JP5675847B2 - ウエハー洗浄装備用カセットジグ及びこれを備えたカセットアセンブリ - Google Patents
ウエハー洗浄装備用カセットジグ及びこれを備えたカセットアセンブリ Download PDFInfo
- Publication number
- JP5675847B2 JP5675847B2 JP2012549918A JP2012549918A JP5675847B2 JP 5675847 B2 JP5675847 B2 JP 5675847B2 JP 2012549918 A JP2012549918 A JP 2012549918A JP 2012549918 A JP2012549918 A JP 2012549918A JP 5675847 B2 JP5675847 B2 JP 5675847B2
- Authority
- JP
- Japan
- Prior art keywords
- cassette
- wafer
- jig
- cleaning equipment
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims description 40
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 71
- 238000012546 transfer Methods 0.000 description 6
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (4)
- ウエハー洗浄装備に使われるカセットにおいて、
第1ウエハーが投入可能な内部空間が形成されて第1ウエハーの積載機能を有するジグ本体と、
上記ジグ本体内に装着され、上記第1ウエハーに比べて相対的に直径が小さい第2ウエハーが投入可能な内部空間が形成されて第2ウエハーの積載機能を有するカセットの挿入をガイドするガイド部材と、を含み、
上記ガイド部材は、上記ジグ本体の一端で上記ジグ本体の幅方向に相互対向する内側コーナー部に装着されたブロックであり、上記コーナー部に対応して曲がった形態のボディーと、上記カセットの外側コーナー部の挿入をガイドするガイド溝とを備えることを特徴とするウエハー洗浄装備用カセットジグ。 - 荷重減少のために上記ジグ本体の側面には、少なくとも1つ以上の切開孔が形成されたことを特徴とする、請求項1に記載のウエハー洗浄装備用カセットジグ。
- ウエハー洗浄装備に使われるカセットにおいて、
第1ウエハーが投入可能な内部空間が形成されて第1ウエハーの積載機能を有するジグ本体と、上記ジグ本体の一端で上記ジグ本体の幅方向に相互対向する内側コーナー部に装着された一対のガイド部材と、を含むカセットジグ、及び
上記第1ウエハーに比べて相対的に直径が小さい第2ウエハーが投入可能な内部空間が形成されて第2ウエハーの積載機能を有し、上記ガイド部材によってガイドされ上記カセットジグ内に挿入されるカセットユニットを備え、
上記ガイド部材は、上記ジグ本体の一端で上記ジグ本体の幅方向に相互対向する内側コーナー部に装着されたブロックであり、上記コーナー部に対応して曲がった形態のボディーと、上記カセットユニットの外側コーナー部の挿入をガイドするガイド溝とを備えることを特徴とする、ウエハー洗浄装備用カセットアセンブリ。 - 上記ジグ本体及びカセットユニットのうち少なくとも何れか一つには、荷重減少のために側面に少なくとも1つ以上の切開孔が形成されたことを特徴とする、請求項3に記載のウエハー洗浄装備用カセットアセンブリ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100006096A KR101150850B1 (ko) | 2010-01-22 | 2010-01-22 | 웨이퍼 세정장비용 카세트 지그 및 이를 구비한 카세트 어셈블리 |
KR10-2010-0006096 | 2010-01-22 | ||
PCT/KR2010/004619 WO2011090242A1 (en) | 2010-01-22 | 2010-07-15 | Cassette jig for wafer cleaning apparatus and cassette assembly having the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013518404A JP2013518404A (ja) | 2013-05-20 |
JP5675847B2 true JP5675847B2 (ja) | 2015-02-25 |
Family
ID=44307039
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012549918A Expired - Fee Related JP5675847B2 (ja) | 2010-01-22 | 2010-07-15 | ウエハー洗浄装備用カセットジグ及びこれを備えたカセットアセンブリ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130001846A1 (ja) |
EP (1) | EP2526564A4 (ja) |
JP (1) | JP5675847B2 (ja) |
KR (1) | KR101150850B1 (ja) |
CN (1) | CN102834908B (ja) |
WO (1) | WO2011090242A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103346115B (zh) * | 2013-05-09 | 2016-08-24 | 北京市塑料研究所 | 硅片承载器卡具 |
CN104299937B (zh) * | 2013-07-15 | 2017-11-21 | 北大方正集团有限公司 | 一种应用于硅腐蚀的固定装置 |
CN108010870A (zh) * | 2017-11-28 | 2018-05-08 | 北京创昱科技有限公司 | 衬底加工设备和衬底加工方法 |
JP6995027B2 (ja) * | 2018-08-17 | 2022-02-04 | 三菱電機株式会社 | ウエハカセット |
Family Cites Families (34)
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US3640398A (en) * | 1970-03-30 | 1972-02-08 | Edward J Mellen Jr | Wafer boat |
JPS60156561U (ja) * | 1984-03-29 | 1985-10-18 | ホ−ヤ株式会社 | 洗浄用治具 |
US5246218A (en) * | 1992-09-25 | 1993-09-21 | Intel Corporation | Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment |
JPH06232244A (ja) * | 1993-01-29 | 1994-08-19 | Komatsu Electron Metals Co Ltd | 半導体ウエハ熱処理方法および熱処理用ボ−トならびにカセットボ−ト |
US5570987A (en) * | 1993-12-14 | 1996-11-05 | W. L. Gore & Associates, Inc. | Semiconductor wafer transport container |
DE59611078D1 (de) * | 1995-03-28 | 2004-10-14 | Brooks Automation Gmbh | Be- und Entladestation für Halbleiterbearbeitungsanlagen |
US5605574A (en) * | 1995-09-20 | 1997-02-25 | Kabushiki Kaisha Toshiba | Semiconductor wafer support apparatus and method |
JPH0992708A (ja) * | 1995-09-27 | 1997-04-04 | Shin Etsu Handotai Co Ltd | ウエーハキャリアの係止治具 |
DE19637875C2 (de) * | 1996-04-17 | 1999-07-22 | Steag Micro Tech Gmbh | Anlage zur Naßbehandlung von Substraten |
US6039186A (en) * | 1997-04-16 | 2000-03-21 | Fluoroware, Inc. | Composite transport carrier |
US6736268B2 (en) * | 1997-07-11 | 2004-05-18 | Entegris, Inc. | Transport module |
US6110011A (en) * | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
US6871741B2 (en) * | 1998-05-28 | 2005-03-29 | Entegris, Inc. | Composite substrate carrier |
JPH11354625A (ja) * | 1998-06-10 | 1999-12-24 | Nikon Corp | 基板カセット |
US6095335A (en) * | 1998-07-10 | 2000-08-01 | H-Square Corporation | Wafer support device having a retrofit to provide size convertibility |
JP3916342B2 (ja) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | 基板収納容器 |
USD436490S1 (en) * | 1999-06-10 | 2001-01-23 | Kwok's Brother Manufacturing Limited | Rack for compact disks |
US6413356B1 (en) * | 2000-05-02 | 2002-07-02 | Applied Materials, Inc. | Substrate loader for a semiconductor processing system |
EP1214734B1 (en) * | 2000-06-15 | 2006-09-27 | Koninklijke Philips Electronics N.V. | Holder for a substrate cassette and device provided with such a holder |
US6450346B1 (en) * | 2000-06-30 | 2002-09-17 | Integrated Materials, Inc. | Silicon fixtures for supporting wafers during thermal processing |
US6632068B2 (en) * | 2000-09-27 | 2003-10-14 | Asm International N.V. | Wafer handling system |
JP2002231802A (ja) * | 2001-01-31 | 2002-08-16 | Takehide Hayashi | 互換性を備えたウェハー搬送容器 |
JP3924714B2 (ja) * | 2001-12-27 | 2007-06-06 | 東京エレクトロン株式会社 | ウエハカセット |
US7121414B2 (en) * | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
KR100606964B1 (ko) * | 2001-12-29 | 2006-08-01 | 엘지.필립스 엘시디 주식회사 | 기판 휨 조절용 지그 |
JP4218260B2 (ja) * | 2002-06-06 | 2009-02-04 | 東京エレクトロン株式会社 | 被処理体の収納容器体及びこれを用いた処理システム |
WO2004003995A1 (ja) * | 2002-06-27 | 2004-01-08 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
US6955197B2 (en) * | 2002-08-31 | 2005-10-18 | Applied Materials, Inc. | Substrate carrier having door latching and substrate clamping mechanisms |
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WO2008126208A1 (ja) * | 2007-03-27 | 2008-10-23 | Fujitsu Limited | 製造システム、カセット、および装着カセット |
KR20090076453A (ko) * | 2008-01-09 | 2009-07-13 | 주식회사 실트론 | 웨이퍼 카세트 |
JP2010073823A (ja) * | 2008-09-17 | 2010-04-02 | Tokyo Electron Ltd | 成膜装置、成膜方法、及びコンピュータ可読記憶媒体 |
US8888085B2 (en) * | 2010-10-05 | 2014-11-18 | Skyworks Solutions, Inc. | Devices and methodologies for handling wafers |
US8403315B2 (en) * | 2011-03-31 | 2013-03-26 | Alta Devices, Inc. | Film transfer frame |
-
2010
- 2010-01-22 KR KR1020100006096A patent/KR101150850B1/ko active IP Right Grant
- 2010-07-15 JP JP2012549918A patent/JP5675847B2/ja not_active Expired - Fee Related
- 2010-07-15 US US13/574,453 patent/US20130001846A1/en not_active Abandoned
- 2010-07-15 EP EP10844038.9A patent/EP2526564A4/en not_active Withdrawn
- 2010-07-15 CN CN201080065637.9A patent/CN102834908B/zh not_active Expired - Fee Related
- 2010-07-15 WO PCT/KR2010/004619 patent/WO2011090242A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2013518404A (ja) | 2013-05-20 |
CN102834908A (zh) | 2012-12-19 |
US20130001846A1 (en) | 2013-01-03 |
CN102834908B (zh) | 2015-07-08 |
EP2526564A1 (en) | 2012-11-28 |
WO2011090242A1 (en) | 2011-07-28 |
KR101150850B1 (ko) | 2012-06-13 |
KR20110086386A (ko) | 2011-07-28 |
EP2526564A4 (en) | 2014-01-01 |
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