CN104558527B - 白色热硬化性树脂组成物、其硬化物、及使用其的显示器用构件 - Google Patents

白色热硬化性树脂组成物、其硬化物、及使用其的显示器用构件 Download PDF

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Publication number
CN104558527B
CN104558527B CN201410545476.3A CN201410545476A CN104558527B CN 104558527 B CN104558527 B CN 104558527B CN 201410545476 A CN201410545476 A CN 201410545476A CN 104558527 B CN104558527 B CN 104558527B
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resin composition
hardening
glass substrate
white hot
hardening resin
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Chinese (zh)
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CN104558527A (zh
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刘权雄
黄富康
黄智轩
杉田昌始
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Taiwan Taiyo Ink Co Ltd
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Taiwan Taiyo Ink Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201410545476.3A 2013-10-16 2014-10-15 白色热硬化性树脂组成物、其硬化物、及使用其的显示器用构件 Active CN104558527B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013215602A JP5670534B1 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
JP2013-215602 2013-10-16

Publications (2)

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CN104558527A CN104558527A (zh) 2015-04-29
CN104558527B true CN104558527B (zh) 2018-04-06

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JP (1) JP5670534B1 (ko)
KR (1) KR101820196B1 (ko)
CN (1) CN104558527B (ko)
HK (1) HK1206376A1 (ko)
TW (1) TWI618755B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20210036119A (ko) * 2019-09-25 2021-04-02 주식회사 케이씨씨 분체도료 조성물
CN113583386A (zh) * 2021-08-20 2021-11-02 广东四会互感器厂有限公司 一种封闭式组合电器用环氧树脂及其制备方法
CN118259540A (zh) * 2022-12-28 2024-06-28 太阳油墨（苏州）有限公司 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
CN116949681B (zh) * 2023-09-20 2024-01-02 江苏青昀新材料有限公司 闪蒸纺制的耐黄变的片材及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421546B2 (ja) * 2007-07-05 2014-02-19 日立化成株式会社 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置
JP2012256651A (ja) * 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及びその製造方法並びに該樹脂パッケージを有してなる半導体発光装置
JP4991957B1 (ja) * 2011-07-14 2012-08-08 積水化学工業株式会社 光半導体装置用白色硬化性組成物及び光半導体装置用成形体
JP5764423B2 (ja) * 2011-08-02 2015-08-19 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレームまたは光半導体装置用基板、ならびに光半導体装置
JP5143964B1 (ja) * 2012-03-30 2013-02-13 積水化学工業株式会社 光半導体装置用白色硬化性組成物、並びに光半導体装置用成形体
WO2013146081A1 (ja) * 2012-03-30 2013-10-03 出光興産株式会社 樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
JP2013209479A (ja) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd 光半導体装置

Also Published As

Publication number Publication date
TW201518433A (zh) 2015-05-16
KR20150044389A (ko) 2015-04-24
JP2015078292A (ja) 2015-04-23
CN104558527A (zh) 2015-04-29
KR101820196B1 (ko) 2018-01-18
JP5670534B1 (ja) 2015-02-18
HK1206376A1 (en) 2016-01-08
TWI618755B (zh) 2018-03-21

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