HK1206376A1 - White-colored thermosetting resin composition, cured product thereof, and display member using the same - Google Patents

White-colored thermosetting resin composition, cured product thereof, and display member using the same

Info

Publication number
HK1206376A1
HK1206376A1 HK15106946.5A HK15106946A HK1206376A1 HK 1206376 A1 HK1206376 A1 HK 1206376A1 HK 15106946 A HK15106946 A HK 15106946A HK 1206376 A1 HK1206376 A1 HK 1206376A1
Authority
HK
Hong Kong
Prior art keywords
white
resin composition
same
thermosetting resin
cured product
Prior art date
Application number
HK15106946.5A
Other languages
English (en)
Chinese (zh)
Inventor
劉權雄
黃富康
黃智軒
杉田昌始
Original Assignee
Taiwan Taiyo Ink Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Taiyo Ink Co Ltd filed Critical Taiwan Taiyo Ink Co Ltd
Publication of HK1206376A1 publication Critical patent/HK1206376A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
HK15106946.5A 2013-10-16 2015-07-21 White-colored thermosetting resin composition, cured product thereof, and display member using the same HK1206376A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013215602A JP5670534B1 (ja) 2013-10-16 2013-10-16 白色熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材

Publications (1)

Publication Number Publication Date
HK1206376A1 true HK1206376A1 (en) 2016-01-08

Family

ID=52573837

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106946.5A HK1206376A1 (en) 2013-10-16 2015-07-21 White-colored thermosetting resin composition, cured product thereof, and display member using the same

Country Status (5)

Country Link
JP (1) JP5670534B1 (ko)
KR (1) KR101820196B1 (ko)
CN (1) CN104558527B (ko)
HK (1) HK1206376A1 (ko)
TW (1) TWI618755B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109705532B (zh) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 一种无卤无磷无氮的阻燃树脂组合物、包含其的半固化片和覆金属箔层压板
KR20210036119A (ko) * 2019-09-25 2021-04-02 주식회사 케이씨씨 분체도료 조성물
CN113583386A (zh) * 2021-08-20 2021-11-02 广东四会互感器厂有限公司 一种封闭式组合电器用环氧树脂及其制备方法
CN116949681B (zh) * 2023-09-20 2024-01-02 江苏青昀新材料有限公司 闪蒸纺制的耐黄变的片材及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421546B2 (ja) * 2007-07-05 2014-02-19 日立化成株式会社 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置
JP2012256651A (ja) * 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp 半導体発光装置用樹脂パッケージ及びその製造方法並びに該樹脂パッケージを有してなる半導体発光装置
JP4991957B1 (ja) * 2011-07-14 2012-08-08 積水化学工業株式会社 光半導体装置用白色硬化性組成物及び光半導体装置用成形体
JP5764423B2 (ja) * 2011-08-02 2015-08-19 日東電工株式会社 光半導体装置用エポキシ樹脂組成物およびそれを用いて得られる光半導体装置用リードフレームまたは光半導体装置用基板、ならびに光半導体装置
JP2013209479A (ja) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd 光半導体装置
WO2013146081A1 (ja) * 2012-03-30 2013-10-03 出光興産株式会社 樹脂組成物及びその硬化物ならびにそれを用いた光半導体用反射材
JP5143964B1 (ja) * 2012-03-30 2013-02-13 積水化学工業株式会社 光半導体装置用白色硬化性組成物、並びに光半導体装置用成形体

Also Published As

Publication number Publication date
TWI618755B (zh) 2018-03-21
TW201518433A (zh) 2015-05-16
CN104558527B (zh) 2018-04-06
JP2015078292A (ja) 2015-04-23
JP5670534B1 (ja) 2015-02-18
KR20150044389A (ko) 2015-04-24
KR101820196B1 (ko) 2018-01-18
CN104558527A (zh) 2015-04-29

Similar Documents

Publication Publication Date Title
EP3006504A4 (en) VULCANIZABLE COMPOSITION AND VULCANIZED PRODUCT OBTAINED
EP2944675A4 (en) HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
EP3061786A4 (en) Resin composition, heat-dissipating material, and heat-dissipating member
EP3115416A4 (en) Thermosetting resin composition and use thereof
SG10201709161SA (en) Novel polymer and thermosetting composition containing same
EP3235845A4 (en) Photocurable and thermosetting resin composition, cured product and laminate
EP3034580A4 (en) Resin composition and molded article
EP3088474A4 (en) Curable composition and cured product thereof
EP3059288A4 (en) Resin composition and molded article
EP2966102A4 (en) PHOTOCHROME HARDENABLE COMPOSITION, HARDENED PRODUCT THEREOF AND LAMINATE WITH THE HARDENED PRODUCT
EP2907833A4 (en) HARDENABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
SG11201500414SA (en) Epoxy resin composition, epoxy resin, and cured product
EP3053955A4 (en) RESIN COMPOSITION AND CORRESPONDING MOLDED PRODUCT
EP3037478A4 (en) POLYAMIDE RESIN COMPOSITION AND MOLDING PRODUCTS
HK1220712A1 (zh) 基於聚酯的共聚物樹脂和包含其的模製產品
PL2937373T3 (pl) Żywica kopoliwęglanowa i zawierający ją wyrób
EP2915848A4 (en) THERMOSETTING RESIN COMPOSITION AND USES THEREOF
EP2952527A4 (en) ACRYLATE STYRENE ACRYLONITRILE POLYMER AND THERMOPLASTIC RESIN COMPOSITION
EP3162855A4 (en) Polyamide resin composition and molded article comprising same
EP2951225A4 (en) EPOXY RESIN COMPOSITION AND ITS APPLICATIONS
HK1206377A1 (en) White-colored thermosetting resin composition, cured product thereof, and display member using the same
HK1207100A1 (en) Thermosetting resin composition, cured product thereof, and display member using the same
EP2837660A4 (en) CURABLE COMPOSITION, AND HARDENED SYNTHETIC RESIN USING THE SAME
EP3118236A4 (en) Resin composition and cured product thereof
HUE054108T2 (hu) Ragasztógyanta készítmény és ezt alkalmazó laminátum