JP5690727B2 - 銅層のガルバニック堆積のための無シアン化物電解質組成物 - Google Patents

銅層のガルバニック堆積のための無シアン化物電解質組成物 Download PDF

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JP5690727B2
JP5690727B2 JP2011518879A JP2011518879A JP5690727B2 JP 5690727 B2 JP5690727 B2 JP 5690727B2 JP 2011518879 A JP2011518879 A JP 2011518879A JP 2011518879 A JP2011518879 A JP 2011518879A JP 5690727 B2 JP5690727 B2 JP 5690727B2
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acid
electrolyte composition
copper
composition according
complexing agent
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JP2011528406A (ja
JP2011528406A5 (https=
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シェーファー，ステファン
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エンソン インコーポレイテッド
エンソン インコーポレイテッド
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2011518879A 2008-07-15 2009-07-15 銅層のガルバニック堆積のための無シアン化物電解質組成物 Active JP5690727B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008033174.0 2008-07-15
DE200810033174 DE102008033174B3 (de) 2008-07-15 2008-07-15 Cyanidfreie Elektrolytzusammensetzung zur galvanischen Abscheidung einer Kupferschicht und Verfahren zur Abscheidung einer kupferhaltigen Schicht
PCT/US2009/050683 WO2010009225A1 (en) 2008-07-15 2009-07-15 Cyanide free electrolyte composition for the galvanic deposition of a copper layer

Publications (3)

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JP2011528406A JP2011528406A (ja) 2011-11-17
JP2011528406A5 JP2011528406A5 (https=) 2012-08-30
JP5690727B2 true JP5690727B2 (ja) 2015-03-25

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JP2011518879A Active JP5690727B2 (ja) 2008-07-15 2009-07-15 銅層のガルバニック堆積のための無シアン化物電解質組成物

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US (1) US8808525B2 (https=)
EP (1) EP2329062B1 (https=)
JP (1) JP5690727B2 (https=)
KR (1) KR101624759B1 (https=)
CN (1) CN102159752B (https=)
DE (1) DE102008033174B3 (https=)
WO (1) WO2010009225A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2620529T3 (pl) * 2012-01-25 2014-09-30 Atotech Deutschland Gmbh Sposób wytwarzania matowych warstw miedzianych
CL2012003726A1 (es) * 2012-12-28 2013-02-01 Quiborax Sa Uso de acidos debiles oxigenados o polioxigenados, minerales o compuestos que los generen en la electrodepositacion de cobre; procedimiento de electro obtencion que comprende adicionar dicho acido debil, o un compuesto o un mineral que lo genere al proceso de electrodepositacion de cobre.
CN103014789B (zh) * 2013-01-14 2015-11-04 厦门大学 一种碱性无氰镀铜阳极溶解促进剂
SG11201604646TA (en) * 2013-12-09 2016-07-28 Aveni Copper electrodeposition bath containing an electrochemically inert cation
CN104711648B (zh) * 2013-12-17 2019-08-16 Ykk株式会社 闪镀铜镀敷液
CN105951138B (zh) * 2016-06-15 2018-03-30 苏州禾川化学技术服务有限公司 一种环保碱铜电镀液及其电镀方法
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
CN110158129B (zh) * 2019-05-27 2020-06-05 广州三孚新材料科技股份有限公司 预渗透剂组合物、预渗透剂、镀铜预处理方法和无氰镀铜方法
CN114293232B (zh) * 2021-12-02 2023-03-17 北京科技大学 一种电铸制备钨弥散强化铜复合材料的方法
JP7436071B1 (ja) 2022-11-25 2024-02-21 株式会社シミズ 非シアン真鍮めっき浴およびめっき方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2700019A (en) 1951-07-05 1955-01-18 Westinghouse Electric Corp Acid copper plating
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating
US3475292A (en) * 1966-02-10 1969-10-28 Technic Gold plating bath and process
JPS5672196A (en) * 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
JPS57193095A (en) * 1981-05-25 1982-11-27 Furukawa Circuit Foil Copper foil for printed circuit and method of producing same
JPH04293792A (ja) * 1991-03-22 1992-10-19 Kawasaki Steel Corp ステンレス鋼帯の脱スケール方法
US5750018A (en) * 1997-03-18 1998-05-12 Learonal, Inc. Cyanide-free monovalent copper electroplating solutions
WO1998045505A1 (fr) * 1997-04-07 1998-10-15 Okuno Chemical Industries Co., Ltd. Procede d'electrodeposition de produit moule en plastique, non conducteur
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
AU2002239767A1 (en) * 2000-11-15 2002-06-11 Intel Corporation Copper alloy interconnections for integrated circuits and methods of making same
US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
US6511589B1 (en) 2001-08-17 2003-01-28 Electroplating Engineers Of Japan Limited Gold plating solution and gold plating method using thereof
US20030155247A1 (en) * 2002-02-19 2003-08-21 Shipley Company, L.L.C. Process for electroplating silicon wafers
JP2007262430A (ja) * 2006-03-27 2007-10-11 C Uyemura & Co Ltd 電気めっき方法
TWI348499B (en) * 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples

Also Published As

Publication number Publication date
WO2010009225A1 (en) 2010-01-21
JP2011528406A (ja) 2011-11-17
CN102159752A (zh) 2011-08-17
EP2329062B1 (en) 2013-05-29
KR20110039460A (ko) 2011-04-18
US8808525B2 (en) 2014-08-19
US20110180415A1 (en) 2011-07-28
CN102159752B (zh) 2013-01-16
KR101624759B1 (ko) 2016-06-07
DE102008033174B3 (de) 2009-09-17
EP2329062A1 (en) 2011-06-08

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