JP5670534B1 - White thermosetting resin composition, cured product thereof, and display member using the same - Google Patents

Abstract

A white thermosetting resin composition capable of achieving a high level of adhesion and curability while maintaining insulation and heat resistance, and capable of forming a white cured product with excellent surface flatness and high-temperature discoloration resistance. And a display including the cured product. (A) a copolymerized epoxy resin having an epoxy equivalent having no aromatic ring within a range of less than 500, (b) an acid anhydride having no aromatic ring as an epoxy curing agent, and (c) A white thermosetting resin composition comprising an antioxidant) and (d) titanium oxide. Preferably, it further contains a silane coupling agent and at least one of barium sulfate, silica, and talc. [Selection figure] None

Description

  The present invention relates to a white thermosetting resin composition, a cured product thereof, and a display member using the same, and in particular, has a high balance between adhesion and curability while having insulation and heat resistance. The present invention relates to a thermosetting resin composition that can be achieved and can form a white cured product excellent in surface flatness and high-temperature discoloration resistance, and a display member provided with the cured product.

  2. Description of the Related Art In recent years, touch panel type input devices (hereinafter simply referred to as “touch panels”) are incorporated as operation units on the screens of various electronic devices such as mobile phones, personal portable information terminals, and notebook computers. In a liquid crystal display device including a touch panel, the touch panel is mounted and fixed on the polarizing plate of the display panel of the liquid crystal display device after alignment. By the way, when viewing the liquid crystal display from the user side on mobile phones and tablets, information or images are not displayed on the entire surface of the transparent glass, but are painted black or white so as to partition the display on the outer periphery of the substrate. There is a frame part, and information is displayed inside the frame part.

  Although this frame portion is called a decoration portion, it has a function of partitioning the display portion into a quadrangular shape and concealing it so that a portion that is inconvenient (such as a wiring portion for a touch panel) cannot be seen. The decorative part is also very important as an appearance decoration member of the portable terminal device display part as a direct eye contact, and since the design is particularly important, its material has high adhesion and curability. There is a need for a thermosetting resin composition that can achieve a well-balanced level and can form a white cured product that is excellent in high-temperature insulation resistance, surface flatness, and high-temperature discoloration resistance required for processing processes.

  Conventionally, as such a thermosetting resin composition, for example, Patent Document 1 discloses a white coating agent containing a thermosetting resin, a white pigment, a curing agent, a curing catalyst, and an elastomer.

JP 2010-278411 A

In recent years, the level of adhesion required for a curable resin composition containing an epoxy resin has increased, and in particular, there has been a demand for a curable resin composition excellent in both curability and adhesion. However, the conventional curable composition described in Patent Document 1 can achieve a high level of adhesion and curability, and can form a cured product having excellent surface flatness and high-temperature discoloration resistance. It wasn't.
Accordingly, the present invention provides a cured product that can achieve a high level of adhesion and curability while maintaining the insulation and heat resistance required during the process, and has excellent surface flatness and high-temperature discoloration resistance. It aims at providing the white thermosetting resin composition which can form, its hardened | cured material, and the member for a display using the same.

As a result of intensive studies to solve the above problems, the present inventors have found that a specific copolymerized epoxy resin, an acid anhydride having no aromatic ring as an epoxy curing agent, an antioxidant, and titanium oxide The present invention has been completed by discovering that a composition containing a desired insulation, heat resistance, adhesion, curability, surface flatness and high temperature discoloration resistance at the same time.
That is, the present invention provides the following (1) to (6).

(1) (a) a copolymerized epoxy resin having an epoxy equivalent having no aromatic ring within a range of less than 500, (b) an acid anhydride having no aromatic ring as an epoxy curing agent, and (c) A white thermosetting resin composition comprising an antioxidant and (d) titanium oxide.

(2) The white thermosetting resin composition as described in (1) above, wherein the antioxidant (c) is a phenolic antioxidant.

(3) The white thermosetting resin composition as described in (1) or (2) above, further comprising a silane coupling agent.

(4) The white thermosetting resin composition according to any one of (1) to (3), further comprising at least one selected from the group consisting of barium sulfate, silica and talc. .

(5) The cured product of the white thermosetting resin composition according to any one of (1) to (4), which is formed on a substrate.

(6) A display member comprising the cured product according to (5).

  According to the present invention, the thermosetting property that can achieve a good balance between adhesion and curability at a high level while having insulation and heat resistance, and can form a white cured product with excellent surface flatness and high-temperature discoloration resistance. A resin composition can be provided. Moreover, the white curable resin composition of this invention is suitable as decorating ink used for a touchscreen.

The white curable resin composition of the present invention (hereinafter also referred to as “the composition of the present invention”) is (a) a copolymerized epoxy resin having an epoxy equivalent not having an aromatic ring within a range of less than 500, (B) A white thermosetting resin composition comprising an acid anhydride having no aromatic ring as an epoxy curing agent, (c) an antioxidant, and (d) titanium oxide.
Hereinafter, each component contained in the composition of the present invention will be described in detail.

[(A) Copolymerized epoxy resin having no aromatic ring]
The copolymerized epoxy resin used in the composition of the present invention is a copolymerized epoxy resin having an epoxy equivalent not having an aromatic ring within a range of less than 500, for example, an epoxy group-containing unsaturated compound, an unsaturated compound, It is a copolymerized epoxy resin. From the viewpoint of further improving the adhesion between the glass substrate and the molded article, the epoxy compound is preferably an epoxy compound having an alicyclic skeleton or an epoxy resin in which a glycidyl group is not directly attached to the alicyclic ring. An epoxy resin having no aromatic ring tends to be excellent in weather resistance and hard to be colored, and an epoxy resin not containing an ester bond in the main chain tends to be excellent in heat resistance.

  Examples of the copolymerized epoxy resin having no aromatic ring include, for example, Celoxide 2021, Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, Celoxide 2000, Celoxide 3000, Cyclomer A200, Cyclomer M100, and Cyclomer M101. , Epolide GT-301, Epolide GT-302, Epolide 401, Epolide 403, ETHB, Epolide HD300 (above, made by Daicel Chemical Industries), KRM-2110, KRM-2199 (above, made by ADEKA), DM 4500, DM Alicyclic epoxy resin such as 3450 (manufactured by Double Bond Chemical Co., Ltd.), triglycidyl isocyanurate, (for example, TEPIC-H (manufactured by Nissan Chemical Co., Ltd. with respect to S-triazine ring skeleton surface) Β-form with a structure in which three epoxy groups are bonded in the same direction) and TEPIC (beta-form and one epoxy group with respect to the S-triazine ring skeleton surface in a different direction from the other two epoxy groups. Etc.), etc.), hydrogenated epoxy resins, amino group-containing epoxy resins, rubber-modified epoxy resins, epoxy group-containing (meth) acrylate resins, silicone-modified epoxies Examples thereof include epoxy resins that are soluble in diluents such as resins and ε-caprolactone-modified epoxy resins. These epoxy resins can be used alone or in combination of two or more.

  Specific examples of the copolymerized epoxy resin having no aromatic ring include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 3,4-epoxy-1. -Methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3- Methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2- (3,4-epoxy Cyclohexyl-5,5- Pyro-3,4-epoxy) cyclohexane-metadioxane, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylenebis (3,4-epoxycyclohexane), propane- 2,2-diyl-bis (3,4-epoxycyclohexane), 2,2-bis (3,4-epoxycyclohexyl) propanedicyclopentadiene diepoxide, ethylenebis (3,4-epoxycyclohexanecarboxylate), epoxy Examples include dioctyl hexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, and the like.

Moreover, if it is a copolymerization epoxy resin in which the epoxy equivalent which does not have an aromatic ring exists in the range of less than 500, it is not limited to said example, It can be used without a problem without causing a time-dependent change. Note that when the epoxy equivalent is less than 500, discoloration with time does not occur. More preferably, the epoxy equivalent is 250 or less.
The compounding quantity of the copolymerization epoxy resin in which the epoxy equivalent which does not have an aromatic ring exists in the range of less than 500 is suitably adjusted so that it may harden | cure moderately by provision of heat, and is not specifically limited. In 100 parts by mass of the white thermosetting resin composition, the content of the copolymerized epoxy resin is preferably 5 parts by mass or more and 50 parts by mass or less, more preferably 10 parts by mass or more and 40 parts by mass or less, and further preferably 15 parts by mass. Part to 35 parts by weight. When the blending amount of the copolymerized epoxy resin is in the range of 5 parts by mass or more and 50 parts by mass or less, the curable composition is more effectively cured by heating, and the heat resistance of the molded body is further increased.

[(B) Acid anhydride having no aromatic ring as an epoxy curing agent]
From the viewpoint of further improving the adhesion between the glass substrate and the molded body, an acid anhydride curing agent is used as a curing agent in the white thermosetting resin composition of the present application. As the acid anhydride curing agent, an acid anhydride having an alicyclic skeleton can be used. Preferred acid anhydride curing agents include phthalic anhydride, maleic anhydride, cyclohexanedicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, and nadic anhydride. Examples thereof include acid, glutaric anhydride, methylhexahydrophthalic anhydride, and methyltetrahydrophthalic anhydride. Among these acid anhydrides, phthalic anhydride, cyclohexanedicarboxylic anhydride, succinic anhydride, and maleic anhydride are preferable from the viewpoint of material availability and cost.

Moreover, it is preferable that an acid anhydride hardening | curing agent does not have a double bond in a carbocyclic ring. The reason is that, when an acid anhydride curing agent having a double bond in the carbocycle is used, there is a risk that high temperature discoloration resistance or ultraviolet irradiation discoloration resistance may be reduced. As preferred acid anhydride curing agents having no double bond, for example, hexahydrophthalic anhydride and methylhexahydrophthalic anhydride are preferably used.
The blending ratio of the above (a) copolymer epoxy resin and (b) curing agent is not particularly limited. The blending amount of the curing agent with respect to 100 parts by mass of the copolymerized epoxy resin compound is preferably 20 parts by mass or more, more preferably 30 parts by mass or more, still more preferably 40 parts by mass or more, and particularly preferably 45 parts by mass or more. Preferably it is 80 mass parts or less, More preferably, it is 70 mass parts or less, More preferably, it is 60 mass parts or less.

[(C) Antioxidant]
In order to prevent oxidation, the composition of the present invention includes a radical scavenger that invalidates the generated radicals, and a peroxide that decomposes the generated peroxides into harmless substances to prevent the generation of new radicals. Contains an antioxidant such as an oxide decomposer. The antioxidant used in the present invention can prevent oxidative deterioration of an epoxy resin or the like and suppress yellowing. An antioxidant may be used individually by 1 type and may be used in combination of 2 or more type.
Examples of the antioxidant include phenolic antioxidants, phosphorus antioxidants, and amine antioxidants. Of these, phenolic antioxidants are particularly preferred.

  Examples of commercially available phenolic antioxidants include IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, IRGANOX 245, IRGANOX 259, and IRGANOX 295 (all of which are manufactured by BASF), ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-70, ADK STAB AO-80, ADK STAB AO-90, and ADK STAB AO-330 (all of which are manufactured by ADEKA), Sumilizer GA-80, Sumizer MDP-S, and Sumilizer BBM-S, Sumilizer GM, Sumilizer GS (F), and Sumilizer GP (all of which are Sumitomo Chemical Industry Co., Ltd.), HOSTANOXO10, HOSTANOX O16, HOSTANOX O14, and HOSTANOX O3 (all are made by Clariant), Antage BHT, Antage W-300, Antage W-400, and Antage W500 (all are Kawaguchi Chemical) Kogyo Co., Ltd.), CHINOX TP-10H (both are manufactured by Double Bond Chemical Co., Ltd.), SENOX 224M, and SEENOX 326M (both are manufactured by Sipro Kasei Co., Ltd.).

  Examples of phosphorus antioxidants include cyclohexylphosphine and triphenylphosphine. Commercially available products of the above phosphorus antioxidants include Adeastab PEP-4C, Adeastab PEP-8, Adeastab PEP-24G, Adeastab PEP-36, Adeastab HP-10, Adeastab 2112, Adeastab 260, Adeastab 522A, Adeastab 1178, Adeastab 1500, Adeastab C, Adeastab 135A, Adeastab 3010, and Adeastab TPP (all are made by ADEKA), Sandstub P-EPQ, and Hostanox PAR24 (all are made by Clariant), and JP-312L, JP -318-0, JPM-308, JPM-313, JPP-613M, JPP-31, JPP-2000PT, and JPH-3800 (all of which are manufactured by Johoku Chemical Industry Co., Ltd.) Etc. The.

  Examples of amine-based antioxidants include triethylamine, melamine, ethyldiamino-S-triazine, 2,4-diamino-S-triazine, 2,4-diamino-6-tolyl-S-triazine, and 2,4-diamino-6. -Xylyl-S-triazine and quaternary ammonium salt derivatives.

  The blending amount of the antioxidant is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, preferably 40 parts by mass or less, more preferably 30 parts by mass with respect to 100 parts by mass of the (a) copolymerized epoxy resin. It is as follows. When the content of the antioxidant is 5 parts by mass or more and 40 parts by mass or less, a molded body that is more excellent in heat resistance can be obtained.

[(D) Titanium oxide]
According to the composition containing titanium oxide, a molded article with high whiteness can be obtained. Further, by using titanium oxide, a molded article having a high light reflectance can be obtained as compared with the case where only a filler different from titanium oxide is used. Titanium oxide is not particularly limited. As for titanium oxide, only 1 type may be used and 2 or more types may be used together. In the white curable resin composition of the present invention, both anatase type titanium oxide and rutile type titanium oxide can be used as titanium oxide. Of these, anatase-type titanium oxide is often used because of its high whiteness compared to the rutile type. However, since anatase type titanium oxide has photocatalytic activity, it may cause discoloration of the resin in the composition. On the other hand, rutile type titanium oxide is preferable because whiteness is slightly inferior to that of anatase type, but since it has almost no photoactivity, a stable cured film can be obtained.

  Specific examples of the rutile-type titanium oxide include Type R-820, Type R-830, Type R-930, Type R-550, Type R-630, Type R-670, Type R-680 and Type R. -780, Taipei R-850, Taipei CR-50, Taipei CR-57, Taipei CR-80, Taipei CR-90, Taipei CR-93, Taipei CR-95, Taipei CR-97, Taipei CR-60, Taipei CR -63, Taipei CR-67, Taipei CR-58, Taipei CR-85, Taipei UT771 (manufactured by Ishihara Sangyo), Taipei Pure R-100, Taiwan Pure R-101, Taiwan Pure R-102, Taiwan Pure R-103, Taiwan Pure R-104, typi A-105, Taipure R-108, Taipure R-900, Taipure R-902, Taipure R-960, Taipure R-706, Taipure R-931 (above, DuPont), TITONR-25, TITON R-21 , TITON R-32, TITON R-7E, TITON R-5N, TITON R-61N, TITON R-62N, TITON R-42, TITON-45M, TITON R-44, TITON R-49S, TITON GTR-100, TITONTR -300, TITON D-918, TITON TCR-29, TITONCR-52, TITON FTR-700 (manufactured by Sakai Chemical Industry Co., Ltd.) and the like.

  Moreover, as said anatase type titanium oxide, TA-100, TA-200, TA-300, TA-400, TA-500 (above, Fuji Titanium Industry Co., Ltd.), Type A-100, Type A-220, Type W-10 (above, manufactured by Ishihara Sangyo Co., Ltd.), TITANIX JA-1, TITANIX JA-3, TITANIX JA-4, TITANIX JA-5 (above, manufactured by Teika), KRONOS KA-10, KRONOS KA-15, KRONOS KA-20, KRONOS KA-30 (above, manufactured by Titanium Industry Co., Ltd.), A-100, A-100, A-100, SA-1, SA-1L (above, manufactured by Sakai Chemical Industry Co., Ltd.) and the like.

The amount of titanium oxide is preferably 80 to 250 parts by mass with respect to 100 parts by mass in total of the above (a) copolymerized epoxy resin and (b) curing agent. It is preferable that the blending amount of the titanium oxide is 250 parts by mass or less because the curability of the white curable resin composition of the present invention is further increased and the depth of curing is increased. Further, when the blending amount of the titanium oxide is 80 parts by mass or more, the hiding power of the white curable resin composition of the present invention is increased, and a cured product having excellent curability and adhesion is obtained. This is preferable.
The titanium oxide preferably includes rutile type titanium oxide surface-treated with aluminum oxide. In 100 parts by mass of the titanium oxide, the content of the rutile titanium oxide surface-treated from the aluminum oxide is preferably 10 parts by mass or more, more preferably 30 parts by mass or more and 100 parts by mass or less. The total amount of the titanium oxide may be rutile titanium oxide surface-treated with the aluminum oxide. Use of the rutile type titanium oxide surface-treated with the aluminum oxide further increases the heat resistance of the molded body.
As the rutile type titanium oxide surface-treated with the aluminum oxide, for example,
R-KB-6 (trade name, manufactured by Bayer AG), which is a rutile type titanium oxide surface-treated with alumina, manufactured by Ishihara Sangyo Co., Ltd., which is a rutile chlorine method titanium oxide: CR-58, CR-90 The product number: R-630 manufactured by Ishihara Sangyo Co., Ltd., which is a rutile sulfuric acid method titanium oxide.

[At least one of barium sulfate, silica, and talc]
In the present invention, it is preferable to include at least one insulating filler selected from the group consisting of barium sulfate, silica and talc. By using the copolymerized epoxy resin in combination with at least one of barium sulfate, silica, and talc, not only the high-temperature insulation resistance of the cured product is improved, but also the surface flatness is increased. In addition to suppressing deformation due to heating and maintaining surface flatness, scratches and microcracks can be effectively prevented.

As the particle size of the insulating filler, the average particle size of barium sulfate is 0.05 to 5.00 μm, the average particle size of silica is 0.1 to 5.0 μm, the average particle size of talc ( D50) is preferably 0.1 to 5.0 μm. When the average particle size of the insulating filler is not more than the upper limit of the above range, dispersibility and surface flatness are further improved. Moreover, sclerosis | hardenability and high temperature resistance improve more that the average particle diameter of an insulating filler is more than said lower limit.
As a compounding quantity of the said insulating filler, it is preferable that it is 30-70 mass parts with respect to 100 mass parts of total amounts of the said (a) copolymerization epoxy resin and (b) hardening | curing agent, 40-60 mass parts It is more preferable that Commercially available barium sulfate, silica, and talc may be used.

Commercially available products of barium sulfate include precipitated barium sulfate # 100, precipitated barium sulfate # 300, precipitated barium sulfate SS-50, BARIACE B-30, BARIACE B-31, BARIACE B-32, BARIACE B-33, BARIACE B-34, BARIFINE BF-1, BARIFINE BF-10, BARIFINE BF-20, BARIFINE BF-40 (manufactured by Sakai Chemical Industry), surface-treated barium sulfate B-30, B-34 (manufactured by Sakai Chemical Industry) , W-1, W-6, W-10, C-300 (manufactured by Takehara Chemical Industry Co., Ltd.) and the like.
As silica commercial products, Aerosil 50, Aerosil 200, Aerosil 380, Aerosil A300 and other A series, RY300 and other RY series (manufactured by Nippon Aerosil Co., Ltd.); WACKER HDK S13, WACKER HDK V15, WACKER HDK N20 (all "Fine Seal B" (trade name, manufactured by Tokuyama), "Fine Seal" (produced by Tokuyama), "Siricia" (produced by Fuji Silysia Chemical), Snowtex UP, Snowtex OUP (Nissan) Chemical Co., Ltd.), Cybersil Asia Co. Megasil 950, Nippon Silica Industry Co., Ltd. Nipsil L-300, Nipsil KQ and the like.
As a commercial item of talc, LMS-100, LMS-200, LMS-300, LMS-3500, LMS-400, LMP-100, PKP-53, PKP-80, PKP-81 (manufactured by Fuji Talc Industrial Co., Ltd.), D-600, D-800, D-1000, P-2, P-3, P-4, P-6, P-8, SG-95 (made by Nippon Talc Co., Ltd.), etc. are mentioned. These can be used alone or in combination.

  Moreover, the following additives can be included in the white thermosetting resin composition of this invention as needed.

[Silane coupling agent]
The white curable resin composition of the present invention preferably further contains a silane coupling agent. By using the coupling agent, not only adhesion with a glass substrate that can be endured even in boiling water for 1 hour is obtained, but adhesion between the thermosetting component and titanium oxide in the molded body is improved. As for a silane coupling agent, only 1 type may be used and 2 or more types may be used together.
Although it does not specifically limit as a silane coupling agent, For example, generally an epoxy silane coupling agent, an aminosilane coupling agent, a cationic silane coupling agent, a vinyl silane coupling agent, an acrylic silane coupling agent, a mercaptosilane System coupling agents and composite coupling agents of these.
It is preferable that the compounding quantity of a silane coupling agent is 0.1 to 15 mass parts with respect to 100 mass parts of total amounts of the said (a) copolymerization epoxy and (b) hardening | curing agent. When the amount is 0.1 parts by mass or more, the effect becomes clear, and when the amount is 15 parts by mass or less, the white curable resin composition does not increase in viscosity and is advantageous in terms of cost. More preferably, it is 10 parts by mass or less.

  Examples of commercially available silane coupling agents include KA-1003, KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502, KBM- 503, KBE-502, KBE-503, KBM-5103, KBM-602, KBM-603, KBE-603, KBM-903, KBE-903, KBE-9103, KBM-9103, KBM-573, KBM-575, KBM-6123, KBE-585, KBM-703, KBM-802, KBM-803, KBE-846, KBE-9007 (all trade names, manufactured by Shin-Etsu Silicone), Silquest A-186, Silquest A-187, Y -9805 (Brand name, Momentive Performance Materials, Inc.). These can be used alone or in combination of two or more.

[Dispersant]
A dispersant can be blended for the purpose of improving the dispersibility and sedimentation properties of the titanium oxide. This dispersant is used to adjust the filling properties of the composition into the minute recesses, the surface smoothness of the cured film, the defoaming property or the surface tension of the composition.
As this dispersing agent, ANTI-TERRAU, ANTI-TERRA-U100, ANTI-TERRA-204, ANTI-TERRA-205, DISPERBYK-101, DISPERBYK-102, DISPERBYK-103, DISPERBYK-106, DISPERBYK-108, DISPERBYK 109, DISPERBYK-110, DISPERBYK-111, DISPERBYK-112, DISPERBYK-116, DISPERBYK-130, DISPERBYK-140, DISPERBYK-142, DISPERBYK-145, DISPERBYK-161, DISPERBYK-162, 63 DISPERBYK-166 DISPERBYK-167, DISPERBYK-168, DISPERBYK-170, DISPERBYK-171, DISPERBYK-174, DISPERBYK-180, DISPERBYK-182, DISPERBYK-183, DISPERBYK-185, DISPERBYK-184, DISPERBYK-184, SPPERBYK-184 2009, DISPERBYK-2020, DISPERBYK-2025, DISPERBYK-2050, DISPERBYK-2070, DISPERBYK-2096, DISPERBYK-2150, BYK-P104, BYK-P104S, BYK-P105, BYK-9076, BYK-9076, BYK-776 Bit Manufactured by Chemie Japan), Disparon 2150, Disparon 1210, Disparon KS-860, Disparon KS-873N, Disparon 7004, Disparon 1830, Disparon 1860, Disparon 1850, Disparon DA-400N, Disparon PW-36, Disparon DA-703 50 (manufactured by Enomoto Kasei Co., Ltd.), Floren G-450, Floren G-600, Floren G-820, Floren G-700, Floren DOPA-44, Floren DOPA-17 (manufactured by Kyoeisha Chemical Co., Ltd.) and the like.
In order to achieve the above object, the blending amount of the dispersant is 0.1 to 10 parts by mass, preferably 0.5 to 5 parts by mass with respect to 100 parts by mass of titanium oxide.

[Light stabilizer]
Furthermore, a hindered amine light stabilizer can be blended with the white curable resin composition of the present invention for the purpose of reducing photodegradation of the cured product.
As this hindered amine light stabilizer, Tinuvin 622LD, Tinuvin 144; CHIMASSORB 944LD, CHIMASSORB 119FL (all of which are manufactured by BASF Japan); MARK LA-57, LA-62, LA-67, LA-63, LA-68 ( These are all manufactured by ADEKA); Sanol LS-770, LS-765, LS-292, LS-2626, LS-1114, LS-744 (all of which are manufactured by Sankyo Lifetech).
It is preferable that the compounding quantity of the said hindered amine light stabilizer is 0.1-10 mass parts with respect to a total of 100 mass parts of said (a) copolymerization epoxy and (b) hardening | curing agent.
The composition of the present invention may contain a thioxanthone-based photopolymerization sensitizer, a polymerization inhibitor, a thickener, a leveling agent, a coupling agent, a flame retardant aid and the like.

[Adhesion promoter]
The composition of this invention can contain a well-known and usual mercapto compound and an adhesion promoter, in order to improve adhesiveness with base materials, such as a polyimide, as needed. Mercapto compounds such as 2-mercaptopropionic acid, trimethylolpropane tris (2-thiopropionate), 2-mercaptoethanol, 2-aminothiophenol, 3-mercapto-1,2,4-triazole, etc. Examples thereof include silane coupling agents. Examples of the adhesion promoter include benzimidazole, benzoxazole, benzthiazole, 2-mercaptobenzimidazole, 2-mercaptobenzoxazole, 2-mercaptobenzthiazole, 3-morpholinomethyl-1-phenyl-triazole-2-thione, Examples include 5-amino-3-morpholinomethyl-thiazole-2-thione, 2-mercapto-5-methylthio-thiadiazole, triazole, tetrazole, benzotriazole, carboxybenzotriazole, amino group-containing benzotriazole, and vinyltriazine. These may be used alone or in combination of two or more.

[Colorant]
Moreover, the white curable resin composition of this invention can contain another coloring agent further. As the colorant to be used, conventionally known colorants such as red, blue, green, yellow, and white can be used, and any of pigments, dyes, and pigments may be used. As a specific example, the following color index (CI; issued by The Society of Dyers and Colorists) numbers can be given.

Red colorant:
Examples of red colorants include monoazo, diazo, azo lake, benzimidazolone, perylene, diketopyrrolopyrrole, condensed azo, anthraquinone, and quinacridone. It is done.
Monoazo: Pigment Red 1, 2, 3, 4, 5, 6, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 112, 114, 146, 147, 151 , 170, 184, 187, 188, 193, 210, 245, 253, 258, 266, 267, 268, 269.
Disazo: Pigment Red 37, 38, 41.
Monoazo lakes: Pigment Red 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53: 1, 53: 2, 57 : 1, 58: 4, 63: 1, 63: 2, 64: 1, 68.
Benzimidazolone series: Pigment Red 171, Pigment Red 175, Pigment Red 176, Pigment Red 185, Pigment Red 208.
Perylene series: Solvent Red 135, Solvent Red 179, Pigment Red 123, Pigment Red 149, Pigment Red 166, Pigment Red 178, Pigment Red 179, Pigment Red 190, Pigment Red 194, Pigment Red 224.
Diketopyrrolopyrrole series: Pigment Red 254, Pigment Red 255, Pigment Red 264, Pigment Red 270, Pigment Red 272.
Condensed azo series: Pigment Red 220, Pigment Red 144, Pigment Red 166, Pigment Red 214, Pigment Red 220, Pigment Red 221 and Pigment Red 242.
Anthraquinone series: Pigment Red 168, Pigment Red 177, Pigment Red 216, Solvent Red 149, Solvent Red 150, Solvent Red 52, Solvent Red 207.
Kinacridone series: Pigment Red 122, Pigment Red 202, Pigment Red 206, Pigment Red 207, Pigment Red 209.

Blue colorant:
Blue colorants include phthalocyanine and anthraquinone, and pigments are compounds classified as Pigment, specifically: Pigment Blue 15, Pigment Blue 15: 1, Pigment Blue 15: 2, Pigment Blue 15: 3, Pigment Blue 15: 4, Pigment Blue 15: 6, Pigment Blue 16, Pigment Blue 60.
The dye systems include Solvent Blue 35, Solvent Blue 63, Solvent Blue 68, Solvent Blue 70, Solvent Blue 83, Solvent Blue 87, Solvent Blue 94, Solvent Blue 97, Solvent Blue 122, Solvent Blue 136, Solvent Blue 67, Solvent Blue 70 etc. can be used. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.

Green colorant:
Similarly, green colorants include phthalocyanine, anthraquinone, and perylene. Specifically, Pigment Green 7, Pigment Green 36, Solvent Green 3, Solvent Green 5, Solvent Green 20, Solvent Green 28, etc. are used. be able to. In addition to the above, a metal-substituted or unsubstituted phthalocyanine compound can also be used.

Yellow colorant:
Examples of yellow colorants include monoazo, disazo, condensed azo, benzimidazolone, isoindolinone, anthraquinone, and the like.
Anthraquinone series: Solvent Yellow 163, Pigment Yellow 24, Pigment Yellow 108, Pigment Yellow 193, Pigment Yellow 147, Pigment Yellow 199, Pigment Yellow 202.
Isoindolinone type: Pigment Yellow 110, Pigment Yellow 109, Pigment Yellow 139, Pigment Yellow 179, Pigment Yellow 185.
Condensed azo series: Pigment Yellow 93, Pigment Yellow 94, Pigment Yellow 95, Pigment Yellow 128, Pigment Yellow 155, Pigment Yellow 166, Pigment Yellow 180.
Benzimidazolone series: Pigment Yellow 120, Pigment Yellow 151, Pigment Yellow 154, Pigment Yellow 156, Pigment Yellow 175, Pigment Yellow 181.
Monoazo: Pigment Yellow 1, 2, 3, 4, 5, 6, 9, 10, 12, 61, 62, 62: 1, 65, 73, 74, 75, 97, 100, 104, 105, 111, 116 , 167, 168, 169, 182, 183.
Disazo: Pigment Yellow 12, 13, 14, 16, 17, 55, 63, 81, 83, 87, 126, 127, 152, 170, 172, 174, 176, 188, 198.

White colorant:
Examples of the white colorant include alumina, magnesium oxide, ammonium oxide, aluminum hydroxide, magnesium carbonate, barium carbonate, and magnesium hydroxide.

In addition, a colorant such as purple, orange, brown, or black may be added for the purpose of adjusting the color tone.
Specifically, PigmentViolet 19, 23, 29, 32, 36, 38, 42, Solvent Violet 13, 36, CI Pigment Orange 1, CI Pigment Orange 5, CI Pigment Orange 13, CI Pigment Orange 14, CI Pigment Orange 16, CI Pigment Orange 17, CI Pigment Orange 24, CI Pigment Orange 34, CI Pigment Orange 36, CI Pigment Orange 38, CI Pigment Orange 40, CI Pigment Orange 43, CI Pigment Orange 46, CI Pigment Orange 49, CI Pigment Orange 51, CI Pigment Orange 61, CI Pigment Orange 63, CI Pigment Orange 64, CI Pigment Orange 71, CI Pigment Orange 73, CI Pigment Brown 23, CI Pigment Brown 25, CI Pigment Black 1, CI Pigment Black And the like.
Although the compounding quantity of a coloring agent does not have a restriction | limiting in particular, Preferably it is 0.01-10 mass parts with respect to 100 mass of said titanium oxides, Most preferably, it is 0.1-5 mass parts.

[Organic solvent]
Furthermore, the thermosetting resin composition of this invention can use an organic solvent as a diluent for the dilution of a composition, or the viscosity adjustment for apply | coating to a board | substrate or a carrier film.
Examples of such organic solvents include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, and the like. More specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate , Esters such as propylene glycol butyl ether acetate; ethanol, propano , Ethylene glycol, alcohols such as propylene glycol; octane, aliphatic hydrocarbons decane; petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and petroleum solvents such as solvent naphtha. Such an organic solvent may be used individually by 1 type, and may be used as a 2 or more types of mixture. The amount of the organic solvent used is not particularly limited, and may be appropriately added as necessary.

  The thermosetting resin composition of the present invention is adjusted to a viscosity suitable for the coating method using, for example, the organic solvent, and on the substrate, dip coating method, flow coating method, roll coating method, bar coater method, screen printing method A tack-free coating film can be formed by applying the organic solvent contained in the composition at a temperature of about 50 to 300 ° C. by volatile drying (temporary drying).

[Leveling agent]
Examples of leveling agents include polyacrylate polymers, polyether-modified dimethylpolysiloxane copolymers, polyester-modified dimethylpolysiloxane copolymers, polyether-modified methylalkylpolysiloxane copolymers, and aralkyl-modified methylalkylpolysiloxane copolymers. Examples thereof include a polymer and a polyether-modified methyl alkyl polysiloxane copolymer. Leveling agents may be used alone or in combination of two or more. Examples of commercially available leveling agents include BYK-352 and BYK-354 manufactured by Big Chemie GMBH. As a compounding quantity of a leveling agent, Preferably it is 0.01-10 weight part with respect to 100 mass parts of copolymerization epoxy resins, More preferably, it is 1-8 mass parts.

[Defoamer]
Specific examples of the antifoaming agent include BYK (registered trademark) -054, -055, -057, and -1790 manufactured by Big Chemie Japan Co., Ltd. as an antifoaming agent comprising a commercially available non-silicone-based foam-breaking polymer solution. Examples of the silicone-based antifoaming agent include BYK (registered trademark) -063, -065, -066N, -067A, -077 manufactured by Big Chemie Japan, and dimethyl manufactured by Toray Dow Corning Silicone. Silicone oil SH200 series, etc. are mentioned.

〔substrate〕
As a board | substrate used for this invention, resin films, such as a polyimide film and PET film, a glass substrate, a ceramic substrate, a metal substrate, a wafer board, etc. can be mentioned. Among these, a polyimide film, a resin film such as a PET film, and a glass substrate can be preferably used. The material and shape of the substrate are selected depending on the intended use and performance of the molded product, and if necessary, two or more kinds of materials and shapes can be combined. Moreover, a glass substrate is more preferable from the viewpoint of adhesion.

[Production / mixing method]
The white thermosetting resin composition of the present invention can be produced by uniformly mixing the above essential components and other additive components used as necessary. A known method can be used as the mixing method, and is not particularly limited. Any of a method of mixing without using a disperser and a method of mechanically mixing with various dispersers such as a kneader, a roll, an attritor, and a bead mill may be used.
As a particularly preferable method, the insulating filler, a solvent, and a dispersing agent are blended in advance, and the dispersion liquid dispersed with a disperser such as a roll mill is mixed with other curable resin components, or, if necessary, a roll mill again. A method obtained by dispersing, or by mixing a part of the resin component, the insulating filler, the solvent, and a dispersing agent in advance and dispersing with a dispersing machine such as a roll mill, or other curable resin component, or The method of obtaining by roll mill dispersion again as needed is mentioned.
In addition, when adding the colorant, from the viewpoint of dispersibility, the colorant dispersant is dissolved or finely dispersed in a mixed liquid in which powders such as the colorant are previously dispersed in water or an organic solvent. It is preferable to add and mix the solution.

[Coating method]
After preparing the white thermosetting resin composition in a predetermined composition in this way, for example, adjusting the viscosity to be suitable for the coating method with an organic solvent, on the substrate, for example, dip coating method, flow coating method, The coating can be performed by a roll coating method, a bar coater method, a screen printing method, a curtain coating method, or the like. Among these, the flow coating method, the roll coating method, the bar coater method, and the screen printing method are preferably used, and the screen printing method is particularly preferably used.

EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated concretely, this invention is not limited only to these Examples. In the following description, “part” means part by mass and “%” means mass% unless otherwise specified.

*1 DM4500、ダブルボンドケミカル（股）製、エポキシ当量：１９６〜２０２
*2 DM3450、ダブルボンドケミカル（股）製、エポキシ当量：約２７５
*3 A-266、ＤＩＣコーポレーション製、エポキシ当量：５６０〜６００
*4 4MHHPA、台湾南亜プラスチック（股）製、メチルヘキサヒドロフタル酸無水物
*5 THPA、台湾南亜プラスチック（股）製、テトラヒドロフタル酸無水物
*6 CHINOX TP-10H、ダブルボンドケミカル（股）製、フェノール系酸化防止剤
*7 R-KB-6、バイエルＡＧ社製、アルミナにより表面処理されたルチル型酸化チタン
*8 Silquest A-187 モメンティブ・パフォーマンス・マテリアルズ社製、有機シラン
*9 B-30、堺化学工業（株）製 平均粒径：０．３μｍ 表面処理硫酸バリウム
*10 Nipsil L300 、日本シリカ工業（株）製 平均粒径２．２μｍ
*11 SG-95、日本タルク（株）製 含水ケイ酸マグネシウム 平均粒径（Ｄ_５０）：２．５μｍ
*12 BYK-110、BYK-ChemieJapan製、酸性基含有共重合体
*13 BYK-354、BYK-ChemieJapan製、ポリアクリレート系レベリング剤
*14 DEAC、Polynt UKLtd.製 ジエチレングリコールモノエチルエーテルアセテート (Examples 1-7 , Reference Example 1 and Comparative Examples 1-2)
Various components shown in Table 1 below were blended in the proportions (parts by mass) shown in Table 1, premixed with a stirrer, and then kneaded with a three-roll mill to prepare a thermosetting resin composition paste.

* 1 DM4500, double bond chemical (thigh), epoxy equivalent: 196-202
* 2 DM3450, double bond chemical (thigh), epoxy equivalent: approx. 275
* 3 A-266, manufactured by DIC Corporation, epoxy equivalent: 560-600
* 4 4MHHPA, Made in Taiwan Nanya Plastic (Thigh), Methylhexahydrophthalic anhydride
* 5 THPA, Taiwan Nanya Plastic (Thigh), Tetrahydrophthalic anhydride
* 6 CHINOX TP-10H, manufactured by Double Bond Chemical (crotch), phenolic antioxidant
* 7 R-KB-6, manufactured by Bayer AG, rutile titanium oxide surface-treated with alumina
* 8 Silquest A-187 Momentive Performance Materials, Organosilane
* 9 B-30, manufactured by Sakai Chemical Industry Co., Ltd. Average particle size: 0.3 μm Surface-treated barium sulfate
* 10 Nipsil L300, manufactured by Nippon Silica Industry Co., Ltd. Average particle size 2.2μm
* 11 SG-95, manufactured by Nippon Talc Co., Ltd. Hydrous magnesium silicate Average particle diameter (D ₅₀ ): 2.5 μm
* 12 BYK-110, BYK-ChemieJapan, acidic group-containing copolymer
* 13 BYK-354, manufactured by BYK-ChemieJapan, polyacrylate leveling agent
* 14 Diethylene glycol monoethyl ether acetate from DEAC, Polynt UK Ltd.

(Production of evaluation glass substrate)
The paste of the thermosetting resin composition obtained in Examples 1 to 7, Reference Example 1 and Comparative Examples 1 and 2 was screen printed using a 420 mesh screen, and the thickness of the cured film was about 18 μm after drying. The glass substrate (Corning International Co., Ltd. gorilla glass, thickness 0.7 mm) was coated so as to be, and the coated glass substrate was placed in an oven (DH-62, manufactured by Yamato Kagaku Co., Ltd.). After heat baking for minutes, the glass substrate was allowed to cool to room temperature. The coating, heating baking, and cooling were repeated three times, and then again placed in an oven and heated and baked at 220 ° C. for 40 minutes to produce an evaluation glass substrate on which a 18 μm cured film was formed.
Using the glass substrate on which the cured film of each thermosetting resin composition was formed, the following various properties were evaluated by the following methods.

<Solvent resistance>
Use a lens paper to which a small amount of alcohol (95 vol%), dipropylene glycol monomethyl ether (DPM) (100 vol%), isopropyl alcohol (IPA) (100 vol%) is attached to a lens paper made by Kimberly Clark. After the glass substrate film was wiped about 20 times repeatedly, the surface of the film was visually observed.
○: No change was confirmed.
Δ: A slight change was confirmed.
X: The film peeled off.

<Sulfuric acid resistance>
After immersing the glass substrate in a 10 vol% sulfuric acid aqueous solution at 25 ° C. for 30 minutes and washing with water, the moisture was removed, and the intrusion of water or the elution of the film was visually confirmed. Next, a transparent adhesive tape (manufactured by Nichiban Co., Ltd., width: 18 mm) is completely attached to the film side of the evaluation glass substrate, and immediately pulled apart while keeping one end of the tape at right angles to the glass substrate. The film was evaluated as follows.
○: No change was confirmed.
Δ: A slight change was confirmed.
X: Water permeation or film peeling was confirmed.

<Hydrochloric acid resistance>
The glass substrate was immersed in a 10 vol% hydrochloric acid aqueous solution at 25 ° C. for 30 minutes and washed with water. Then, the water was removed, and water intrusion or film elution was visually confirmed. Next, a transparent adhesive tape (manufactured by Nichiban Co., Ltd., width: 18 mm) is completely attached to the film side of the evaluation glass substrate, and immediately pulled apart while keeping one end of the tape at right angles to the glass substrate. The film was evaluated as follows.
○: No change was confirmed.
Δ: A slight change was confirmed.
X: Water permeation or film peeling was confirmed.

<Alkali resistance>
After immersing the glass substrate in a 10 vol% NaOH aqueous solution at 25 ° C. for 30 minutes and washing with water, the water was removed, and water permeation or film elution was confirmed visually. Next, a transparent adhesive tape (manufactured by Nichiban Co., Ltd., width: 18 mm) is completely attached to the film side of the evaluation glass substrate, and immediately pulled apart while keeping one end of the tape at right angles to the glass substrate. The film was evaluated as follows.
○: No change was confirmed.
Δ: A slight change was confirmed.
X: Water permeation or film peeling was confirmed.

<High temperature insulation resistance>
The glass substrate is baked in an oven at 230 ° C. for 60 minutes, and the distance between the positive electrode and the negative electrode of the resistance meter (Agilent Technologies, high resistance meter 4339B, component test fixture 16339A) is 0.5 cm. The film resistance was measured under the conditions of voltage: 500 V, time: 60 seconds, and the film resistance was evaluated as follows.
○: Resistance of more than 10 ¹⁰ Ω Δ: Resistance of 10 ¹⁰ or more and 10 ⁸ or less ×: Resistance of less than 10 ⁸ Ω

<Light shielding (OD value)>
The glass substrate was attached to a transmission densitometer (manufactured by Sakata Inx Engineering, model number: X-Rite 361T, light source wavelength: 400-800 nm) with the film side facing the measuring device, and the OD value was evaluated as follows.
○: OD value is over 0.7 Δ: OD value is 0.5 or more and 0.7 or less ×: OD value is less than 0.5

<Adhesion (cross-cut adhesion test method)>
In accordance with JISK5400, 100 1 mm grids (10 × 10) are made on the sample film, and a transparent adhesive tape (Nichiban Co., Ltd., width: 18 mm) is completely adhered on the grids. While keeping one end at a right angle to the glass substrate, it was pulled away instantaneously, and the number of grids remaining without being completely peeled was examined.
Table 2 below shows the results with the number of remaining grids as the numerator and the total number of grids (100) as the denominator.
○: 100% of the grid pattern remained.
(Triangle | delta): 95-99% of cross-cuts remained.
X: A grid of less than 95% remained.

<High temperature discoloration resistance>
The glass substrate is placed in a DEN YNG high-temperature oven (manufactured by Torigi Co., Ltd., model number: DH-400), baked at 300 ° C. for 1 hour, and using a spectrocolorimeter (manufactured by Konica Minolta, CM-2600d), The discoloration degree (ΔE) of the coating film surface of the glass substrate was measured and evaluated as follows.
○: ΔE is less than 1.2 Δ: ΔE is 1.2 or more and less than 1.5 ×: ΔE is 1.5 or more

<UV radiation discoloration resistance>
After repeatedly irradiating the glass substrate twice using an ultraviolet irradiator (Gundo Kogyo Co., Ltd., model number: GUC-384) so that the ultraviolet irradiation energy is 2000 mJ / cm ² , The degree of color change (ΔE) was measured and evaluated as follows.
○: ΔE is less than 1.2 Δ: ΔE is 1.2 or more and less than 1.5 ×: ΔE is 1.5 or more

<High temperature crack resistance>
The glass substrate is placed in a DENG YNG high-temperature oven (manufactured by Torigi Co., Ltd., model number: DH-400), heated at 230 ° C. for 1 hour, and electron microscope (50 times, manufactured by Olympus, model number: MEASURING MICROSCOPE STM-MJS2 ), The coating film surface flatness of the glass substrate was evaluated as follows.
○: No crack Δ: Crack occurrence rate is 0% or more and less than 50% ×: Crack occurrence rate is 50% or more

<Hot water resistance (hot water test)>
After immersing the glass substrate in boiling water at 100 ° C. for 60 minutes, the glass substrate was taken out and the surface moisture was removed, and then water intrusion or film deposition was visually confirmed. Next, a transparent adhesive tape (manufactured by Nichiban Co., Ltd., width: 18 mm) was completely attached to the film side of the evaluation glass substrate, and immediately pulled away while keeping one end of the tape at right angles to the glass substrate. The coating was evaluated as follows.
○: No change was confirmed.
Δ: A slight change was confirmed.
X: Water permeation or film peeling was confirmed.

<Surface flatness>
Using a surface roughness meter (manufactured by Kosaka Laboratory, model number: SE3500), measurement length: 2.5 mm, longitudinal magnification: 1000, lateral magnification: 100, cutoff: 0.8 mm, speed: 0.5 mm / The surface roughness (maximum peak height, RmaxD) was measured three times under the condition of s, and evaluated as follows.
○: RmaxD is less than 2 μm Δ: RmaxD is 2 μm or more and less than 3 μm ×: RmaxD is 3 μm or more

<Pencil hardness test>
In accordance with JIS K5400 (1990 edition), a pencil hardness meter (manufactured by Toyo Seiki, model number: C221A), about 4 to 9 H pencils sharpened so that the tip of the core becomes flat on each glass substrate. Pressing at an angle of °, the hardness of the pencil at which no film peeling occurred was recorded.
The results of each evaluation test are summarized in Table 2.

As shown in Table 2, each of Examples 1 to 7 and Reference Example 1 according to the present embodiment can achieve a high level of adhesion, surface flatness, and curability, and can achieve high-temperature discoloration resistance and ultraviolet irradiation. It was excellent in discoloration resistance and surface flatness. In particular, it was confirmed that when a silane coupling agent was added, the hot water resistance was further improved. On the other hand, Comparative Example 1 using a composition containing a copolymerized epoxy resin having an epoxy equivalent exceeding 500 is inferior in terms of high-temperature discoloration resistance and surface flatness. Further, as in the embodiment of the present application, Comparative Example 2 using a composition containing a copolymerized epoxy having an epoxy equivalent of less than 500 is excellent in surface flatness, but the curing agent used is a curing having an aromatic ring. Therefore, resistance to high-temperature discoloration and resistance to discoloration due to ultraviolet irradiation are insufficient.

Claims (5)

(A) An epoxy equivalent having no aromatic ring is in the range of less than 500, a copolymerized epoxy resin of an epoxy group-containing unsaturated compound and an unsaturated compound, and (b) having an aromatic ring as an epoxy curing agent. A white thermosetting resin composition for decorating a glass substrate, comprising: an acid anhydride that is not used; (c) an antioxidant; (d) titanium oxide; and a silane coupling agent. The said antioxidant (c) is a phenolic antioxidant, The white thermosetting resin composition for decorating with respect to the glass substrate of Claim 1 characterized by the above-mentioned. Furthermore, the white thermosetting resin composition for decorating with respect to the glass substrate of Claim 1 or 2 characterized by including at least 1 sort (s) chosen from the group which consists of barium sulfate, a silica, and a talc. It formed on the board | substrate, The hardened | cured material of the white thermosetting resin composition for decorating with respect to the glass substrate of any one of Claims 1-3 characterized by the above-mentioned.   A display member comprising the cured product according to claim 4.