JP5673608B2 - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法 Download PDF

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Publication number
JP5673608B2
JP5673608B2 JP2012127192A JP2012127192A JP5673608B2 JP 5673608 B2 JP5673608 B2 JP 5673608B2 JP 2012127192 A JP2012127192 A JP 2012127192A JP 2012127192 A JP2012127192 A JP 2012127192A JP 5673608 B2 JP5673608 B2 JP 5673608B2
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JP
Japan
Prior art keywords
measured
heat radiating
terminal
insulating substrate
inspection
Prior art date
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Expired - Fee Related
Application number
JP2012127192A
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English (en)
Japanese (ja)
Other versions
JP2013250235A5 (https=
JP2013250235A (ja
Inventor
岡田　章
章 岡田
肇 秋山
肇 秋山
欽也 山下
欽也 山下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2012127192A priority Critical patent/JP5673608B2/ja
Priority to US13/783,060 priority patent/US8981805B2/en
Priority to CN201310214803.2A priority patent/CN103454460B/zh
Publication of JP2013250235A publication Critical patent/JP2013250235A/ja
Publication of JP2013250235A5 publication Critical patent/JP2013250235A5/ja
Application granted granted Critical
Publication of JP5673608B2 publication Critical patent/JP5673608B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2012127192A 2012-06-04 2012-06-04 検査装置及び検査方法 Expired - Fee Related JP5673608B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012127192A JP5673608B2 (ja) 2012-06-04 2012-06-04 検査装置及び検査方法
US13/783,060 US8981805B2 (en) 2012-06-04 2013-03-01 Inspection apparatus and inspection method
CN201310214803.2A CN103454460B (zh) 2012-06-04 2013-06-03 检查装置及检查方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012127192A JP5673608B2 (ja) 2012-06-04 2012-06-04 検査装置及び検査方法

Publications (3)

Publication Number Publication Date
JP2013250235A JP2013250235A (ja) 2013-12-12
JP2013250235A5 JP2013250235A5 (https=) 2014-10-09
JP5673608B2 true JP5673608B2 (ja) 2015-02-18

Family

ID=49669444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012127192A Expired - Fee Related JP5673608B2 (ja) 2012-06-04 2012-06-04 検査装置及び検査方法

Country Status (3)

Country Link
US (1) US8981805B2 (https=)
JP (1) JP5673608B2 (https=)
CN (1) CN103454460B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016138898A (ja) * 2016-04-21 2016-08-04 三菱電機株式会社 検査装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017009449A (ja) * 2015-06-23 2017-01-12 三菱電機株式会社 コンタクトプローブ型温度検出器、半導体装置の評価装置および半導体装置の評価方法
WO2018103074A1 (en) 2016-12-09 2018-06-14 Telefonaktiebolaget Lm Ericsson (Publ) Electrical test probe and testing system using the same
GB202018028D0 (en) * 2020-11-17 2020-12-30 Rolls Royce Plc Method of inspecting a component
KR102892995B1 (ko) 2021-03-24 2025-12-05 삼성전자주식회사 반도체 소자 검사용 프로브 및 이를 포함하는 프로브 카드

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079740U (ja) * 1983-11-08 1985-06-03 日本電気株式会社 集積回路装置用コンタクトピン
JPH0269682A (ja) 1988-09-05 1990-03-08 Nec Corp 測定用接続基板
JP3274359B2 (ja) * 1996-06-17 2002-04-15 株式会社ピーエフユー Ｃｓｐソケット構造
JPH1070361A (ja) 1996-08-28 1998-03-10 Omron Corp 半田付け方法及び装置
JP3231668B2 (ja) 1997-08-27 2001-11-26 九州日本電気株式会社 プローブ装置
JP2001153886A (ja) * 1999-11-26 2001-06-08 Mitsubishi Electric Corp プローブカード、及びこれを備えたテスト装置
JP2004150999A (ja) * 2002-10-31 2004-05-27 Advantest Corp プローブカード
US7285968B2 (en) * 2005-04-19 2007-10-23 Formfactor, Inc. Apparatus and method for managing thermally induced motion of a probe card assembly
JP4598614B2 (ja) 2005-06-30 2010-12-15 富士通株式会社 ソケット及び電子機器
JP2008111719A (ja) 2006-10-30 2008-05-15 Sumitomo Electric Ind Ltd コンタクトプローブ
JP2009031059A (ja) * 2007-07-25 2009-02-12 Japan Electronic Materials Corp プローブ
JP4999615B2 (ja) * 2007-08-31 2012-08-15 東京エレクトロン株式会社 検査装置及び検査方法
JP4598093B2 (ja) * 2008-02-15 2010-12-15 株式会社日立ハイテクノロジーズ 不良検査装置
JP2010019797A (ja) 2008-07-14 2010-01-28 Fujitsu Ltd 両側プローブピン用ソケット、両側プローブピン、及びプローブユニット
DE102008047337B4 (de) 2008-09-15 2010-11-25 Suss Microtec Test Systems Gmbh Verfahren und Vorrichtung zur Prüfung eines Testsubstrats in einem Prober unter definierten thermischen Bedingungen
JP5471144B2 (ja) 2009-08-07 2014-04-16 大日本印刷株式会社 基板検査用治具および基板検査方法
JP5600520B2 (ja) 2010-08-25 2014-10-01 日本電子材料株式会社 プローブカード
JP5928203B2 (ja) * 2012-07-10 2016-06-01 三菱電機株式会社 検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016138898A (ja) * 2016-04-21 2016-08-04 三菱電機株式会社 検査装置

Also Published As

Publication number Publication date
CN103454460B (zh) 2016-08-10
CN103454460A (zh) 2013-12-18
US8981805B2 (en) 2015-03-17
JP2013250235A (ja) 2013-12-12
US20130321015A1 (en) 2013-12-05

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