CN109545714A - 晶圆清洗装置及其工作方法 - Google Patents
晶圆清洗装置及其工作方法 Download PDFInfo
- Publication number
- CN109545714A CN109545714A CN201811391846.7A CN201811391846A CN109545714A CN 109545714 A CN109545714 A CN 109545714A CN 201811391846 A CN201811391846 A CN 201811391846A CN 109545714 A CN109545714 A CN 109545714A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- wafer
- chamber
- box body
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 236
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000001035 drying Methods 0.000 claims description 58
- 239000007921 spray Substances 0.000 claims description 27
- 239000000243 solution Substances 0.000 claims description 15
- 230000001360 synchronised effect Effects 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000006210 lotion Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 230000003749 cleanliness Effects 0.000 abstract description 28
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811391846.7A CN109545714B (zh) | 2018-11-21 | 2018-11-21 | 晶圆清洗装置及其工作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811391846.7A CN109545714B (zh) | 2018-11-21 | 2018-11-21 | 晶圆清洗装置及其工作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109545714A true CN109545714A (zh) | 2019-03-29 |
CN109545714B CN109545714B (zh) | 2021-01-22 |
Family
ID=65849062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811391846.7A Active CN109545714B (zh) | 2018-11-21 | 2018-11-21 | 晶圆清洗装置及其工作方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109545714B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112864066A (zh) * | 2020-12-31 | 2021-05-28 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备推拉式晶圆盒装载输送系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077987A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | 基板保持ステージ清掃装置およびその清掃方法 |
CN1802222A (zh) * | 2003-04-10 | 2006-07-12 | 安堤格里斯公司 | 晶片承载器清洗系统 |
CN103620757A (zh) * | 2011-06-23 | 2014-03-05 | 动力微系统公司 | 清洁系统和方法 |
CN107665832A (zh) * | 2016-07-27 | 2018-02-06 | 上海新昇半导体科技有限公司 | 晶盒清洗设备 |
-
2018
- 2018-11-21 CN CN201811391846.7A patent/CN109545714B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003077987A (ja) * | 2001-09-06 | 2003-03-14 | Sony Corp | 基板保持ステージ清掃装置およびその清掃方法 |
CN1802222A (zh) * | 2003-04-10 | 2006-07-12 | 安堤格里斯公司 | 晶片承载器清洗系统 |
CN103620757A (zh) * | 2011-06-23 | 2014-03-05 | 动力微系统公司 | 清洁系统和方法 |
CN107665832A (zh) * | 2016-07-27 | 2018-02-06 | 上海新昇半导体科技有限公司 | 晶盒清洗设备 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112864066A (zh) * | 2020-12-31 | 2021-05-28 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备推拉式晶圆盒装载输送系统 |
CN112864066B (zh) * | 2020-12-31 | 2022-06-10 | 至微半导体(上海)有限公司 | 一种晶圆清洗设备推拉式晶圆盒装载输送系统 |
Also Published As
Publication number | Publication date |
---|---|
CN109545714B (zh) | 2021-01-22 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230719 Address after: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee after: Huaian Xide Industrial Design Co.,Ltd. Address before: No. 599, East Changjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: HUAIAN IMAGING DEVICE MANUFACTURER Corp. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240710 Address after: Room 1903, Building 3, Qingshanwan Garden, No. 160 Jianping North Road, Tianning District, Changzhou City, Jiangsu Province, China 213000 Patentee after: Hong Mei Country or region after: China Address before: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province Patentee before: Huaian Xide Industrial Design Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |