TW201217550A - containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability - Google Patents

containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability Download PDF

Info

Publication number
TW201217550A
TW201217550A TW100136249A TW100136249A TW201217550A TW 201217550 A TW201217550 A TW 201217550A TW 100136249 A TW100136249 A TW 100136249A TW 100136249 A TW100136249 A TW 100136249A TW 201217550 A TW201217550 A TW 201217550A
Authority
TW
Taiwan
Prior art keywords
copper
crystal plane
temperature
copper alloy
ray diffraction
Prior art date
Application number
TW100136249A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroyasu Horie
Naohiko Era
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of TW201217550A publication Critical patent/TW201217550A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C2202/00—Physical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW100136249A 2010-10-29 2011-10-06 containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability TW201217550A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010244789A JP5718021B2 (ja) 2010-10-29 2010-10-29 電子部品用チタン銅

Publications (1)

Publication Number Publication Date
TW201217550A true TW201217550A (en) 2012-05-01

Family

ID=46069333

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100136249A TW201217550A (en) 2010-10-29 2011-10-06 containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability

Country Status (4)

Country Link
JP (1) JP5718021B2 (ko)
KR (1) KR20120046049A (ko)
CN (1) CN102465214A (ko)
TW (1) TW201217550A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104755643A (zh) * 2012-10-25 2015-07-01 Jx日矿日石金属株式会社 高强度钛铜
US10100387B2 (en) 2013-11-18 2018-10-16 Jx Nippon Mining & Metals Corporation Copper-titanium alloy for electronic component
US10351932B2 (en) 2013-12-27 2019-07-16 Jx Nippon Mining & Metals Corporation Copper-titanium alloy for electronic component

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6228941B2 (ja) * 2015-01-09 2017-11-08 Ｊｘ金属株式会社 めっき層を有するチタン銅
JP6650987B1 (ja) * 2018-11-09 2020-02-19 Ｊｘ金属株式会社 チタン銅箔、伸銅品、電子機器部品及びオートフォーカスカメラモジュール
JP6907282B2 (ja) * 2019-09-25 2021-07-21 Ｊｘ金属株式会社 ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04221032A (ja) * 1990-12-21 1992-08-11 Nikko Kyodo Co Ltd 高強度高熱伝導性プラスチック成形金型用銅合金およびその製造方法。
JP4014542B2 (ja) * 2002-07-18 2007-11-28 本田技研工業株式会社 銅合金素材の製造方法
JP4193171B2 (ja) * 2002-09-19 2008-12-10 三菱マテリアル株式会社 加工性に優れた含Ｔｉ銅合金板または条製造用鋳塊の製造方法
US20040136861A1 (en) * 2002-11-29 2004-07-15 Nikko Metal Manufacturing Co., Ltd. Copper alloy and producing method therefor
JP5084106B2 (ja) * 2005-03-07 2012-11-28 Ｄｏｗａメタニクス株式会社 銅チタン合金板材及びその製造方法
JP4439003B2 (ja) * 2005-03-28 2010-03-24 日鉱金属株式会社 強度と曲げ加工性に優れたチタン銅合金及びその製造方法
CN101086044A (zh) * 2007-07-13 2007-12-12 苏州有色金属研究院有限公司 一种高强高弹性Cu－Ti合金及其制造方法
WO2010016429A1 (ja) * 2008-08-05 2010-02-11 古河電気工業株式会社 電気・電子部品用銅合金材料
JP4563480B2 (ja) * 2008-11-28 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP4563495B1 (ja) * 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5479798B2 (ja) * 2009-07-22 2014-04-23 Ｄｏｗａメタルテック株式会社 銅合金板材、銅合金板材の製造方法、および電気電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104755643A (zh) * 2012-10-25 2015-07-01 Jx日矿日石金属株式会社 高强度钛铜
US10100387B2 (en) 2013-11-18 2018-10-16 Jx Nippon Mining & Metals Corporation Copper-titanium alloy for electronic component
US10351932B2 (en) 2013-12-27 2019-07-16 Jx Nippon Mining & Metals Corporation Copper-titanium alloy for electronic component

Also Published As

Publication number Publication date
JP2012097305A (ja) 2012-05-24
JP5718021B2 (ja) 2015-05-13
CN102465214A (zh) 2012-05-23
KR20120046049A (ko) 2012-05-09

Similar Documents

Publication Publication Date Title
JP4171735B2 (ja) クロム含有銅合金の製造方法、クロム含有銅合金および伸銅品
JP5490439B2 (ja) 電子部品用チタン銅の製造方法
JP5319590B2 (ja) 銅合金、銅合金の製造方法及び電子部品の製造方法
JP5226057B2 (ja) 銅合金、伸銅品、電子部品及びコネクタ
JP5611773B2 (ja) 銅合金及びこれを用いた伸銅品、電子部品及びコネクタ及び銅合金の製造方法
JP5657311B2 (ja) 銅合金板材およびその製造方法
JP5226056B2 (ja) 銅合金、伸銅品、電子部品及びコネクタ
WO2007015549A1 (ja) 電子部品用高強度銅合金及び電子部品
CN102639731A (zh) 电子部件用钛铜
TW200918678A (en) Cu-ni-si-co copper alloy for electronic materials and methodfor manufacturing same
JP2009263784A (ja) 導電性ばね材に用いられるＣｕ−Ｎｉ−Ｓｉ系合金
TW201217550A (en) containing 2.0-4.0 mass% of Ti, 0.01-0.15 wt% of one or more of Fe, Co, Ni, Cr, V, Nb, Mo, Mn, Zr, Si, Mg, B and P in total and the remainder containing Cu and unavoidable impurities, and having excellent strength and bendability
JP2009242895A (ja) 曲げ加工性に優れた高強度銅合金
JP5297855B2 (ja) 銅合金板材およびその製造方法
TW201209181A (en) Copper-cobalt-silicon alloy for electrode material
JP2009007625A (ja) 電気・電子部品用高強度銅合金の製造方法
JP5628712B2 (ja) 電子部品用チタン銅
JP4166196B2 (ja) 曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP5378286B2 (ja) チタン銅及びその製造方法
JP2006097113A (ja) 析出硬化型銅合金の製造方法、析出硬化型銅合金及び伸銅品
JPH09316569A (ja) リードフレーム用銅合金及びその製造法
JP2017155334A (ja) 熱間成形用アルミニウム合金板及びその製造方法
JP2011038151A (ja) 銅合金材およびその製造方法
JP2012052178A (ja) 室温での強度及び延性に優れたチタン合金
JP2013204138A (ja) チタン銅及びその製造方法