JP5719296B2 - マイクロスケール熱または熱および質量移動システム - Google Patents
マイクロスケール熱または熱および質量移動システム Download PDFInfo
- Publication number
- JP5719296B2 JP5719296B2 JP2011521348A JP2011521348A JP5719296B2 JP 5719296 B2 JP5719296 B2 JP 5719296B2 JP 2011521348 A JP2011521348 A JP 2011521348A JP 2011521348 A JP2011521348 A JP 2011521348A JP 5719296 B2 JP5719296 B2 JP 5719296B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- fluid
- mass transfer
- shim
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B33/00—Boilers; Analysers; Rectifiers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B37/00—Absorbers; Adsorbers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/15—Microelectro-mechanical devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/01—Geometry problems, e.g. for reducing size
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D21/0015—Heat and mass exchangers, e.g. with permeable walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
- F28D9/005—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another the plates having openings therein for both heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0093—Multi-circuit heat-exchangers, e.g. integrating different heat exchange sections in the same unit or heat-exchangers for more than two fluids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/62—Absorption based systems
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Sorption Type Refrigeration Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8519208P | 2008-07-31 | 2008-07-31 | |
| US61/085,192 | 2008-07-31 | ||
| PCT/US2009/052362 WO2010014878A1 (en) | 2008-07-31 | 2009-07-31 | Microscale heat or heat and mass transfer system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011530059A JP2011530059A (ja) | 2011-12-15 |
| JP2011530059A5 JP2011530059A5 (enExample) | 2012-09-06 |
| JP5719296B2 true JP5719296B2 (ja) | 2015-05-13 |
Family
ID=41610741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011521348A Active JP5719296B2 (ja) | 2008-07-31 | 2009-07-31 | マイクロスケール熱または熱および質量移動システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110180235A1 (enExample) |
| EP (1) | EP2321605B1 (enExample) |
| JP (1) | JP5719296B2 (enExample) |
| KR (2) | KR20110074970A (enExample) |
| CN (1) | CN102112837B (enExample) |
| WO (1) | WO2010014878A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2603759A4 (en) * | 2010-08-10 | 2015-01-14 | Georgia Tech Res Inst | STEAM LIQUID HEAT AND / OR STOCK EXCHANGE DEVICE |
| JP5731246B2 (ja) * | 2011-03-23 | 2015-06-10 | 大阪瓦斯株式会社 | 熱交換器及び熱交換器の製造方法 |
| JP5731247B2 (ja) * | 2011-03-23 | 2015-06-10 | 大阪瓦斯株式会社 | 吸収式冷凍機及び吸収式冷凍機の製造方法 |
| WO2014057470A1 (en) * | 2012-10-11 | 2014-04-17 | Driessen Aerospace Group Nv | Absorption cooling for aircraft trolleys and compartments |
| US20140157815A1 (en) * | 2012-12-06 | 2014-06-12 | Massachusetts Institute Of Technology | Monolithically Integrated Bi-Directional Heat Pump |
| JP6146484B2 (ja) | 2013-12-13 | 2017-06-14 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
| DE102014204935A1 (de) * | 2014-03-17 | 2015-10-01 | Mahle International Gmbh | Heizkühlmodul |
| US20160141062A1 (en) * | 2014-11-19 | 2016-05-19 | General Electric Company | Target body for an isotope production system and method of using the same |
| US20160265814A1 (en) * | 2015-03-11 | 2016-09-15 | Heatcraft Refrigeration Products Llc | Water Cooled Microchannel Condenser |
| EP3303946B1 (en) | 2015-05-27 | 2021-04-07 | Carrier Corporation | Evaporator with a mulitlevel distribution system |
| FR3043765B1 (fr) * | 2015-11-17 | 2019-05-31 | Dcns | Plaque d'echangeur thermique, echangeur thermique, dispositif de refroidissement par absorption monte sur une plateforme navale et procede d'echange thermique associes |
| CN106802018B (zh) * | 2015-11-26 | 2023-04-21 | 四川捷元科技有限公司 | 吸收式制冷单元 |
| CN106802013B (zh) * | 2015-11-26 | 2023-04-21 | 四川捷元科技有限公司 | 单元组合式制冷矩阵 |
| WO2017124176A1 (en) * | 2016-01-21 | 2017-07-27 | Etalim Inc. | Apparatus and system for exchanging heat with a fluid |
| CN106686947B (zh) * | 2016-12-30 | 2018-11-09 | 华为机器有限公司 | 散热器及通信产品 |
| US10428713B2 (en) | 2017-09-07 | 2019-10-01 | Denso International America, Inc. | Systems and methods for exhaust heat recovery and heat storage |
| CN108804845B (zh) * | 2018-06-20 | 2020-03-31 | 西安交通大学 | 基于无网格伽辽金法的散热器件冷却通道生成式设计方法 |
| US20200149748A1 (en) * | 2018-11-14 | 2020-05-14 | Francesco Giovanni Longo | Building System |
| WO2020162938A1 (en) * | 2019-02-07 | 2020-08-13 | Hewlett Packard Enterprise Development Lp | Photo-etched chassis cooling walls |
| JP7188376B2 (ja) * | 2019-07-23 | 2022-12-13 | 株式会社デンソー | 熱交換器 |
| WO2021014893A1 (ja) * | 2019-07-23 | 2021-01-28 | 株式会社デンソー | 熱交換器 |
| JP7207286B2 (ja) * | 2019-07-23 | 2023-01-18 | 株式会社デンソー | 熱交換器 |
| JP2022554145A (ja) * | 2019-10-25 | 2022-12-28 | エボルブ アディティブ ソリューションズ, インコーポレイテッド | 積層造形のための冷却装置及び方法 |
| US12238895B2 (en) * | 2021-04-07 | 2025-02-25 | Nvidia Corporation | Intelligent low pressure two-phase cold plate with flow stabilization for datacenter cooling systems |
| DE102022116807A1 (de) | 2022-07-06 | 2024-01-11 | Viessmann Climate Solutions Se | Kältekreislaufvorrichtung |
| CN115420131B (zh) * | 2022-09-21 | 2024-04-19 | 西安电子科技大学 | 一种中心差分式换热器及其换热性能检测装置 |
| WO2024141035A1 (zh) * | 2022-12-31 | 2024-07-04 | 浙江炽昇热泵有限公司 | 流体通道片及具有其的换热器 |
| JP7564524B2 (ja) * | 2023-07-04 | 2024-10-09 | Kmt技研株式会社 | ベーパーチャンバー製造用金属部材、その製造方法及びベーパーチャンバーの製造方法 |
| DE102023119385A1 (de) | 2023-07-21 | 2025-01-23 | Viessmann Climate Solutions Se | Kältekreisvorrichtung und wärmepumpe |
| DE102023119386A1 (de) | 2023-07-21 | 2025-01-23 | Viessmann Climate Solutions Se | Kältekreisvorrichtung und wärmepumpe |
| DE102023119395A1 (de) | 2023-07-21 | 2025-01-23 | Viessmann Climate Solutions Se | Kältekreisvorrichtung und wärmepumpe |
| WO2025021283A1 (de) | 2023-07-21 | 2025-01-30 | Viessmann Climate Solutions Se | Kältekreisvorrichtung und wärmepumpe |
| DE102023119382A1 (de) | 2023-07-21 | 2025-01-23 | Viessmann Climate Solutions Se | Kältekreisvorrichtung und wärmepumpe |
| ES3031124A1 (es) * | 2024-09-23 | 2025-07-04 | Univ Rovira I Virgili | Dispositivo de bomba de calor por compresion-resorcion de doble elevacion de temperatura |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
| GB2076304B (en) * | 1980-05-26 | 1984-02-22 | Univ Sydney | Heat exchange (evaporator) device |
| US4972679A (en) * | 1990-02-09 | 1990-11-27 | Columbia Gas Service Corporation | Absorption refrigeration and heat pump system with defrost |
| US5392849A (en) * | 1990-09-28 | 1995-02-28 | Matsushita Refrigeration Company | Layer-built heat exchanger |
| US5146978A (en) * | 1990-10-30 | 1992-09-15 | Walter F. Albers | Method and apparatus for monochannel simultaneous heat and mass transfer |
| US5367884B1 (en) * | 1991-03-12 | 1996-12-31 | Phillips Eng Co | Generator-absorber-heat exchange heat transfer apparatus and method and use thereof in a heat pump |
| JPH06300389A (ja) * | 1993-04-13 | 1994-10-28 | Honda Motor Co Ltd | 吸収式空気調和装置 |
| US6129973A (en) * | 1994-07-29 | 2000-10-10 | Battelle Memorial Institute | Microchannel laminated mass exchanger and method of making |
| US5611214A (en) * | 1994-07-29 | 1997-03-18 | Battelle Memorial Institute | Microcomponent sheet architecture |
| JPH09101066A (ja) * | 1995-10-03 | 1997-04-15 | Matsushita Electric Ind Co Ltd | 吸収式ヒートポンプシステム |
| DE19608824A1 (de) * | 1996-03-07 | 1997-09-18 | Inst Mikrotechnik Mainz Gmbh | Verfahren zur Herstellung von Mikrowärmetauschern |
| US5709264A (en) * | 1996-03-18 | 1998-01-20 | The Boc Group, Inc. | Heat exchanger |
| JP3716041B2 (ja) * | 1996-05-22 | 2005-11-16 | 松下電器産業株式会社 | 吸収式ヒートポンプ装置 |
| JP3858484B2 (ja) * | 1998-11-24 | 2006-12-13 | 松下電器産業株式会社 | 積層式熱交換器 |
| AU4687799A (en) * | 1998-06-19 | 2000-01-05 | Zess Technologies, Inc. | Micro-channel heat exchanger |
| EP1132694A4 (en) * | 1998-10-19 | 2009-06-03 | Ebara Corp | SOLUTION HEAT EXCHANGERS FOR ABSORPTION COOLING DEVICES |
| US6148635A (en) * | 1998-10-19 | 2000-11-21 | The Board Of Trustees Of The University Of Illinois | Active compressor vapor compression cycle integrated heat transfer device |
| US6314752B1 (en) * | 1998-12-18 | 2001-11-13 | The Ohio State University Research Foundation | Mass and heat transfer devices and methods of use |
| US6192596B1 (en) * | 1999-03-08 | 2001-02-27 | Battelle Memorial Institute | Active microchannel fluid processing unit and method of making |
| JP3932241B2 (ja) * | 1999-11-22 | 2007-06-20 | 荏原冷熱システム株式会社 | 吸収式冷凍機 |
| US6581405B2 (en) * | 2000-02-15 | 2003-06-24 | Jong Hae Kim | Airconditioning system utilizing absorption chiller cell |
| US6666909B1 (en) * | 2000-06-06 | 2003-12-23 | Battelle Memorial Institute | Microsystem capillary separations |
| US7125540B1 (en) * | 2000-06-06 | 2006-10-24 | Battelle Memorial Institute | Microsystem process networks |
| US6631624B1 (en) * | 2000-11-10 | 2003-10-14 | Rocky Research | Phase-change heat transfer coupling for aqua-ammonia absorption systems |
| US6598420B2 (en) * | 2001-06-26 | 2003-07-29 | Carrier Corporation | Heat exchanger for high stage generator of absorption chiller |
| ITMI20022309A1 (it) * | 2002-10-30 | 2004-04-30 | Robur Spa | Pompa di calore ad assorbimento reversibile aria-acqua. |
| DE10328746A1 (de) * | 2003-06-25 | 2005-01-13 | Behr Gmbh & Co. Kg | Vorrichtung zum mehrstufigen Wärmeaustausch und Verfahren zur Herstellung einer derartigen Vorrichtung |
| US7032654B2 (en) * | 2003-08-19 | 2006-04-25 | Flatplate, Inc. | Plate heat exchanger with enhanced surface features |
| US7434411B2 (en) * | 2003-12-15 | 2008-10-14 | Drost Kevin M | Droplet desorption process and system |
| KR100599382B1 (ko) * | 2004-10-11 | 2006-07-12 | 한국에너지기술연구원 | 균일가열을 위한 미세유로 가열기 |
| WO2006075163A2 (en) * | 2005-01-12 | 2006-07-20 | Chart Heat Exchangers Lp | Removable heat exchanger inserts |
| KR100727407B1 (ko) * | 2006-03-31 | 2007-06-13 | 한국생산기술연구원 | 흡착식 냉동기용 마이크로 채널의 흡착탑 |
| GB0617721D0 (en) * | 2006-09-08 | 2006-10-18 | Univ Warwick | Heat exchanger |
| US20090211977A1 (en) * | 2008-02-27 | 2009-08-27 | Oregon State University | Through-plate microchannel transfer devices |
| WO2009124155A1 (en) * | 2008-04-01 | 2009-10-08 | Battelle Memorial Institute | Methods for separating a fluid, and devices capable of separating a fluid |
| US8544294B2 (en) * | 2011-07-11 | 2013-10-01 | Palo Alto Research Center Incorporated | Plate-based adsorption chiller subassembly |
-
2009
- 2009-07-31 CN CN2009801309645A patent/CN102112837B/zh not_active Expired - Fee Related
- 2009-07-31 KR KR1020117004898A patent/KR20110074970A/ko not_active Ceased
- 2009-07-31 WO PCT/US2009/052362 patent/WO2010014878A1/en not_active Ceased
- 2009-07-31 KR KR1020167037001A patent/KR101727890B1/ko not_active Expired - Fee Related
- 2009-07-31 EP EP09803636.1A patent/EP2321605B1/en not_active Not-in-force
- 2009-07-31 JP JP2011521348A patent/JP5719296B2/ja active Active
- 2009-07-31 US US13/058,182 patent/US20110180235A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20110180235A1 (en) | 2011-07-28 |
| KR20170005164A (ko) | 2017-01-11 |
| EP2321605B1 (en) | 2018-09-12 |
| KR20110074970A (ko) | 2011-07-05 |
| EP2321605A4 (en) | 2014-12-31 |
| CN102112837A (zh) | 2011-06-29 |
| CN102112837B (zh) | 2013-05-08 |
| WO2010014878A1 (en) | 2010-02-04 |
| JP2011530059A (ja) | 2011-12-15 |
| EP2321605A1 (en) | 2011-05-18 |
| KR101727890B1 (ko) | 2017-04-18 |
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