JP5670534B1 - 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 - Google Patents

白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 Download PDF

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JP5670534B1
JP5670534B1 JP2013215602A JP2013215602A JP5670534B1 JP 5670534 B1 JP5670534 B1 JP 5670534B1 JP 2013215602 A JP2013215602 A JP 2013215602A JP 2013215602 A JP2013215602 A JP 2013215602A JP 5670534 B1 JP5670534 B1 JP 5670534B1
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resin composition
epoxy
thermosetting resin
pigment
glass substrate
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JP2015078292A (ja
Inventor
權雄 劉
權雄 劉
富康 ▲黄▼
富康 ▲黄▼
智軒 ▲黄▼
智軒 ▲黄▼
昌始 杉田
昌始 杉田
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台湾太陽油▲墨▼股▲分▼有限公司
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Priority to JP2013215602A priority Critical patent/JP5670534B1/ja
Priority to KR1020140137635A priority patent/KR101820196B1/ko
Priority to CN201410545476.3A priority patent/CN104558527B/zh
Priority to TW103135681A priority patent/TWI618755B/zh
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Publication of JP5670534B1 publication Critical patent/JP5670534B1/ja
Publication of JP2015078292A publication Critical patent/JP2015078292A/ja
Priority to HK15106946.5A priority patent/HK1206376A1/xx
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2013215602A 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材 Active JP5670534B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2013215602A JP5670534B1 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
KR1020140137635A KR101820196B1 (ko) 2013-10-16 2014-10-13 백색 열경화성 수지 조성물, 그의 경화물 및 그것을 사용한 디스플레이용 부재
CN201410545476.3A CN104558527B (zh) 2013-10-16 2014-10-15 白色热硬化性树脂组成物、其硬化物、及使用其的显示器用构件
TW103135681A TWI618755B (zh) 2013-10-16 2014-10-15 White thermosetting resin composition, cured product thereof, and display member using the same
HK15106946.5A HK1206376A1 (en) 2013-10-16 2015-07-21 White-colored thermosetting resin composition, cured product thereof, and display member using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013215602A JP5670534B1 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Publications (2)

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JP5670534B1 true JP5670534B1 (ja) 2015-02-18
JP2015078292A JP2015078292A (ja) 2015-04-23

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JP2013215602A Active JP5670534B1 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Country Status (5)

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JP (1) JP5670534B1 (ko)
KR (1) KR101820196B1 (ko)
CN (1) CN104558527B (ko)
HK (1) HK1206376A1 (ko)
TW (1) TWI618755B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116949681A (zh) * 2023-09-20 2023-10-27 江苏青昀新材料有限公司 闪蒸纺制的耐黄变的片材及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20210036119A (ko) * 2019-09-25 2021-04-02 주식회사 케이씨씨 분체도료 조성물
CN113583386A (zh) * 2021-08-20 2021-11-02 广东四会互感器厂有限公司 一种封闭式组合电器用环氧树脂及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009030019A (ja) * 2007-07-05 2009-02-12 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置
JP2012256651A (ja) * 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及びその製造方法並びに該樹脂パッケージを有してなる半導体発光装置
WO2013146081A1 (ja) * 2012-03-30 2013-10-03 出光興産株式会社 樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
JP2013209531A (ja) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd 光半導体装置用白色硬化性組成物、並びに光半導体装置用成形体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4991957B1 (ja) * 2011-07-14 2012-08-08 積水化学工業株式会社 光半導体装置用白色硬化性組成物及び光半導体装置用成形体
JP5764423B2 (ja) * 2011-08-02 2015-08-19 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレームまたは光半導体装置用基板、ならびに光半導体装置
JP2013209479A (ja) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd 光半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009030019A (ja) * 2007-07-05 2009-02-12 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置
JP2012256651A (ja) * 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及びその製造方法並びに該樹脂パッケージを有してなる半導体発光装置
WO2013146081A1 (ja) * 2012-03-30 2013-10-03 出光興産株式会社 樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
JP2013209531A (ja) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd 光半導体装置用白色硬化性組成物、並びに光半導体装置用成形体

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116949681A (zh) * 2023-09-20 2023-10-27 江苏青昀新材料有限公司 闪蒸纺制的耐黄变的片材及其制造方法
CN116949681B (zh) * 2023-09-20 2024-01-02 江苏青昀新材料有限公司 闪蒸纺制的耐黄变的片材及其制造方法

Also Published As

Publication number Publication date
TWI618755B (zh) 2018-03-21
TW201518433A (zh) 2015-05-16
CN104558527B (zh) 2018-04-06
JP2015078292A (ja) 2015-04-23
KR20150044389A (ko) 2015-04-24
KR101820196B1 (ko) 2018-01-18
CN104558527A (zh) 2015-04-29
HK1206376A1 (en) 2016-01-08

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