JP5712658B2 - ポジ型感光性樹脂組成物 - Google Patents

ポジ型感光性樹脂組成物 Download PDF

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Publication number
JP5712658B2
JP5712658B2 JP2011031615A JP2011031615A JP5712658B2 JP 5712658 B2 JP5712658 B2 JP 5712658B2 JP 2011031615 A JP2011031615 A JP 2011031615A JP 2011031615 A JP2011031615 A JP 2011031615A JP 5712658 B2 JP5712658 B2 JP 5712658B2
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compound
acid
photosensitive resin
benzene
toluene
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Japanese (ja)
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JP2012168487A5 (https=
JP2012168487A (ja
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真治 有本
真治 有本
三好　一登
一登 三好
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Toray Industries Inc
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Toray Industries Inc
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  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
JP2011031615A 2011-02-17 2011-02-17 ポジ型感光性樹脂組成物 Active JP5712658B2 (ja)

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JP2011031615A JP5712658B2 (ja) 2011-02-17 2011-02-17 ポジ型感光性樹脂組成物

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JP2011031615A JP5712658B2 (ja) 2011-02-17 2011-02-17 ポジ型感光性樹脂組成物

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JP2012168487A JP2012168487A (ja) 2012-09-06
JP2012168487A5 JP2012168487A5 (https=) 2014-04-03
JP5712658B2 true JP5712658B2 (ja) 2015-05-07

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5798978B2 (ja) * 2012-05-17 2015-10-21 富士フイルム株式会社 着色感放射線性組成物、これを用いたカラーフィルタ
JP2016004929A (ja) * 2014-06-18 2016-01-12 東レ株式会社 犠牲層用樹脂組成物およびそれを用いた半導体装置の製造方法
JP6623132B2 (ja) * 2016-08-31 2019-12-18 富士フイルム株式会社 仮接着用組成物、硬化膜および半導体素子の製造方法
KR102275345B1 (ko) * 2018-05-16 2021-07-09 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2614527B2 (ja) * 1990-03-29 1997-05-28 株式会社巴川製紙所 ポジ型感光性ポリアミドイミド樹脂の製造法
JPH0827098A (ja) * 1994-07-12 1996-01-30 Mitsubishi Chem Corp スルホニルクロライド基を有するキノンジアジド化合物の製造方法
JP4834246B2 (ja) * 2001-07-13 2011-12-14 Ａｚエレクトロニックマテリアルズ株式会社 感光性ポリアミド及び組成物
JP2003321438A (ja) * 2002-05-09 2003-11-11 Wako Pure Chem Ind Ltd ハロスルホニル基含有キノンジアジド化合物の製造法
JP2007246440A (ja) * 2006-03-16 2007-09-27 Toray Ind Inc ジアミン化合物およびそれを用いたアルカリ可溶性樹脂、感光性樹脂組成物

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