JP5686737B2 - 二ホウ化マグネシウム - Google Patents
二ホウ化マグネシウム Download PDFInfo
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- JP5686737B2 JP5686737B2 JP2011535953A JP2011535953A JP5686737B2 JP 5686737 B2 JP5686737 B2 JP 5686737B2 JP 2011535953 A JP2011535953 A JP 2011535953A JP 2011535953 A JP2011535953 A JP 2011535953A JP 5686737 B2 JP5686737 B2 JP 5686737B2
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- magnesium
- diboride
- borohydride
- magnesium diboride
- wire
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- PZKRHHZKOQZHIO-UHFFFAOYSA-N [B].[B].[Mg] Chemical compound [B].[B].[Mg] PZKRHHZKOQZHIO-UHFFFAOYSA-N 0.000 title claims description 80
- 239000011777 magnesium Substances 0.000 claims description 116
- 229910052749 magnesium Inorganic materials 0.000 claims description 81
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 74
- 238000000034 method Methods 0.000 claims description 38
- 239000012535 impurity Substances 0.000 claims description 25
- -1 Alkyl magnesium Chemical compound 0.000 claims description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 18
- 229910052760 oxygen Inorganic materials 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 238000000197 pyrolysis Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 16
- 239000002904 solvent Substances 0.000 claims description 16
- 239000007789 gas Substances 0.000 claims description 15
- 229910012375 magnesium hydride Inorganic materials 0.000 claims description 13
- 239000006227 byproduct Substances 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 7
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 238000005491 wire drawing Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000010 aprotic solvent Substances 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000006104 solid solution Substances 0.000 claims description 3
- 230000002378 acidificating effect Effects 0.000 claims 2
- 238000000634 powder X-ray diffraction Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 description 24
- 229910052796 boron Inorganic materials 0.000 description 19
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 18
- 239000000843 powder Substances 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- 239000000395 magnesium oxide Substances 0.000 description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 7
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 239000000543 intermediate Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000012454 non-polar solvent Substances 0.000 description 4
- 238000005979 thermal decomposition reaction Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002887 superconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 229910052810 boron oxide Inorganic materials 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005551 mechanical alloying Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000005649 metathesis reaction Methods 0.000 description 2
- UIUXUFNYAYAMOE-UHFFFAOYSA-N methylsilane Chemical class [SiH3]C UIUXUFNYAYAMOE-UHFFFAOYSA-N 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ODHFJIDDBSDWNU-UHFFFAOYSA-N CCCC[Mg]CCCC Chemical compound CCCC[Mg]CCCC ODHFJIDDBSDWNU-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000012448 Lithium borohydride Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000004703 alkoxides Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000002902 bimodal effect Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- VEWFZHAHZPVQES-UHFFFAOYSA-N boron;n,n-diethylethanamine Chemical compound [B].CCN(CC)CC VEWFZHAHZPVQES-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- UTUAUBOPWUPBCH-UHFFFAOYSA-N dimethylsilylidene(dimethyl)silane Chemical compound C[Si](C)=[Si](C)C UTUAUBOPWUPBCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B35/00—Boron; Compounds thereof
- C01B35/02—Boron; Borides
- C01B35/04—Metal borides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0856—Manufacture or treatment of devices comprising metal borides, e.g. MgB2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49014—Superconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
本発明の課題は、粉末充填ワイヤにおける超伝導材料として、または二ホウ化マグネシウム焼結体として使用することができる特定の品質の二ホウ化マグネシウム(MgB2)を提供することである。二ホウ化マグネシウムからなる部材またはワイヤの達成可能な電流容量は、高い磁界が印加された場合でも可能である程度の大きさでなくてはならない。さらに、得られた二ホウ化マグネシウムの達成可能な焼結活性は、すでに低い温度でも可能である程度であるべきである。さらに、ドーピング剤は簡単な方法で二ホウ化マグネシウムへ導入することができるべきである。Si化合物およびC化合物によるドーピングの場合、ドーピング剤はできる限り微細にMgB2中に分散していて、いわゆる「固溶体」が存在しているべきである。
従来技術において入手可能なMgB2品質は、これらの要求を満たしていない。超伝導二ホウ化マグネシウムワイヤを製造する際の問題は、二ホウ化マグネシウム中の酸素含有率である。二ホウ化マグネシウムは、酸素および湿分に敏感である。しかしこの化合物の化学的性質に存在する二ホウ化マグネシウムの不利な物質特性は、完成した充填ワイヤ自体では欠点とはならない。というのも、ワイヤの充填材料は、空気の遮断下に存在するからである。たとえ元素のマグネシウムおよびホウ素から二ホウ化マグネシウムを製造する際に、細心の注意を払うことができ、空気および湿分との接触を回避することができるとしても、材料中のマグネシウムおよびホウ素の酸素親和性は維持されたままである、つまり最初から元素中に存在する酸素割合は完成品中にも見られる。酸素不含の元素のマグネシウムは、製造することができないか、または製造および貯蔵に多大なコストがかかり、元素のホウ素に関しては、なおさらである。
3MgR2 + 4B2H6 → 2BR3 + 3Mg(BH4)2 (1)
3Mg(OR)2 + 4B2H6 → 2B(OR)3 + 3Mg(BH4)2 (2)
MgH2 + B2H6 → Mg(BH4)2 (3)
Mg(BH4)2 → MgB2 + 4H2 (4)
に従って進行する。
マグネシウム原子に配位しているドナー溶剤は、アルゴン流中、すでに50〜250℃の温度で放出される。しかし、水素化ホウ素マグネシウムはこの温度で分解に対して安定している。従ってこの意味で、水素化ホウ素マグネシウムとドナー溶剤とからなる付加物は、250℃を超えたときに初めて開始される水素化ホウ素マグネシウムの分解の際に障害となるという欠点を有していない。
Claims (8)
- 非晶質または部分結晶質の二ホウ化マグネシウムにおいて、X線粉末回折法により測定して、最大で25質量%の結晶質割合を有し、かつ最大で2000ppmの酸素含有率を有することを特徴とする、非晶質または部分結晶質の二ホウ化マグネシウム。
- 15μm以下の単峰性の粒径分布D100を有することを特徴とする、請求項1記載の二ホウ化マグネシウム。
- a1)アルキルマグネシウム(MgR2)もしくはマグネシウムアルコキシド(Mg(OR)2)(式中、基Rは、1〜5個の炭素原子を有するアルキル基を表す)およびジボラン(B2H6)を無極性溶剤中で水素化ホウ素マグネシウム(Mg(BH4)2)へと反応させ、かつ酸化物の不純物ならびに副生成物を分離するか、または
a2)水素化マグネシウム(MgH2)およびジボラン(B2H6)を双極性非プロトン性溶剤中で水素化ホウ素マグネシウム(Mg(BH 4 )2)へと反応させ、かつ酸化物の不純物を分離し、かつ
b)水素化ホウ素マグネシウムを標準圧力および250℃〜1600℃の温度で保護ガス雰囲気下に分解して二ホウ化マグネシウムを得る
請求項1または2記載の二ホウ化マグネシウムの製造方法。 - 工程(a1)または(a2)において得られた水素化ホウ素マグネシウムを双極性非プロトン性溶剤中で再結晶化する、請求項3記載の方法。
- 工程(b)において保護ガスに、熱分解の際に固溶体の形で炭素もしくはケイ素による二ホウ化マグネシウムのドーピングを生じる気体を添加する、請求項3または4記載の方法。
- 超伝導材料のための請求項1または2記載の二ホウ化マグネシウムの使用。
- 金属シェルと、二ホウ化マグネシウムからなるコアとを有する超伝導ワイヤの製造方法であって、請求項1または2記載の二ホウ化マグネシウムを準備し、金属シェル中に封入し、かつ引き続きワイヤ線引き加工により、金属シェルと、二ホウ化マグネシウムからなるコアとを有するワイヤが得られる方法。
- 請求項7に記載の方法であって、
a1)アルキルマグネシウム(MgR2)もしくはマグネシウムアルコキシド(Mg(OR)2)(式中、基Rは、1〜5個の炭素原子を有するアルキル基を表す)およびジボラン(B2H6)を無極性溶剤中で水素化ホウ素マグネシウム(Mg(BH4)2)へと反応させ、かつ酸化物の不純物ならびに副生成物を分離するか、または
a2)水素化マグネシウム(MgH2)およびジボラン(B2H6)を双極性非プロトン性溶剤中で、水素化ホウ素マグネシウム(Mg(BH4)2)へと反応させ、かつ酸化物の不純物を分離し、かつ
b)得られた水素化ホウ素マグネシウムを標準圧力および250℃〜1600℃の温度で保護ガス雰囲気下に分解して二ホウ化マグネシウムが得られ、
c)得られた二ホウ化マグネシウムを金属シェル中に封入し、かつ
d)ワイヤ線引き加工により金属シェルと、二ホウ化マグネシウムからなるコアとを有するワイヤが得られる
方法。
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DE102008056824A DE102008056824A1 (de) | 2008-11-11 | 2008-11-11 | Anorganische Verbindungen |
PCT/EP2009/063641 WO2010054914A1 (de) | 2008-11-11 | 2009-10-19 | Magnesiumdiborid |
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GB2498565B (en) * | 2012-01-20 | 2014-09-17 | Siemens Plc | Methods for forming joints between magnesium diboride conductors |
CN103021562A (zh) * | 2012-11-30 | 2013-04-03 | 江苏威纳德照明科技有限公司 | 一种高性能超导线的制备方法 |
CN102963900A (zh) * | 2012-11-30 | 2013-03-13 | 江苏威纳德照明科技有限公司 | 一种MgB2的制造方法 |
CN102992772A (zh) * | 2012-11-30 | 2013-03-27 | 江苏威纳德照明科技有限公司 | 一种MgB2超导导线的制备方法 |
CN102963901A (zh) * | 2012-11-30 | 2013-03-13 | 江苏威纳德照明科技有限公司 | 一种高纯度二硼化镁的制造方法 |
PL405397A1 (pl) | 2013-09-19 | 2015-03-30 | Uniwersytet Warszawski | Sposób syntezy niesolwatowanych borowodorków podwójnych |
KR102114423B1 (ko) * | 2018-02-06 | 2020-05-25 | 한국기계연구원 | 이붕소마그네슘을 포함하는 초전도체 및 이의 제조방법 |
CN108930027B (zh) * | 2018-06-22 | 2020-09-01 | 无锡众创未来科技应用有限公司 | 超导电缆用二硼化镁超导薄膜的制备方法 |
CN111646429B (zh) * | 2020-07-04 | 2022-03-18 | 上海镁源动力科技有限公司 | 基于镁的放氢材料、其制备方法及水解制氢的方法 |
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US2930674A (en) * | 1957-11-15 | 1960-03-29 | Olin Mathieson | Preparation of magnesium borohydride |
US2930675A (en) * | 1957-11-15 | 1960-03-29 | Olin Mathieson | Preparation of magnesium borohydride |
JP2560028B2 (ja) * | 1987-05-07 | 1996-12-04 | 新技術事業団 | ホウ化チタンの製造方法 |
US20040204321A1 (en) * | 2001-03-12 | 2004-10-14 | Andreas Gumbel | Mgb2 based powder for the production of super conductOrs, method for the use and production thereof |
JP4033375B2 (ja) * | 2001-10-15 | 2008-01-16 | 学校法人東海大学 | MgB2系超伝導体及びその製造方法 |
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JP4048270B2 (ja) * | 2002-02-25 | 2008-02-20 | 独立行政法人物質・材料研究機構 | MgB2超伝導膜状体とその製造方法 |
US6511943B1 (en) * | 2002-03-13 | 2003-01-28 | The Regents Of The University Of California | Synthesis of magnesium diboride by magnesium vapor infiltration process (MVIP) |
DE102004014315A1 (de) | 2003-10-01 | 2005-05-12 | Dronco Ag | Verfahren zur Herstellung von kristallinem Metallborid und kristallines Metallborid |
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US20060093861A1 (en) * | 2004-10-29 | 2006-05-04 | The Penn State Research Foundation | Method for producing doped, alloyed, and mixed-phase magnesium boride films |
DE102006017435B4 (de) | 2006-04-07 | 2008-04-17 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Pulver für die Herstellung von MgB2-Supraleitern und Verfahren zur Herstellung dieser Pulver |
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US20080236869A1 (en) * | 2007-03-30 | 2008-10-02 | General Electric Company | Low resistivity joints for joining wires and methods for making the same |
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