CN106449477A - 晶圆片的清洗烘干系统 - Google Patents

晶圆片的清洗烘干系统 Download PDF

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Publication number
CN106449477A
CN106449477A CN201610867121.5A CN201610867121A CN106449477A CN 106449477 A CN106449477 A CN 106449477A CN 201610867121 A CN201610867121 A CN 201610867121A CN 106449477 A CN106449477 A CN 106449477A
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Prior art keywords
cleaning
washing
sides
wafer
wafers
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CN201610867121.5A
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吕耀安
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WUXI HI-NANO TECHNOLOGY Co Ltd
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WUXI HI-NANO TECHNOLOGY Co Ltd
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Priority to CN201610867121.5A priority Critical patent/CN106449477A/zh
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本发明涉及一种晶圆片的清洗烘干系统,包括带状清洗槽、安装于所述清洗槽两侧的多根清洗管及安装于清洗槽底部的排水槽,所述清洗槽的前端安装有分输箱,清洗槽包括清洗区及烘干区,所述清洗区的两侧槽板上具有喷洗孔,所述烘干区两侧槽板上具有喷气孔,所述喷洗孔及喷气孔贯穿槽板的两侧并朝晶圆片的输送方向倾斜,所述喷洗孔与清洗管连通,所述清洗管连接清洗泵,所述喷气孔与烘干腔连通,所述烘干腔连接热风机。本发明采用带状清洗槽,对晶圆片进行移动时清洗,可缩短清洗时间,并无需二次冲洗,节省清洗操作,降低成本;并且,于清洗槽的尾端设置烘干区,晶圆片清洗完成后,直接进行烘干,整个操作流畅,效率高。

Description

晶圆片的清洗烘干系统
技术领域
本发明属于集成电路的生产设备领域,特别涉及集成电路的晶圆片用清洗设备。
背景技术
现有的半导体晶圆片的清洗设备,将一批晶圆片集中置于清洗槽中,并利用升降装置对晶圆片进行升降,通过冲洗作用,将晶圆片的表面清洗干净。这种清洗设备,虽然能实现批量清洗,但每次清洗的时间较长,需要浸泡处理,并且清洗完成后,还需要进行对晶圆片表面的残留水进行冲洗,整个清洗时间较长;并且,为防止晶圆片之间相互碰撞,还需对清洗槽中通入气体,保证清洗槽中不断产生气泡,对晶圆片进行保护。
发明内容
针对上述晶圆片清洗设备存在的问题,申请人进行研究及设计,提供一种晶圆片的清洗烘干系统,采用带状清洗槽,实现移动式清洗,缩短清洗时间,简化设备结构。
为了解决上述问题,本发明采用如下方案:
一种晶圆片的清洗烘干系统,包括带状清洗槽、安装于所述清洗槽两侧的多根清洗管及安装于清洗槽底部的排水槽,所述清洗槽的前端安装有分输箱,清洗槽包括清洗区及烘干区,所述清洗区的两侧槽板上具有喷洗孔,所述烘干区两侧槽板上具有喷气孔,所述喷洗孔及喷气孔贯穿槽板的两侧并朝晶圆片的输送方向倾斜,所述喷洗孔与清洗管连通,所述清洗管连接清洗泵,所述喷气孔与烘干腔连通,所述烘干腔连接热风机。
作为上述技术方案的进一步改进:
所述清洗管间隔布置于槽板的侧面,每根清洗管与独立的清洗泵连接,清洗管的侧面具有与所述喷洗孔连通的出水孔。
本发明的技术效果在于:
本发明采用带状清洗槽,对晶圆片进行移动时清洗,可缩短清洗时间,并无需二次冲洗,节省清洗操作,降低成本;并且,于清洗槽的尾端设置烘干区,晶圆片清洗完成后,直接进行烘干,整个操作流畅,效率高。
附图说明
图1为本发明的结构示意图。
图2为图1的俯视图。
图中:1、清洗槽;2、清洗管;3、排水槽;4、槽板;5、喷洗孔;6、晶圆片;7、分输箱;8、烘干腔;9、喷气孔;101、清洗区;102、烘干区。
具体实施方式
下面结合附图对本发明的具体实施方式作进一步说明。
如图1、图2所示,本实施例的晶圆片的清洗烘干系统,包括带状清洗槽1、安装于清洗槽1两侧的多根清洗管2及安装于清洗槽1底部的排水槽3,清洗槽1的前端安装有分输箱7,清洗槽1包括清洗区101及烘干区102,清洗区101的两侧槽板4上具有喷洗孔5,烘干区102两侧槽板4上具有喷气孔9,喷洗孔5及喷气孔9贯穿槽板4的两侧并朝晶圆片6的输送方向倾斜,喷洗孔5与清洗管2连通,清洗管2连接清洗泵,喷气孔9与烘干腔8连通,烘干腔8连接热风机。
清洗管2间隔布置于槽板4的侧面,每根清洗管2与独立的清洗泵连接,清洗管2的侧面具有与喷洗孔5连通的出水孔。当所需喷洗压力不大时,可以将多个清洗管2共同连接一个清洗泵,以降低能耗。
使用时,将晶圆片6置于分输箱7中,分输箱7中具有与清洗槽1对应的、倾斜设置的输送槽,晶圆片6从该输送槽中输出至清洗槽1中,将晶圆片6置于清洗槽1中后,开启清洗泵,高压水从喷洗孔5中喷出,由于喷洗孔5倾斜设置,对晶圆片6表面清洗的同时将其向前推送,从而对晶圆片6进行移动式清洗,晶圆片6走完整个清洗槽1的清洗区101后,完成清洗操作;晶圆片6继续向前移动,经过烘干区102时,热空气吹向其表面,将其表面的水吹干,同样,喷气孔9倾斜布置,对晶圆片6向前有推送作用。
以上所举实施例为本发明的较佳实施方式,仅用来方便说明本发明,并非对本发明作任何形式上的限制,任何所属技术领域中具有通常知识者,若在不脱离本发明所提技术特征的范围内,利用本发明所揭示技术内容所作出局部改动或修饰的等效实施例,并且未脱离本发明的技术特征内容,均仍属于本发明技术特征的范围内。

Claims (2)

1.一种晶圆片的清洗烘干系统,其特征在于:包括多个平行设置的带状清洗槽(1)、安装于所述清洗槽(1)两侧的多根清洗管(2)及安装于清洗槽(1)底部的排水槽(3),所述清洗槽(1)的前端安装有分输箱(7),清洗槽(1)包括清洗区(101)及烘干区(102),所述清洗区(101)的两侧槽板(4)上具有喷洗孔(5),所述烘干区(102)两侧槽板(4)上具有喷气孔(9),所述喷洗孔(5)及喷气孔(9)贯穿槽板(4)的两侧并朝晶圆片(6)的输送方向倾斜,所述喷洗孔(5)与清洗管(2)连通,所述清洗管(2)连接清洗泵,所述喷气孔(9)与烘干腔(8)连通,所述烘干腔(8)连接热风机。
2.根据权利要求1所述的晶圆片的清洗烘干系统,其特征在于:所述清洗管(2)间隔布置于槽板(4)的侧面,每根清洗管(2)与独立的清洗泵连接,清洗管(2)的侧面具有与所述喷洗孔(5)连通的出水孔。
CN201610867121.5A 2016-09-29 2016-09-29 晶圆片的清洗烘干系统 Withdrawn CN106449477A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113566510A (zh) * 2021-09-26 2021-10-29 常州市豪迈干燥工程有限公司 一种半导体晶圆用的桨叶干燥机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102327875A (zh) * 2011-06-21 2012-01-25 天津市中马骏腾精密机械制造有限公司 圆形工件清洗装置
CN205373360U (zh) * 2015-12-25 2016-07-06 苏州普锐晶科技有限公司 一种晶片连续清洗烘干装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102327875A (zh) * 2011-06-21 2012-01-25 天津市中马骏腾精密机械制造有限公司 圆形工件清洗装置
CN205373360U (zh) * 2015-12-25 2016-07-06 苏州普锐晶科技有限公司 一种晶片连续清洗烘干装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113566510A (zh) * 2021-09-26 2021-10-29 常州市豪迈干燥工程有限公司 一种半导体晶圆用的桨叶干燥机

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Application publication date: 20170222