JP5718021B2 - 電子部品用チタン銅 - Google Patents
電子部品用チタン銅 Download PDFInfo
- Publication number
- JP5718021B2 JP5718021B2 JP2010244789A JP2010244789A JP5718021B2 JP 5718021 B2 JP5718021 B2 JP 5718021B2 JP 2010244789 A JP2010244789 A JP 2010244789A JP 2010244789 A JP2010244789 A JP 2010244789A JP 5718021 B2 JP5718021 B2 JP 5718021B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- solution treatment
- ray diffraction
- copper alloy
- crystal plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 title description 23
- 239000013078 crystal Substances 0.000 claims description 62
- 238000005097 cold rolling Methods 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 34
- 238000002441 X-ray diffraction Methods 0.000 claims description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 230000032683 aging Effects 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 230000009467 reduction Effects 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000000843 powder Substances 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 12
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052726 zirconium Inorganic materials 0.000 claims description 11
- 229910052796 boron Inorganic materials 0.000 claims description 10
- 229910052748 manganese Inorganic materials 0.000 claims description 10
- 229910052750 molybdenum Inorganic materials 0.000 claims description 10
- 229910052758 niobium Inorganic materials 0.000 claims description 10
- 229910052720 vanadium Inorganic materials 0.000 claims description 10
- 229910052749 magnesium Inorganic materials 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 4
- 239000000243 solution Substances 0.000 description 54
- 239000010936 titanium Substances 0.000 description 34
- 238000005452 bending Methods 0.000 description 28
- 238000005096 rolling process Methods 0.000 description 23
- 238000007792 addition Methods 0.000 description 11
- 238000000137 annealing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000006104 solid solution Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000000265 homogenisation Methods 0.000 description 4
- 238000005098 hot rolling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000003483 aging Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 238000005482 strain hardening Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910004353 Ti-Cu Inorganic materials 0.000 description 1
- 229910010165 TiCu Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001330 spinodal decomposition reaction Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244789A JP5718021B2 (ja) | 2010-10-29 | 2010-10-29 | 電子部品用チタン銅 |
| TW100136249A TW201217550A (en) | 2010-10-29 | 2011-10-06 | containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability |
| KR1020110110857A KR20120046049A (ko) | 2010-10-29 | 2011-10-28 | 전자 부품용 티탄구리 |
| CN2011103340463A CN102465214A (zh) | 2010-10-29 | 2011-10-28 | 电子部件用钛铜 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010244789A JP5718021B2 (ja) | 2010-10-29 | 2010-10-29 | 電子部品用チタン銅 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012097305A JP2012097305A (ja) | 2012-05-24 |
| JP5718021B2 true JP5718021B2 (ja) | 2015-05-13 |
Family
ID=46069333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010244789A Active JP5718021B2 (ja) | 2010-10-29 | 2010-10-29 | 電子部品用チタン銅 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5718021B2 (ko) |
| KR (1) | KR20120046049A (ko) |
| CN (1) | CN102465214A (ko) |
| TW (1) | TW201217550A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6192917B2 (ja) * | 2012-10-25 | 2017-09-06 | Ｊｘ金属株式会社 | 高強度チタン銅 |
| JP5718436B1 (ja) | 2013-11-18 | 2015-05-13 | Jx日鉱日石金属株式会社 | 電子部品用チタン銅 |
| JP5718443B1 (ja) | 2013-12-27 | 2015-05-13 | Jx日鉱日石金属株式会社 | 電子部品用チタン銅 |
| JP6228941B2 (ja) * | 2015-01-09 | 2017-11-08 | Ｊｘ金属株式会社 | めっき層を有するチタン銅 |
| JP6650987B1 (ja) * | 2018-11-09 | 2020-02-19 | Ｊｘ金属株式会社 | チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール |
| JP6907282B2 (ja) * | 2019-09-25 | 2021-07-21 | Ｊｘ金属株式会社 | ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04221032A (ja) * | 1990-12-21 | 1992-08-11 | Nikko Kyodo Co Ltd | 高強度高熱伝導性プラスチック成形金型用銅合金およびその製造方法。 |
| JP4014542B2 (ja) * | 2002-07-18 | 2007-11-28 | 本田技研工業株式会社 | 銅合金素材の製造方法 |
| JP4193171B2 (ja) * | 2002-09-19 | 2008-12-10 | 三菱マテリアル株式会社 | 加工性に優れた含Ｔｉ銅合金板または条製造用鋳塊の製造方法 |
| US20040136861A1 (en) * | 2002-11-29 | 2004-07-15 | Nikko Metal Manufacturing Co., Ltd. | Copper alloy and producing method therefor |
| JP5084106B2 (ja) * | 2005-03-07 | 2012-11-28 | Ｄｏｗａメタニクス株式会社 | 銅チタン合金板材及びその製造方法 |
| JP4439003B2 (ja) * | 2005-03-28 | 2010-03-24 | 日鉱金属株式会社 | 強度と曲げ加工性に優れたチタン銅合金及びその製造方法 |
| CN101086044A (zh) * | 2007-07-13 | 2007-12-12 | 苏州有色金属研究院有限公司 | 一种高强高弹性Cu－Ti合金及其制造方法 |
| WO2010016429A1 (ja) * | 2008-08-05 | 2010-02-11 | 古河電気工業株式会社 | 電気・電子部品用銅合金材料 |
| JP4563480B2 (ja) * | 2008-11-28 | 2010-10-13 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造方法 |
| JP4563495B1 (ja) * | 2009-04-27 | 2010-10-13 | Ｄｏｗａメタルテック株式会社 | 銅合金板材およびその製造方法 |
| JP5479798B2 (ja) * | 2009-07-22 | 2014-04-23 | Ｄｏｗａメタルテック株式会社 | 銅合金板材、銅合金板材の製造方法、および電気電子部品 |
-
2010
- 2010-10-29 JP JP2010244789A patent/JP5718021B2/ja active Active
-
2011
- 2011-10-06 TW TW100136249A patent/TW201217550A/zh unknown
- 2011-10-28 KR KR1020110110857A patent/KR20120046049A/ko not_active Application Discontinuation
- 2011-10-28 CN CN2011103340463A patent/CN102465214A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012097305A (ja) | 2012-05-24 |
| CN102465214A (zh) | 2012-05-23 |
| KR20120046049A (ko) | 2012-05-09 |
| TW201217550A (en) | 2012-05-01 |
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