015-02-06 ポリマー材料表面相互作用を変えるための方法及びプロセス

Country Status (7)

Country Link
US (1) US9063408B2 (OSRAM)
EP (1) EP2199855B1 (OSRAM)
JP (2) JP5725465B2 (OSRAM)
KR (1) KR101767179B1 (OSRAM)
CN (1) CN101872115B (OSRAM)
SG (1) SG162674A1 (OSRAM)
TW (1) TWI515510B (OSRAM)

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JP2013518740A (ja) * 2010-02-05 2013-05-23 オブダカット・アーベー 大面積ナノパターン用金属スタンプ複製の方法及びプロセス
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SG10201506124TA (en) * 2010-08-06 2015-09-29 Soken Kagaku Kk Resin Mold For Nanoimprinting And Production Method Thereof
JP5481000B2 (ja) * 2010-08-26 2014-04-23 エーエスエムエル ネザーランズ ビー．ブイ． インプリントリソグラフィ方法
JP5306404B2 (ja) * 2011-03-25 2013-10-02 株式会社東芝 パターン形成方法
JP6162145B2 (ja) * 2012-01-13 2017-07-12 エーエスエムエル ネザーランズ ビー．ブイ． 自己組織化可能な重合体及びリソグラフィにおける使用方法
JP5959865B2 (ja) 2012-02-09 2016-08-02 キヤノン株式会社 光硬化物及びその製造方法
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KR102267680B1 (ko) * 2013-11-29 2021-06-22 에베 그룹 에. 탈너 게엠베하 다이 구조물을 가지는 다이, 뿐만 아니라 이의 제조 방법
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US10754244B2 (en) * 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold
JP6754344B2 (ja) * 2017-09-26 2020-09-09 富士フイルム株式会社 インプリント用下層膜形成用組成物、キット、積層体、積層体の製造方法、硬化物パターンの製造方法、回路基板の製造方法
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11549020B2 (en) 2019-09-23 2023-01-10 Canon Kabushiki Kaisha Curable composition for nano-fabrication

Also Published As

Publication number Publication date
TW201027251A (en) 2010-07-16
JP5838002B2 (ja) 2015-12-24
JP2010183064A (ja) 2010-08-19
TWI515510B (zh) 2016-01-01
CN101872115A (zh) 2010-10-27
JP2015097293A (ja) 2015-05-21
KR101767179B1 (ko) 2017-08-10
US20100160478A1 (en) 2010-06-24
CN101872115B (zh) 2015-09-30
HK1149804A1 (en) 2011-10-14
US9063408B2 (en) 2015-06-23
EP2199855A1 (en) 2010-06-23
KR20100071925A (ko) 2010-06-29
SG162674A1 (en) 2010-07-29
EP2199855B1 (en) 2016-07-20

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