HK1206376A1 - White-colored thermosetting resin composition, cured product thereof, and display member using the same - Google Patents

White-colored thermosetting resin composition, cured product thereof, and display member using the same

Info

Publication number
HK1206376A1
HK1206376A1 HK15106946.5A HK15106946A HK1206376A1 HK 1206376 A1 HK1206376 A1 HK 1206376A1 HK 15106946 A HK15106946 A HK 15106946A HK 1206376 A1 HK1206376 A1 HK 1206376A1
Authority
HK
Hong Kong
Prior art keywords
white
resin composition
same
thermosetting resin
cured product
Prior art date
Application number
HK15106946.5A
Other languages
Chinese (zh)
Inventor
劉權雄
黃富康
黃智軒
杉田昌始
Original Assignee
Taiwan Taiyo Ink Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Taiyo Ink Co Ltd filed Critical Taiwan Taiyo Ink Co Ltd
Publication of HK1206376A1 publication Critical patent/HK1206376A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
HK15106946.5A 2013-10-16 2015-07-21 White-colored thermosetting resin composition, cured product thereof, and display member using the same HK1206376A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013215602A JP5670534B1 (en) 2013-10-16 2013-10-16 White thermosetting resin composition, cured product thereof, and display member using the same

Publications (1)

Publication Number Publication Date
HK1206376A1 true HK1206376A1 (en) 2016-01-08

Family

ID=52573837

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106946.5A HK1206376A1 (en) 2013-10-16 2015-07-21 White-colored thermosetting resin composition, cured product thereof, and display member using the same

Country Status (5)

Country Link
JP (1) JP5670534B1 (en)
KR (1) KR101820196B1 (en)
CN (1) CN104558527B (en)
HK (1) HK1206376A1 (en)
TW (1) TWI618755B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109705532B (en) * 2018-12-29 2021-05-11 广东生益科技股份有限公司 Halogen-free, phosphorus-free and nitrogen-free flame-retardant resin composition, prepreg containing same and metal foil-clad laminate
KR20210036119A (en) * 2019-09-25 2021-04-02 주식회사 케이씨씨 Powder coating composition
CN113583386A (en) * 2021-08-20 2021-11-02 广东四会互感器厂有限公司 Epoxy resin for closed combined electrical appliance and preparation method thereof
CN116949681B (en) * 2023-09-20 2024-01-02 江苏青昀新材料有限公司 Flash spun yellowing resistant sheet and method of making same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421546B2 (en) * 2007-07-05 2014-02-19 日立化成株式会社 Thermosetting light reflecting resin composition, optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
JP2012256651A (en) * 2011-06-07 2012-12-27 Mitsubishi Chemicals Corp Resin package for semiconductor light-emitting device and manufacturing method therefor and semiconductor light-emitting device having resin package
JP4991957B1 (en) * 2011-07-14 2012-08-08 積水化学工業株式会社 White curable composition for optical semiconductor device and molded article for optical semiconductor device
JP5764423B2 (en) * 2011-08-02 2015-08-19 日東電工株式会社 Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device or substrate for optical semiconductor device obtained by using the same, and optical semiconductor device
JP5841237B2 (en) * 2012-03-30 2016-01-13 大阪有機化学工業株式会社 Resin composition, cured product thereof, and reflecting material for optical semiconductor using the same
JP5143964B1 (en) * 2012-03-30 2013-02-13 積水化学工業株式会社 White curable composition for optical semiconductor device, and molded article for optical semiconductor device
JP2013209479A (en) * 2012-03-30 2013-10-10 Sekisui Chem Co Ltd Optical semiconductor device

Also Published As

Publication number Publication date
CN104558527A (en) 2015-04-29
JP5670534B1 (en) 2015-02-18
TW201518433A (en) 2015-05-16
TWI618755B (en) 2018-03-21
KR20150044389A (en) 2015-04-24
CN104558527B (en) 2018-04-06
JP2015078292A (en) 2015-04-23
KR101820196B1 (en) 2018-01-18

Similar Documents

Publication Publication Date Title
EP3006504A4 (en) Curable composition, and cured product thereof
EP2944675A4 (en) Curable resin composition, and cured product of same
EP3061786A4 (en) Resin composition, heat-dissipating material, and heat-dissipating member
EP3115416A4 (en) Thermosetting resin composition and use thereof
SG10201709161SA (en) Novel polymer and thermosetting composition containing same
EP3235845A4 (en) Photocurable and thermosetting resin composition, cured product and laminate
EP3009478A4 (en) Polyamide resin composition and molded article produced therefrom
EP3088474A4 (en) Curable composition and cured product thereof
EP3059288A4 (en) Resin composition and molded article
EP2966102A4 (en) Curable photochromic composition, cured product thereof, and laminate including cured product
EP2907833A4 (en) Curable resin composition, and cured product thereof
SG11201500414SA (en) Epoxy resin composition, epoxy resin, and cured product
EP2915848A4 (en) Thermosetting resin composition and use thereof
HK1220712A1 (en) Copolymerized polyester resin and molded product using same
PL2937373T3 (en) Copolycarbonate resin and product comprising same
EP2952527A4 (en) Acrylate-styrene-acrylonitrile polymer and thermoplastic resin composition
EP3162855A4 (en) Polyamide resin composition and molded article comprising same
EP2951225A4 (en) An epoxy resin composition,and its applications
HK1206377A1 (en) White-colored thermosetting resin composition, cured product thereof, and display member using the same
HK1207100A1 (en) Thermosetting resin composition, cured product thereof, and display member using the same
EP2837660A4 (en) Curable composition, and cured synthetic resin using same
EP3118236A4 (en) Resin composition and cured product thereof
EP2990443A4 (en) Polyamide resin composition, and molded article
HUE054108T2 (en) Adhesive resin composition and laminate using same
HK1206376A1 (en) White-colored thermosetting resin composition, cured product thereof, and display member using the same