JP5722600B2 - 埋立ビットラインを有する半導体装置及び半導体装置の製造方法 - Google Patents

埋立ビットラインを有する半導体装置及び半導体装置の製造方法 Download PDF

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JP5722600B2
JP5722600B2 JP2010264982A JP2010264982A JP5722600B2 JP 5722600 B2 JP5722600 B2 JP 5722600B2 JP 2010264982 A JP2010264982 A JP 2010264982A JP 2010264982 A JP2010264982 A JP 2010264982A JP 5722600 B2 JP5722600 B2 JP 5722600B2
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bit line
region
semiconductor device
layer
buried bit
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JP2011187927A5 (enExample
JP2011187927A (ja
Inventor
在萬 尹
在萬 尹
熙中 金
熙中 金
鉉雨 鄭
鉉雨 鄭
鉉▲ギ▼ 金
鉉▲ギ▼ 金
岡▲ウク▼ 金
岡▲ウク▼ 金
容哲 呉
容哲 呉
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
    • H10B12/053—Making the transistor the transistor being at least partially in a trench in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/09—Manufacture or treatment with simultaneous manufacture of the peripheral circuit region and memory cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
JP2010264982A 2010-03-10 2010-11-29 埋立ビットラインを有する半導体装置及び半導体装置の製造方法 Active JP5722600B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0021211 2010-03-10
KR1020100021211A KR20110101876A (ko) 2010-03-10 2010-03-10 매립 비트 라인을 갖는 반도체 장치 및 반도체 장치의 제조 방법
US12/760,140 US8373214B2 (en) 2010-03-10 2010-04-14 Semiconductor devices with buried bit lines and methods of manufacturing semiconductor devices
US12/760,140 2010-04-14

Publications (3)

Publication Number Publication Date
JP2011187927A JP2011187927A (ja) 2011-09-22
JP2011187927A5 JP2011187927A5 (enExample) 2013-12-05
JP5722600B2 true JP5722600B2 (ja) 2015-05-20

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JP2010264982A Active JP5722600B2 (ja) 2010-03-10 2010-11-29 埋立ビットラインを有する半導体装置及び半導体装置の製造方法

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Country Link
US (1) US8373214B2 (enExample)
JP (1) JP5722600B2 (enExample)
KR (1) KR20110101876A (enExample)

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US20110254085A1 (en) * 2010-04-16 2011-10-20 Hynix Semiconductor Inc. Semiconductor integrated circuit device having reduced unit cell area and method for manufacturing the same
KR101669261B1 (ko) * 2010-06-14 2016-10-25 삼성전자주식회사 수직 채널 트랜지스터를 구비한 반도체 소자 및 그 제조 방법
KR20130110181A (ko) * 2011-11-09 2013-10-08 유니산티스 일렉트로닉스 싱가포르 프라이빗 리미티드 반도체 장치의 제조 방법 및 반도체 장치
US8759178B2 (en) 2011-11-09 2014-06-24 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device
US10438836B2 (en) 2011-11-09 2019-10-08 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing a semiconductor device
US9117690B2 (en) 2011-12-02 2015-08-25 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
US8735971B2 (en) 2011-12-02 2014-05-27 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
US9312257B2 (en) 2012-02-29 2016-04-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20130106159A (ko) 2012-03-19 2013-09-27 에스케이하이닉스 주식회사 매립비트라인을 구비한 반도체장치 및 제조 방법
US9023723B2 (en) * 2012-05-31 2015-05-05 Applied Materials, Inc. Method of fabricating a gate-all-around word line for a vertical channel DRAM
JP2014022390A (ja) * 2012-07-12 2014-02-03 Ps4 Luxco S A R L 半導体装置、ピラートランジスタのレイアウト方法及びそのレイアウト方法を用いて製造した半導体装置
KR101924020B1 (ko) 2012-10-18 2018-12-03 삼성전자주식회사 반도체 장치 및 이의 제조 방법
KR102001417B1 (ko) 2012-10-23 2019-07-19 삼성전자주식회사 반도체 장치
KR20140109741A (ko) * 2013-03-06 2014-09-16 에스케이하이닉스 주식회사 수직형 반도체 장치 및 제조 방법과 그 동작 방법
KR102029794B1 (ko) * 2013-03-15 2019-10-08 삼성전자주식회사 반도체 장치
JP5974066B2 (ja) * 2014-12-12 2016-08-23 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドＵｎｉｓａｎｔｉｓ Ｅｌｅｃｔｒｏｎｉｃｓ Ｓｉｎｇａｐｏｒｅ Ｐｔｅ Ｌｔｄ． 半導体装置の製造方法と半導体装置
TWI685841B (zh) * 2019-03-08 2020-02-21 華邦電子股份有限公司 動態隨機存取記憶體及其製造方法
TWI715335B (zh) * 2019-12-05 2021-01-01 華邦電子股份有限公司 記憶體結構及其形成方法
CN117320434A (zh) * 2022-06-13 2023-12-29 长鑫存储技术有限公司 一种半导体结构及其制作方法
EP4355048A4 (en) * 2022-06-13 2024-04-17 Changxin Memory Technologies, Inc. SEMICONDUCTOR STRUCTURE AND CORRESPONDING MANUFACTURING METHOD

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Publication number Publication date
US20110220977A1 (en) 2011-09-15
KR20110101876A (ko) 2011-09-16
JP2011187927A (ja) 2011-09-22
US8373214B2 (en) 2013-02-12

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