JP2015193758A - Photosensitive resin composition for overcoat and coating film using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin composition from which such a coating film can be formed that has good adhesiveness to a substrate or an undercoat and excels in film hardness, etchant durability, and moisture-heat resistance, and a protective film or an insulating film for a touch panel using the composition.SOLUTION: A photosensitive resin composition for an overcoat is provided, which comprises an alkali-soluble resin (A), a silane coupling agent (I), and a compound (C) containing an isocyanurate skeleton. A coating film is formed from the photosensitive resin composition for an overcoat.

Description

  The present invention relates to a photosensitive resin composition for overcoat and a coating film using the same. This coating film can be used suitably for the coating film for overcoats used for a touch panel, a liquid crystal display device, an organic EL device, etc.

  In recent years, as electronic devices have become more sophisticated, diversified, and smaller and lighter, a transparent touch panel is mounted on the front surface of a display element such as a liquid crystal, and characters, symbols, patterns, etc. displayed on the display element through this transparent touch panel There are an increasing number of devices that perform visual recognition and selection, and switch each function of the device by operating a transparent touch panel.

  The touch panel is, for example, a bank ATM, a vending machine, a personal digital assistant (PDA, UMPC), a copier, a facsimile, a portable game machine, a guide board, a car navigation, a multimedia station (a multifunction terminal installed in a convenience store) ), And rapidly becoming widespread as input devices such as mobile phones, railway vehicle monitoring devices, and answering devices such as quiz programs.

Existing touch panel systems can be classified into a resistive film system, an optical system, an electrostatic capacity system, an ultrasonic system, a pressure system, an electromagnetic wave induction system, an image recognition system, a vibration detection system, and the like.
Specific examples of a touch panel arranged on a display device such as a liquid crystal include a resistance film method and a capacitance method. The resistance film method is a method of detecting a pressed position by voltage, and a capacitance method. Detects the position by capturing the change in capacitance caused by pressing.
As for the electrostatic capacity method, Patent Documents 1 to 3 and the like are disclosed, and an insulating film and a protective film are provided in the laminated structure in order to prevent erroneous recognition of a contact position.

  The performance required for this insulating film and protective film is: adhesion to substrates, bases, and other layers (glass, inorganic materials, metal materials, transparent electrodes such as ITO, organic materials, etc.), etching of ITO and molybdenum There are demands for resistance to liquids (etchant resistance), heat resistance to a high-temperature firing process in the touch panel manufacturing process, and transmittance when a laminated substrate is used.

  In addition, an insulating film and a protective film used for touch panel applications are required to have high surface hardness, and Patent Document 4 discloses a method of adding inorganic oxide fine particles to a resin component.

Furthermore, as a protective film for touch panels, there is a demand for a quality change protective film, that is, a protective film excellent in moisture and heat adhesion even in a severe environment of high temperature and high humidity. However, these methods have been studied for improving the adhesion to the transparent conductive film (Patent Document 5). However, in these methods, yellowing occurs due to a baking process at a high temperature, the transmittance decreases, and moisture resistance is reduced. There are problems such as insufficient coexistence with thermal adhesion.
That is, the conventional resin composition is excellent in adhesion to the substrate, film hardness, and resistance, and cannot satisfy all of the transmittance, wet heat resistance adhesion, and the like.

JP 2008-65748 A JP 2009-15490 A JP 2010-44453 A JP 2000-281863 A JP 2013-76793 A

  An object of the present invention is to provide a resin composition that can form a coating film that has good adhesion to a base material, an underlayer, etc., and is excellent in film hardness, etchant resistance, and heat and humidity resistance, and a protective film or touch panel using the resin composition An object is to provide an insulating film.

  As a result of intensive studies on new means that can solve the above problems, the present inventors contain an alkali-soluble resin (A), a silane coupling agent (I), and an isocyanurate skeleton-containing compound (C1). The present inventors have found that the resin composition can be excellent in adhesion, film hardness, and various resistances for overcoat applications, and have reached the present invention.

  That is, the present invention relates to an overcoat resin composition comprising an alkali-soluble resin (A), a silane coupling agent (I), and an isocyanurate skeleton-containing compound (C).

In the present invention, the isocyanurate skeleton-containing compound (C) contains the isocyanurate skeleton-containing compound (C1) represented by the following general formula (101). Related to things.
[In General Formula (101), R ₁ , R ₂ and R ₃ are each independently a hydrogen atom, a chlorine atom, a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent, or a general formula It is group represented by (1)-(8), and at least 1 is any group represented by general formula (1)-(8). ]


[In General Formulas (1) to (8), R ₄ , R ₅ and R ₆ are each independently either H or CH ₃ . n is an integer of 0-10. m is an integer of 1-20 each independently. l is an integer of 1-5. ]

  Further, the present invention is characterized in that the isocyanurate skeleton-containing compound (C1) represented by the general formula (101) is contained in an amount of 5 to 30% by weight in the entire solid content of the overcoat photosensitive resin composition. It is related with the photosensitive resin composition for overcoats of Claim 2.

  In the present invention, the isocyanurate skeleton-containing compound (C1) represented by the general formula (101) has at least one group represented by the general formulas (1), (3), and (4). The overcoat photosensitive resin composition is characterized by comprising:

Moreover, this invention contains alkali-soluble resin (A) including resin (A1) which has at least 1 sort (s) of structural unit chosen from the group which consists of the following structural unit (I), (B), and (C). It is related with the said photosensitive resin composition for overcoats characterized by the above-mentioned.

(A) Structural unit having an aromatic ring group represented by general formula (11) or general formula (12):

[In General Formula (11) and General Formula (12), R ⁵⁶ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may have a benzene ring. ]
(B) A structural unit having an aliphatic cyclic group represented by chemical formula (14) or chemical formula (15):
(C) Structural unit having a compound represented by the following general formula (40) as a precursor:

[In General Formula (40), R ₂₁ and R ₂₂ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]

[In General Formula (41), R ₂₃ and R ₂₄ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]

  In the present invention, the alkali-soluble resin (A) is composed of a resin (A1-a) having the structural units (A) and (B) and a resin (A1-b) having the structural unit (C). The photosensitive resin composition for overcoat, comprising at least one resin selected from the above.

  The present invention also relates to the above-mentioned photosensitive resin composition for overcoat, wherein the silane coupling agent (I) is contained in an amount of 0.05 to 20% by weight in the entire solid content.

  The present invention further comprises inorganic fine particles (D) of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, indium, tin, antimony and cerium. The present invention relates to a photosensitive resin composition for overcoat.

  The present invention also relates to the above-mentioned photosensitive resin composition for overcoat, wherein the inorganic fine particles (D) are inorganic fine particles of zirconium or titanium.

  In the present invention, the silane coupling agent (I) contains at least one organic group selected from a (meth) acryloyl group, a glycidyl group, an epoxycyclohexyl group, and a carbamic acid group. The present invention relates to a photosensitive resin composition for coating.

  Moreover, this invention relates to the coating film formed from the said photosensitive resin composition for overcoats.

  The photosensitive resin composition of the present invention has good adhesion to a substrate, a base, and the like, and further has excellent film hardness, etchant resistance, and moist heat resistance, and the coating film formed from the photosensitive resin composition is: It can be suitably used as an overcoat for a touch panel, a liquid crystal display device, an organic EL device or the like.

First, the photosensitive resin composition of the present invention will be described.
In the present application, when “(meth) acryloyl”, “(meth) acryl”, “(meth) acrylic acid”, “(meth) acrylate”, or “(meth) acrylamide” is particularly described, Unless otherwise indicated, “acryloyl and / or methacryloyl”, “acrylic and / or methacrylic”, “acrylic acid and / or methacrylic acid”, “acrylate and / or methacrylate”, or “acrylamide and / or methacrylamide”, respectively. It shall represent.

The photosensitive resin composition of the present invention comprises an alkali-soluble resin (A), a silane coupling agent (I), and an isocyanurate skeleton-containing compound (C). It is a composition.
It is.

  Various components of the photosensitive resin composition of the present invention will be described.

<Resin>
The photosensitive resin composition by this invention can form the coating film which is excellent in developability, hardness, adhesiveness, and etchant tolerance, and has heat-and-moisture resistance by containing alkali-soluble resin (A).

Among the alkali-soluble resins (A), including a resin (A1) having at least one selected from the group consisting of structural units (A), (B), and (C) described later, developability, hardness, It can be excellent in adhesion to the substrate and surface uniformity, which is preferable.
More preferably, since the hardness increases, the resin (A1-a) having the structural units (A) and (B), or the resin (A1-b) having the structural unit (C) in terms of excellent adhesion. is there.

(Alkali-soluble resin (A))
By containing the alkali-soluble resin (A), the photosensitive resin composition of the present invention can be made excellent in developability, hardness, adhesion to a substrate, and surface uniformity. Thereby, the curable photosensitive composition obtained is a composition in which an uncured part can be developed with an alkali developer, or when it further has a hydroxyl group, the acid group and hydroxyl group of the alkali-soluble resin (A) react with each other. Thus, a curable photosensitive composition capable of a crosslinking reaction utilizing the occurrence of an ester bond can be obtained. The acid group is not particularly limited, and examples thereof include a carboxyl group, a phenolic hydroxyl group, and a carboxylic anhydride group. These acid groups may be used alone or in combination of two or more.
Moreover, since it is excellent in compatibility, it is preferable that it is an alkali-soluble acrylic resin.

  It is preferable that content of alkali-soluble resin (A) is 5 to 100 weight% in the whole resin of the photosensitive resin composition. By being in this range, it is excellent in developability, hardness, adhesion, and etchant resistance. More preferably, it is 5-95 weight%, More preferably, it is 25-90 weight%.

  The alkali-soluble resin (A) is preferably used in an amount of 10 to 80% by weight in a total of 100% by weight of the solid content of the photosensitive composition. This is because if the resin (A) is 10% by weight or more, sufficient effects of improving adhesion and increasing hardness can be obtained, and if it is 80% by weight or less, sufficient coating film hardness can be easily obtained.

As the alkali-soluble resin (A), a resin obtained by copolymerizing an acidic group-containing ethylenically unsaturated monomer, or an ethylenically unsaturated monomer capable of giving an acid group after polymerization is used as an ethylenically unsaturated monomer. It can be obtained by polymerizing as a component. In addition, when an acid group is introduced using an ethylenically unsaturated monomer capable of imparting an acid group after polymerization as a monomer component, for example, a treatment for imparting an acid group as described below is required after the polymerization. Become.
In order to further improve the photosensitivity, a photosensitive resin having an ethylenically unsaturated double bond can be used.

  Further, it is preferably a resin copolymerized with an acidic group-containing ethylenically unsaturated monomer, more preferably a resin having an acid group derived from (meth) acrylic acid, imparting alkali developability, development. This is preferable for suppressing the subsequent decrease in hardness.

  When copolymerizing using an acidic substituent-containing ethylenically unsaturated monomer, for example, (meth) acrylic acid, itaconic acid, crotonic acid, o-, m-, p-vinylbenzoic acid, (meth) Ethylenically unsaturated monomers (unsaturated monobasic acids) having a carboxyl group, such as monocarboxylic acids such as α-position haloalkyl, alkoxyl, halogen, nitro, and cyano substituents of acrylic acid, and phenols such as N-hydroxyphenylmaleimide An ethylenically unsaturated monomer having an ionic hydroxyl group, polybasic acid anhydrides such as tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride, and the like can be used.

Examples of the ethylenically unsaturated monomer that can impart an acid group after polymerization include, for example, an ethylenically unsaturated monomer having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, and an epoxy group such as glycidyl (meth) acrylate. And ethylenically unsaturated monomers having
When using an ethylenically unsaturated monomer having a hydroxyl group, for example, it is obtained by copolymerizing an ethylenically unsaturated monomer having a hydroxyl group with another copolymerizable ethylenically unsaturated monomer. The hydroxyl group of the obtained copolymer can be reacted with a polybasic acid anhydride to introduce an acid group (carboxyl group). Or, when using an ethylenically unsaturated monomer having an epoxy group, for example, copolymerizing an ethylenically unsaturated monomer having an epoxy group with another copolymerizable ethylenically unsaturated monomer Then, an unsaturated monobasic acid having a carboxyl group is added to the side chain epoxy group of the copolymer thus obtained, and a polybasic acid anhydride is reacted with the generated hydroxyl group to produce an acid group (carboxyl). Group) can be introduced. In this method, when the hydroxyl group and the polybasic acid anhydride are reacted without excess or deficiency, the hydroxyl group disappears. On the other hand, a resin having a hydroxyl group in the side chain and an acid group such as a carboxyl group and an ethylenically unsaturated double bond is obtained by reacting a part of the hydroxyl group with a polybasic acid anhydride.

  When the ethylenically unsaturated monomer having an acid group is included, the content ratio is not particularly limited, but it is 2 to 80% by weight, preferably 5 to 5% of the total 100% by weight of all ethylenically unsaturated monomer components. It should be 55% by weight, more preferably 5 to 50% by weight. If the amount of the ethylenically unsaturated monomer having an acid group is too large, it may be easily gelled during copolymerization. On the other hand, if the amount is too small, effects such as compatibility and developability may be difficult to obtain. There is.

  When an ethylenically unsaturated monomer for imparting an acid group after polymerization is included, the content ratio is not particularly limited, but is 5 to 70% by weight in a total of 100% by weight of all ethylenically unsaturated monomer components. Preferably, it is 10 to 60% by weight.

  Moreover, as the structural unit of the alkali-soluble resin (A), in addition to the structural unit having an acid group, structural units (a), (b), (c), and (2) can be mentioned, and among these, The resin (A1) having at least one structural unit selected from the group consisting of structural units (a), (b) and (c) is preferred for imparting adhesion, and more preferably the structural unit. It is a resin (A1-a) having (a) and (b) or a resin (A1-b) having a structural unit (c).

(A) Structural unit having an aromatic ring group represented by general formula (11) or general formula (12):
[In General Formula (11) and General Formula (12), R ⁵⁶ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may have a benzene ring. ]
(B) A structural unit having an aliphatic cyclic group represented by chemical formula (14) or chemical formula (15):

(C) Structural unit having a compound represented by the following general formula (40) as a precursor:

[In General Formula (40), R ₂₁ and R ₂₂ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]
[In General Formula (41), R ₂₃ and R ₂₄ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]
(D) Other structural units

  Hereinafter, the structural unit (A), the structural unit (B), the structural unit (C), and the structural unit (D) will be described in order. In the present specification, the content weight% of each structural unit is the weight% of the precursor that brings each structural unit to the alkali-soluble resin (A). The resin (A) can be obtained by copolymerizing the structural unit having an acidic group and the structural units (a) to (d) so as to have an arbitrary ratio.

《Structural unit (b)》
The structural unit (a) has a cyclic structure with an aromatic ring group represented by the general formula (11) and the general formula (12), and contributes to improvement in hardness and developability.
Based on the weight of all the structural units of the resin (A), the structural unit (a) is 2 to 80% by weight from the viewpoint of developability. If it is 2% by weight or more, the developability is good, and if it is 80% by weight or less, the dissolution rate in an alkaline developer is fast and the development time is shortened, so that the productivity is improved, which is preferable.

[In General Formula (11) and General Formula (12), R ⁵⁶ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may have a benzene ring. ]

  As the precursor of the structural unit (a), styrene, α-methylstyrene, divinylbenzene, indene, acetylnaphthene, benzyl (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, (meth) of methylolated melamine Examples thereof include monomers / oligomers such as acrylic acid esters, and ethylenically unsaturated monomers represented by the general formula (13).

[In General Formula (13), R ⁵⁷ is a hydrogen atom or a methyl group, R ⁵⁸ is an alkylene group having 2 or 3 carbon atoms, and R ⁵⁹ is a carbon that may have a benzene ring. It is a C1-C20 alkyl group, and n1 is an integer of 1-15. ]

Examples of the ethylenically unsaturated monomer represented by the general formula (13) include:
New Frontier CEA [EO-modified cresol acrylate, ^R57 : hydrogen atom, ^R58 : ethylene group, ^R59 : methyl group, n1 = 1 or 2,], NP-2 [n-nonylphenoxypolyethylene manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd. Glycol acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : n-nonyl group, n1 = 2, N-177E [n-nonylphenoxypolyethylene glycol acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene Group, R ⁵⁹ : n-nonyl group, n1 = 16 to 17], or PHE [phenoxyethyl acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1],
Manufactured by Daicel, IRR169 [ethoxylated phenyl acrylate (EO 1 mol), R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1], or Ebecryl 110 [ethoxylated phenyl acrylate (EO 2 mol), R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 2],
Aronix M-101A manufactured by Toagosei Co., Ltd. [phenol EO modified (n1≈2) acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1≈2], M-102 [phenol EO modified ( n1≈4) acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1≈4], M-110 [paracumylphenol EO modified (n1≈1) acrylate, R ⁵⁷ : hydrogen atom , R ⁵⁸ : ethylene group, R ⁵⁹ : paracumyl, n1≈1], M-111 [n-nonylphenol EO-modified (n1≈1) acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : n- Nonyl group, n1≈1], M-113 [n-nonylphenol EO-modified (n1≈4) acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : N-nonyl group, n1≈4], or M-117 [n-nonylphenol PO-modified (n1≈2.5) acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : propylene group, R ⁵⁹ : n-nonyl group, n1≈2.5],
Kyoeisha light acrylate PO-A [phenoxyethyl acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1], P-200A [phenoxypolyethylene glycol acrylate, R ⁵⁷ : hydrogen atom, R ^58: an ethylene ^{group, R 59:} a hydrogen atom, n1 ≒ 2], NP- 4EA [ nonylphenol EO adduct ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene ^{group, R} 59: n-nonyl group, n1 ≒ 4 ], Or NP-8EA [[nonylphenol EO adduct acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : n-nonyl group, n1≈8], or light ester PO [phenoxyethyl methacrylate, R ⁵⁷ : Methyl group, R ⁵⁸ : propylene group, R ⁵⁹ : hydrogen atom, n1 = 1],
Manufactured by NOF Corporation Blemmer ANE-300 [nonylphenoxy polyethylene glycol ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene ^{group, R 59:} - nonyl group, n1 ≒ 5], ANP- 300 [ nonylphenoxy polypropylene glycol acrylate, R ^57: a hydrogen ^{atom, R 58:} a propylene ^{group, R} 59: n-nonyl group, n1 ≒ 5], 43ANEP- 500 [ nonylphenoxy - polyethylene glycol - polypropylene glycol - ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene group and propylene ^{group, R 59:} - nonyl group, n1 ≒ 5 + 5], 70ANEP-550 [ nonylphenoxy - polyethylene glycol - polypropylene glycol - ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene group and a propylene ^{group, R 59} n- nonyl group, n1 ≒ 9 + 3], 75ANEP-600 [ nonylphenoxy - polyethylene glycol - polypropylene glycol - ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene group and a propylene ^{group, R} 59: n- nonyl group, n1 ≒ 5 + 2], AAE-50 [phenoxypolyethylene glycol acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1], AAE-300 [phenoxypolyethylene glycol acrylate, R ⁵⁷ : hydrogen atom, ^R58 : ethylene group, ^R59 : hydrogen atom, n1≈5.5], PAE-50 [phenoxypolyethylene glycol methacrylate, ^R57 : methyl group, ^R58 : ethylene group, ^R59 : hydrogen atom, n1 = 1] PAE-100 [Phenoxypolyethyleneglycol ^{Methacrylate, R 57: methyl, R 58:} an ethylene ^{group, R 59:} a hydrogen atom, n1 = 2], or 43PAPE-600B [phenoxy - polyethylene glycol - polypropylene glycol - ^{methacrylate, R 57: methyl, R 58:} Ethylene group and propylene group, R ⁵⁹ : hydrogen atom, n1≈6 + 6],
NK ESTER AMP-10G [phenoxyethylene glycol acrylate (EO 1 mol), Shin Nakamura Chemical Co., Ltd., R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1], AMP-20G [phenoxyethylene glycol acrylate ^{(EO2mol), R 57:} a hydrogen ^{atom, R 58:} an ethylene ^{group, R 59:} a hydrogen atom, n1 ≒ 2], AMP- 60G [ phenoxy ethyleneglycol acrylate ^{(EO6mol), R 57:} a hydrogen ^{atom, R 58:} an ethylene group , R ⁵⁹ : hydrogen atom, n1≈6], PHE-1G [phenoxyethylene glycol methacrylate (EO 1 mol), R ⁵⁷ : methyl group, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1],
Biscoat # 192 [Phenoxyethyl acrylate, R ⁵⁷ : hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : hydrogen atom, n1 = 1] manufactured by Osaka Organic Chemical Co., Ltd.
Nippon Kayaku SR-339A [2-phenoxy ethyleneglycol ^{acrylate, R 57:} a hydrogen ^{atom, R 58:} an ethylene ^{group, R 59:} a hydrogen atom, n1 = 1], or SR-504 (ethoxylated nonylphenol ^{acrylate, R 57} : Hydrogen atom, R ⁵⁸ : ethylene group, R ⁵⁹ : n-nonyl group] and the like, but not limited thereto, two or more kinds may be used in combination.

In the ethylenically unsaturated monomer represented by the general formula (13), the alkyl group of R ⁵⁹ has 1 to 20 carbon atoms, more preferably 1 to 10 carbon atoms. The alkyl group includes not only a linear alkyl group but also a branched alkyl group and an alkyl group having a benzene ring as a substituent. When the carbon number of the alkyl group of R ⁵⁹ is 1 to 10, the adhesion to the substrate is enhanced, but when the carbon number exceeds 10, the long alkyl group tends to prevent the adhesion with the substrate. This tendency becomes remarkable in accordance with the carbon chain length of the alkyl group R ⁵⁹ is longer, when the number of carbon atoms exceeds 20, adhesion to a substrate extremely lowered. ^Examples of the alkyl group having a benzene ring represented by R59 include a benzyl group and a 2-phenyl (iso) propyl group. Developability is improved by adding one side chain benzene ring.

  In the ethylenically unsaturated monomer represented by the general formula (13), n1 is preferably an integer of 1 to 15. When n1 exceeds 15, the hydrophilicity increases and the effect of solvation decreases, and the viscosity of the resin (A) increases, and the viscosity of the photosensitive composition using this increases, which affects the fluidity. May give. From the viewpoint of solvation, n1 is particularly preferably 1 to 4.

  As the precursor of the structural unit (a), styrene, α-methylstyrene, benzyl (meth) acrylate, or the general formula (7) from the viewpoints of copolymerization with other precursors and chemical resistance. The ethylenically unsaturated monomer shown by these is preferable. These are particularly preferable because a benzene ring can be introduced into the side chain of the resin (A2). Introduction of a benzene ring into the side chain of the resin (A2) is effective in improving developability. Furthermore, benzyl (meth) acrylate is most preferable from the viewpoint of development residue.

《Unit (b)》
The structural unit (b) has a cyclic structure with an aliphatic ring group represented by chemical formula (14) and chemical formula (15), imparts hardness, and functions as a hydrophobic site for an alkaline developer.
Based on the weight of all the structural units of the resin (A), the structural unit (b) is 2 to 50% by weight from the viewpoint of developability and imparting hardness. If it is 2% by weight or more, developability and hardness are good, and a high-quality coating film for touch panel can be obtained. Further, the hydrophobicity at the time of development is sufficient, and an effect of improving pattern peeling or chipping in the pixel portion is seen. If it is 50 weight% or less, since the melt | dissolution rate to an alkali developing solution becomes quick, development time is short and productivity of the coating film for touchscreens improves, it is preferable.

Examples of the precursor of the structural unit (b) include an ethylenically unsaturated monomer represented by the general formula (16), an ethylenically unsaturated monomer represented by the general formula (17), and the like.

[In General Formula (16) and General Formula (17), R ₉ is a hydrogen atom or a methyl group, R ₁₀ is an alkylene group having 2 or 3 carbon atoms, and m1 is an integer of 1 to 15 It is. ]

Examples of the ethylenically unsaturated monomer represented by the general formula (16) include:
FANCLIL FA-513A manufactured by Hitachi Chemical Co., Ltd. FA-513A [dicyclopentanyl acrylate, R ₉ : hydrogen atom, R ₁₀ : none, m1 = 0], or FA-513M [dicyclopentanyl methacrylate, R ₉ : methyl, R ₁₀ : None, m1 = 0], and the like, but not limited thereto, two or more kinds may be used in combination.

As an unsaturated ethylene monomer represented by the general formula (17), for example,
FANCLIL manufactured by Hitachi Chemical Co., Ltd. FA-511A [dicyclopentenyl acrylate, R ₉ : hydrogen atom, R ₁₀ : none, m1 = 0], FA-512A [dicyclopentenyloxyethyl acrylate, R ₉ : hydrogen atom, R ₁₀ : ethylene, m1 = 1], FA- 512M [ dicyclopentenyloxyethyl methacrylate, _{R 9:} a methyl _{group, R 10:} an ethylene group, m1 = 1], or FA-512MT [dicyclopentenyloxyethyl methacrylate, R ₉ : methyl group, R ₁₀ : ethylene group, m1 = 1] and the like, but not limited thereto, two or more kinds may be used in combination.

<Unit (C)>
The structural unit (c) is a structural unit having a compound (ha ′) represented by the following general formula (40) as a precursor or a compound (ha ″) represented by the general formula (41) as a precursor.
Based on the weight of all the structural units of the resin (A), the structural unit (c) is 2 to 60% by weight, preferably 5 to 55% from the viewpoints of stability, transparency, heat resistance, and solubility in a solvent. % By weight, more preferably 5 to 50% by weight. If the amount of the structural unit (c) is too large, it may be difficult to obtain a low molecular weight component during copolymerization or may be easily gelled. On the other hand, if the amount is too small, the transparency and heat resistance may be increased. There is a risk that the performance of the coating film such as property may be insufficient.
[In General Formula (40), R ₂₁ and R ₂₂ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]
[In General Formula (41), R ₂₃ and R ₂₄ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]

In the general formula (40), the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R ₂₁ and R ₂₂ is not particularly limited, and examples thereof include methyl, ethyl, linear or branched alkyl groups such as n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, t-amyl, stearyl, lauryl, 2-ethylhexyl; aryl groups such as phenyl; cyclohexyl, t-butyl An alicyclic group such as cyclohexyl, dicyclopentadienyl, tricyclodecanyl, isobornyl, adamantyl, 2-methyl-2-adamantyl; an alkyl group substituted with alkoxy such as 1-methoxyethyl, 1-ethoxyethyl; An alkyl group substituted with an aryl group such as benzyl; and the like. Among these, an acid such as methyl, ethyl, cyclohexyl, benzyl and the like and a hydrocarbon group which is difficult to be removed by heat are preferable from the viewpoint of heat resistance. R ₂₁ and R ₂₂ may be the same type of hydrocarbon group or different hydrocarbon groups.

Specific examples of the compound (ha ′) include, for example, dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate Di (n-propyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (isopropyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (n -Butyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (isobutyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (t-butyl)- 2,2 '-[oxybis (methylene)] bis-2-propenoate, di (t-amyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, Di (stearyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (lauryl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (2-ethylhexyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (1-methoxyethyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (1-ethoxyethyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, dibenzyl-2,2'-[oxybis (methylene)] bis-2-propenoate, diphenyl-2,2 '-[oxybis (methylene)] Bis-2-propenoate, dicyclohexyl-2,2 '-[oxybis (methylene)] bis-2-propenoate, di (t-butyl cis Rohexyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (dicyclopentadienyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, di (tricyclo Decanyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate, di (isobornyl) -2,2'-[oxybis (methylene)] bis-2-propenoate, diadamantyl-2,2 ' -[Oxybis (methylene)] bis-2-propenoate, di (2-methyl-2-adamantyl) -2,2 '-[oxybis (methylene)] bis-2-propenoate and the like. Among these, dimethyl-2,2 '-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2'-[oxybis (methylene)] bis-2-propenoate, dicyclohexyl-2,2'- [Oxybis (methylene)] bis-2-propenoate and dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate are preferred.
These compounds (C ′) can be used singly or as a mixture of two or more at any ratio as necessary.

  When the compound (C ') is copolymerized with other copolymerizable precursors (d) to obtain the resin (A), the cyclization reaction of the compound (C') proceeds simultaneously with the polymerization. Thus, a tetrahydropyran ring structure is formed.

In the general formula (41), the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R ₂₃ and R ₂₄ is not particularly limited, and examples thereof include methyl, ethyl, linear or branched alkyl groups such as n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, t-amyl, stearyl, lauryl, 2-ethylhexyl; aryl groups such as phenyl; cyclohexyl, t-butyl An alicyclic group such as cyclohexyl, dicyclopentadienyl, tricyclodecanyl, isobornyl, adamantyl, 2-methyl-2-adamantyl; an alkyl group substituted with alkoxy such as 1-methoxyethyl, 1-ethoxyethyl; An alkyl group substituted with an aryl group such as benzyl; and the like. Among these, an acid such as methyl, ethyl, cyclohexyl, benzyl and the like and a hydrocarbon group which is difficult to be removed by heat are preferable from the viewpoint of heat resistance. R ₂₃ and R ₂₄ may be the same type of hydrocarbon group or different hydrocarbon groups.

As a specific example of the compound (ha ''), for example,
α-allyloxymethyl acrylic acid, methyl α-allyloxymethyl acrylate, ethyl α-allyloxymethyl acrylate, n-propyl α-allyloxymethyl acrylate, i-propyl α-allyloxymethyl acrylate, α- N-butyl allyloxymethyl acrylate, s-butyl α-allyloxymethyl acrylate, t-butyl α-allyloxymethyl acrylate, n-amyl α-allyloxymethyl acrylate, α-allyloxymethyl acrylate s -Amyl, α-allyloxymethyl acrylate t-amyl, α-allyloxymethyl acrylate neopentyl, α-allyloxymethyl acrylate n-hexyl, α-allyloxymethyl acrylate s-hexyl, α-allyloxymethyl N-heptyl acrylate, α-allyloxymethyl N-octyl crylate, s-octyl α-allyloxymethyl acrylate, t-octyl α-allyloxymethyl acrylate, 2-ethylhexyl α-allyloxymethyl acrylate, α-allyloxymethyl acrylate capryl, α- Allyloxymethyl acrylate nonyl, α-allyloxymethyl acrylate decyl, α-allyloxymethyl acrylate undecyl, α-allyloxymethyl acrylate acrylate, α-allyloxymethyl acrylate tridecyl, α-allyloxymethyl acrylate Myristyl, pentadecyl α-allyloxymethyl acrylate, cetyl α-allyloxymethyl acrylate, heptadecyl α-allyloxymethyl acrylate, stearyl α-allyloxymethyl acrylate, α-allyloxymethyl acrylate nonade Chain saturated hydrocarbon group-containing α- (allyloxymethyl) acrylates such as syl, α-allyloxymethyl acrylate eicosyl, α-allyloxymethyl ceryl acrylate, and melyl α-allyloxymethyl acrylate.

  α- (allyloxymethyl) acrylates containing hydroxy-substituted chain saturated hydrocarbon groups such as hydroxyethyl α-allyloxymethyl acrylate, hydroxypropyl α-allyloxymethyl acrylate, hydroxybutyl α-allyloxymethyl acrylate; -Fluoroethyl allyloxymethyl acrylate, difluoroethyl α-allyloxymethyl acrylate, chloroethyl α-allyloxymethyl acrylate, dichloroethyl α-allyloxymethyl acrylate, bromoethyl α-allyloxymethyl acrylate, α-allyl Halogen-substituted chain-like saturated hydrocarbon group-containing α- (allyloxymethyl) acrylate such as dibromoethyl oxymethyl acrylate.

  α-allyloxymethyl acrylate cyclopentyl, α-allyloxymethyl acrylate cyclopentyl methyl, α-allyloxymethyl acrylate cyclohexyl, α-allyloxymethyl acrylate acrylate methyl, α-allyloxymethyl acrylate 4-methylcyclohexyl, α-allyloxymethyl acrylate 4-t-butylcyclohexyl, α-allyloxymethyl acrylate tricyclodecanyl, α-allyloxymethyl acrylate isobornyl, α-allyloxymethyl acrylate adamantyl, α-allyloxymethyl acryl Alicyclic hydrocarbon group-containing α- (allyloxymethyl) acrylates such as dicyclopentanyl acid and dicyclopentenyl α-allyloxymethyl acrylate; phenyl α-allyloxymethyl acrylate α-Allyloxymethyl acrylate methylphenyl, α-allyloxymethylacrylate dimethylphenyl, α-allyloxymethylacrylate trimethylphenyl, α-allyloxymethylacrylate 4-t-butylphenyl, α-allyloxymethylacrylic Acid benzyl, α-allyloxymethyl acrylate diphenylmethyl, α-allyloxymethyl acrylate diphenylethyl, α-allyloxymethyl acrylate triphenylmethyl, α-allyloxymethyl acrylate naphthyl, α-allyloxymethyl acrylate An α- (allyloxymethyl) acrylate containing an aromatic hydrocarbon group such as anthranyl.

methoxyethyl α-allyloxymethyl acrylate, methoxyethoxyethyl α-allyloxymethyl acrylate, methoxyethoxyethoxyethyl α-allyloxymethyl acrylate, 3-methoxybutyl α-allyloxymethyl acrylate, α-allyloxymethyl Chain ether group-based saturated hydrocarbon group-containing α- such as ethoxyethyl acrylate, ethoxyethoxyethyl α-allyloxymethyl acrylate, phenoxyethyl α-allyloxymethyl acrylate, phenoxyethoxyethyl α-allyloxymethyl acrylate (Allyloxymethyl) acrylate; cyclopentoxyethyl α-allyloxymethyl acrylate, cyclohexyloxylethyl α-allyloxymethyl acrylate, cyclopentoxy α-allyloxymethyl acrylate Α- (allyloxymethyl) acrylate having both an alicyclic hydrocarbon group and a chain ether group, such as toxiethyl, α-allyloxymethyl acrylate cyclohexyloxyethoxyethyl, α-allyloxymethyl acrylate dicyclopentenyloxyethyl; α- (allyloxymethyl) acrylate having both an aromatic hydrocarbon group and a chain ether group such as phenoxyethyl α-allyloxymethyl acrylate and phenoxyethoxyethyl α-allyloxymethyl acrylate; α-allyloxymethyl acrylic acid Glycidyl, α-allyloxymethyl acrylate β-methylglycidyl, α-allyloxymethyl acrylate β-ethyl glycidyl, α-allyloxymethyl acrylate 3,4-epoxycyclohexylmethyl, α-allyloxymethyl acrylic Acid 2-oxetanemethyl, α-allyloxymethyl acrylate 3-methyl-3-oxetanemethyl, α-allyloxymethyl acrylate 3-ethyl-3-oxetanemethyl, α-allyloxymethyl acrylate tetrahydrofuranyl, α- Cyclic ether group-based saturated hydrocarbon group-containing α- such as tetrahydrofurfuryl allyloxymethyl acrylate, tetrahydropyranyl α-allyloxymethyl acrylate, dioxazolanyl α-allyloxymethyl acrylate, dioxanyl α-allyloxymethyl acrylate And (allyloxymethyl) acrylate.
These compounds (c) can be used singly or in combination of two or more at any ratio as necessary.

  Among these, a chain saturated hydrocarbon group-containing α- (allyloxymethyl) acrylate such as α-allyloxymethylacrylic acid and methyl α-allyloxymethylacrylate is particularly preferable.

  When the compound (ha '') is copolymerized with a precursor of another copolymerizable structural unit (d) to obtain the resin (A), the cyclization reaction of the compound (ha '') simultaneously with the polymerization Proceeds to form a tetrahydrofuran ring structure.

<Unit (d)>
Examples of the precursor of the structural unit (d) include an acidic group-containing ethylenically unsaturated monomer, an ethylenically unsaturated monomer that can give an acid group after polymerization, the structural units (a), (b), and ( If it is a compound copolymerizable with the precursor of c), there will be no restriction | limiting in particular. As the structural unit, a structural unit having a radically polymerizable double bond (d-1) and a structural unit having a side chain cyclic ether (knee 2) are preferable.
Based on the weight of all the structural units of the resin (A), the structural unit (d) is preferably 2 to 80% by weight, more preferably 2 to 70% by weight.

· Structural units having radically polymerizable double bonds (d-1)
In order to introduce a radical polymerizable double bond into the resin (A), for example, a treatment such as method (iii) or method (iv) described later may be performed.

<< Method (iii) >>
As the method (iii), for example, the side chain epoxy group of a copolymer obtained by copolymerizing an ethylenically unsaturated monomer having an epoxy group and one or more other monomers is used. Then, the carboxyl group of the unsaturated monobasic acid having a radical polymerizable double bond is subjected to an addition reaction, and the resulting hydroxyl group is reacted with a polybasic acid anhydride to form a radical polymerizable double bond and an acid group (carboxyl group). ).
That is, the structural unit at this time is a structural unit having both an acid group and a radical polymerizable double bond.

  Examples of the ethylenically unsaturated monomer having an epoxy group include glycidyl (meth) acrylate, methyl glycidyl (meth) acrylate, 2-glycidoxyethyl (meth) acrylate, 3,4 epoxybutyl (meth) acrylate, And 3,4 epoxy cyclohexyl (meth) acrylates, and these may be used alone or in combination of two or more. From the viewpoint of reactivity with the unsaturated monobasic acid in the next step, glycidyl (meth) acrylate is preferred.

  Examples of unsaturated monobasic acids include (meth) acrylic acid, crotonic acid, o-, m-, p-vinylbenzoic acid, α-haloalkyl of (meth) acrylic acid, alkoxyl, halogen, nitro, cyano substituted products, etc. Monocarboxylic acid etc. are mentioned, These may be used independently or may use 2 or more types together.

  Examples of polybasic acid anhydrides include tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride, succinic anhydride, maleic anhydride, etc., and these may be used alone or in combination of two or more. It doesn't matter. If necessary, use a tricarboxylic anhydride such as trimellitic anhydride or a tetracarboxylic dianhydride such as pyromellitic dianhydride to increase the number of carboxyl groups. The group can also be hydrolyzed. Further, when tetrahydrophthalic anhydride or maleic anhydride having a radical polymerizable double bond is used as the polybasic acid anhydride, the radical polymerizable double bond can be further increased.

As a method similar to method (iii), for example, a side chain of a copolymer obtained by copolymerizing an ethylenically unsaturated monomer having a carboxyl group and one or more other monomers. There is a method in which an ethylenically unsaturated monomer having an epoxy group is added to a part of a carboxyl group to introduce a radical polymerizable double bond and an acid group (carboxyl group).
That is, the structural unit at this time corresponds to the structural unit having an acid group because it has an acid group together with the radical polymerizable double bond.

<< Method (iv) >>
As the method (iv), an ethylenically unsaturated monomer having a hydroxyl group is used, and an unsaturated monobasic acid monomer having another carboxyl group or another monomer is copolymerized. There is a method of reacting the isocyanate group of an ethylenically unsaturated monomer having an isocyanate group with the side chain hydroxyl group of the obtained copolymer.

  Examples of the ethylenically unsaturated monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2- or 3-hydroxypropyl (meth) acrylate, 2- or 3- or 4-hydroxybutyl (meth) acrylate, and glycerol. Examples thereof include hydroxyalkyl (meth) acrylates such as (meth) acrylate or cyclohexanedimethanol mono (meth) acrylate, and these may be used alone or in combination of two or more. Further, polyether mono (meth) acrylate obtained by addition polymerization of ethylene oxide, propylene oxide, and / or butylene oxide to the above hydroxyalkyl (meth) acrylate, (poly) γ-valerolactone, (poly) ε-caprolactone And / or (poly) 12-hydroxystearic acid added (poly) ester mono (meth) acrylate can also be used. From the viewpoint of suppressing foreign matter on the coating film, 2-hydroxyethyl (meth) acrylate or glycerol (meth) acrylate is preferable.

  Examples of the ethylenically unsaturated monomer having an isocyanate group include 2- (meth) acryloyloxyethyl isocyanate, 1,1-bis [(meth) acryloyloxy] ethyl isocyanate, and the like. In addition, two or more types can be used in combination.

・ Constitutional unit having side chain type cyclic ether (knee 2)
Examples of the structural unit (knee 2) having a side chain type cyclic ether include a structural unit containing at least one skeleton selected from the group consisting of a tetrahydrofuran skeleton, a furan skeleton, a tetrahydropyran skeleton, a pyran skeleton, and a lactone skeleton.
Examples of the tetrahydrofuran skeleton include tetrahydrofurfuryl (meth) acrylate, 2-methacryloyloxy-propionic acid tetrahydrofurfuryl ester, (meth) acrylic acid tetrahydrofuran-3-yl ester, and the like;
Examples of the furan skeleton include 2-methyl-5- (3-furyl) -1-penten-3-one, furfuryl (meth) acrylate, 1-furan-2-butyl-3-en-2-one, and 1-furan. 2-butyl-3-methoxy-3-en-2-one, 6- (2-furyl) -2-methyl-1-hexen-3-one, 6-furan-2-yl-hex-1-ene -3-one, 2-furan-2-yl-1-methyl-ethyl acrylate, 6- (2-furyl) -6-methyl-1-hepten-3-one, and the like;
Examples of the tetrahydropyran skeleton include (tetrahydropyran-2-yl) methyl methacrylate, 2,6-dimethyl-8- (tetrahydropyran-2-yloxy) -oct-1-en-3-one, and tetrahydropyran 2-methacrylate. 2-yl ester, 1- (tetrahydropyran-2-oxy) -butyl-3-en-2-one, and the like;
Examples of the pyran skeleton include 4- (1,4-dioxa-5-oxo-6-heptenyl) -6-methyl-2-pyrone and 4- (1,5-dioxa-6-oxo-7-octenyl) -6. -Methyl-2-pyrone and the like;
Examples of the lactone skeleton include 2-propenoic acid 2-methyl-tetrahydro-2-oxo-3-furanyl ester, 2-propenoic acid 2-methyl-7-oxo-6-oxabicyclo [3.2.1] oct-2- Yl ester, 2-propenoic acid 2-methyl-hexahydro-2-oxo-3,5-methano-2H-cyclopenta [b] furan-7-yl ester, 2-propenoic acid 2-methyl-tetrahydro-2-oxo- 2H-pyran-3-yl ester, 2-propenoic acid (tetrahydro-5-oxo-2-furanyl) methyl ester, 2-propenoic acid hexahydro-2-oxo-2,6-methanofuro [3,2-b]- 6-yl ester, 2-propenoic acid 2-methyl-2- (tetrahydro-5-oxo-3-furanyl) ethyl ester, 2-propenoic acid 2-methyl ester Ru-decahydro-8-oxo-5,9-methano-2H-furo [3,4-g] -1-benzopyran-2-yl ester, 2-propenoic acid 2-methyl-2-[(hexahydro-2- Oxo-3,5-methano-2H-cyclopenta [b] furan-6-yl) oxy] ethyl ester, 2-propenoic acid 3-oxo-3-[(tetrahydro-2-oxo-3-furanyl) oxy] propyl And 2-propenoic acid 2-methyl-2-oxy-1-oxaspiro [4.5] dec-8-yl ester.
Among these, tetrahydrofurfuryl (meth) acrylate is preferable from the viewpoint of coloring and availability. These side chain type cyclic ether-containing monomers may be used alone or in combination of two or more.

  The proportion of the structural unit (d-2) having the side chain cyclic ether in the monomer component in obtaining the resin is not particularly limited, but is 5 to 80% by weight, preferably 5 in the total monomer components. It is good that it is -70 weight%, More preferably, it is 5-60 weight%. If the amount of the structural unit having the side chain type cyclic ether is too large, the hydrophilicity becomes too strong and the surface is whitened during alkali development, the pattern is missing, or the adhesion to the substrate is likely to be lowered. On the other hand, if the amount is too small, performance such as heat resistance may be insufficient.

Other structural units Examples of ethylenically unsaturated monomers that can be used as precursors for other structural units include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and isopropyl (meth). ) Acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, 2-hydroxyethyl ( (Meth) acrylates such as (meth) acrylate; N-substituted maleimides such as N-phenylmaleimide and N-cyclohexylmaleimide; butadiene or substituted butadiene compounds such as butadiene and isoprene; ethylene and propylene And ethylene or substituted ethylene compounds such as vinyl chloride and acrylonitrile; vinyl esters such as vinyl acetate; Among these, methyl (meth) acrylate and cyclohexyl (meth) acrylate are preferable in terms of good transparency and resistance to heat resistance. These ethylenically unsaturated monomers may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as a method of the polymerization reaction of the said ethylenically unsaturated monomer, Although conventionally well-known various polymerization methods can be employ | adopted, It is preferable especially by the solution polymerization method. The polymerization temperature and polymerization concentration (polymerization concentration = [total weight of monomer components / (total weight of monomer components + solvent weight)] × 100) are the types and ratios of the monomer components used. Depending on the molecular weight of the target resin, the polymerization temperature is preferably 40 to 150 ° C. and the polymerization concentration is 5 to 50%, and more preferably, the polymerization temperature is 60 to 130 ° C. and the polymerization concentration is 10 to 40%. It is good to do.

(Resin (A1))
In the present invention, the resin (A) has, in addition to the structural unit having an acid group, at least one structural unit selected from the group consisting of the structural units (a), (b) and (c) described above. It is preferable that (A1) is included, and it becomes what was excellent in adhesiveness by this.

  The structural unit having an acidic group and the structural units (a) to (d) can be obtained by copolymerizing respective precursors so as to have an arbitrary ratio. Among them, the structural units (a) and ( The resin (A1-a) having (b) or the resin (A1-b) having the structural unit (c) is preferable for improving the hardness.

"Resin (A1-a)"
The resin (A1-a) is an alkali-soluble resin having at least the structural units (A) and (B).
More preferably, the structural unit having an acidic group, the structural units (a), (b), and (d) are preferably contained in the following proportions.
Structural unit having acidic group: 2 to 80% by weight
Structural unit (a): 2 to 80% by weight
Structural unit (b): 2 to 60% by weight
Structural unit (d): 2 to 80 weight

"Resin (A1-b)"
The resin (A1-b) is an alkali-soluble resin having at least a structural unit (c).
More preferably, the structural unit having an acidic group, the structural units (a), (b), and (d) are preferably contained in the following proportions.
Structural unit having acidic group: 2 to 80% by weight
Structural unit (c): 2-40% by weight
Structural unit (d): 2 to 80 weight

  The resin (A1) is preferably used in an amount of 10 to 80% by weight in a total of 100% by weight of the solid content of the photosensitive composition. When the amount of the resin (A1) is less than 10% by weight, the effect of sufficiently improving the adhesion and increasing the hardness cannot be obtained. It is difficult to obtain film hardness.

(Other resins)
The photosensitive resin composition of this invention can contain other resin other than alkali-soluble resin (A). As other resin, conventionally well-known things, such as a thermoplastic resin mentioned later and a thermosetting resin, can be used, and there is no restriction | limiting in particular. In order to improve photosensitivity, it can also be used as an active energy ray-curable resin having an ethylenically unsaturated double bond.
The other resin is preferably a resin having a transmittance of preferably 80% or more, more preferably 95% or more in the entire wavelength region of 400 to 700 nm in the visible light region. Other resins include thermoplastic resins, thermosetting resins, and photosensitive resins, and these can be used alone or in admixture of two or more.

Examples of the thermoplastic resin include butyral resin, styrene-maleic acid copolymer, chlorinated polyethylene, chlorinated polypropylene, polyvinyl resin, polyvinyl chloride resin, polyvinylidene chloride resin, vinyl chloride-vinyl acetate copolymer, poly Vinyl acetate, polyurethane resin, polyester resin, acrylic resin, methacrylic resin, alkyd resin, polystyrene resin, silicone resin, fluororesin, polyamide resin, rubber resin, cyclized rubber resin, chlorinated rubber, oxidized rubber, hydrochloric acid Examples include rubber, celluloses, polyethylene (HDPE, LDPE), polybutadiene, polyimide resin, petroleum resin, casein, shellac, nitrocellulose, cellulose acetate butyrate, but are not necessarily limited thereto.

  Examples of thermosetting resins include epoxy resins, benzoguanamine resins, melamine resins, rosin modified maleic resins, rosin modified fumaric resins, rosin modified maleic resins, rosin modified phenol resins, urea resins, amino resins, phenol resins, Saturated polyester resins, drying oils, synthetic drying oils and the like can be mentioned, but are not necessarily limited thereto. They can also be used in combination as a thermal crosslinking agent for the thermoplastic resin.

  Examples of the photosensitive resin include (meth) acrylic compounds having a reactive substituent such as an isocyanate group, an aldehyde group, and an epoxy group on a linear polymer having a reactive substituent such as a hydroxyl group, a carboxyl group, or an amino group, A resin obtained by reacting an acid and introducing a photocrosslinkable group such as a (meth) acryloyl group or a styryl group into the linear polymer is used. Further, a linear polymer containing an acid anhydride such as a styrene-maleic anhydride copolymer or an α-olefin-maleic anhydride copolymer is converted into a (meth) acrylic compound having a hydroxyl group such as hydroxyalkyl (meth) acrylate. Half-esterified products are also used. However, it is not necessarily limited to these.

<Isocyanurate skeleton-containing compound (C)>
The resin composition for an overcoat of the present invention is greatly improved in hardness and adhesion due to the effect of imparting elasticity by the isocyanurate skeleton-containing compound (C). This makes it possible to achieve both hardness and adhesion, which has been difficult in the past, and can provide an excellent overcoat.

  As the isocyanurate skeleton-containing compound (C), known compounds can be used without particular limitation as long as they have an isocyanurate skeleton, such as trichloroisocyanuric acid, sodium dichloroisocyanurate, sodium dichloroisocyanurate dihydrate, Examples thereof include trimethyl isocyanuric acid, triphenyl isocyanuric acid, an isocyanurate skeleton-containing compound (C1) represented by the general formula (101), and the like. Among these, it is preferable to use the isocyanurate skeleton-containing compound (C1) represented by the general formula (101) because it is excellent in both hardness and adhesion.

<< Isocyanurate skeleton-containing compound (C1) >>
The isocyanurate skeleton-containing compound (C1) is a compound represented by the following general formula (101).
Formula (101)

[In General Formula (101), R ₁ , R ₂ and R ₃ are each independently a hydrogen atom, a chlorine atom, a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent, or a general formula It is group represented by (1)-(8), and at least 1 is any group represented by general formula (1)-(8). ]


[In General Formulas (1) to (8), R ₄ , R ₅ and R ₆ are each independently either H or CH ₃ . n is an integer of 0-10. m is an integer of 1-20 each independently. l is an integer of 1-5. ]

  Among such isocyanurate skeleton-containing compounds (C1), when having at least one of the groups represented by the general formulas (1), (3) and (4), high reactivity is imparted. The (meth) acryl group is preferable because a stronger crosslink is formed and the molecular weight distribution of the polymer chain in the cured coating is uniform, so that the hardness and etchant resistance are improved.

Of these _R 1, _{R 2} and preferably all _{R 3} is any one of formulas (1) to (8), further all the general formula of _R 1, _{R 2} and _{R 3} (1), ( 3) or (4) is particularly preferable.

Specific examples of the isocyanurate skeleton-containing compound (C1) include
Isocyanuric acid, tris (2-acryloyloxyethyl) isocyanurate (funcryl FA-731A (manufactured by Hitachi Chemical Co., Ltd.)), isocyanuric acid EO-modified triacrylate (A-9300 (manufactured by Shin-Nakamura Chemical Co., Ltd.)), ε-caprolactone Modified tris- (2-acryloxyethyl) isocyanurate (A-9300-1CL (manufactured by Shin-Nakamura Chemical)), A-9300-3CL (manufactured by Shin-Nakamura Chemical), CIC acid (manufactured by Shikoku Kasei), MA- DGIC (manufactured by Shikoku Kasei), DA-MGIC (manufactured by Shikoku Kasei), MeDAIC (manufactured by Shikoku Kasei), MeDHIC (manufactured by Shikoku Kasei), MACIC-1 (manufactured by Shikoku Kasei), TSIC-2 (manufactured by Shikoku Kasei), TEPIC- S (manufactured by Nissan Chemical Industries), TEPIC-VL (manufactured by Nissan Chemical Industries), TEPIC-PAS (manufactured by Nissan Chemical Industries) , A mixture of isocyanuric acid EO-modified diacrylate and isocyanuric acid EO-modified triacrylate (Aronix M-315 ((produced by Toagosei Co., Ltd.)), etc. may be mentioned.

The isocyanurate skeleton-containing compound (C1) represented by the general formula (101) includes any of the groups represented by the general formula (1), (3) or the general formula (4). Acid triacrylate (A-9300 (made by Shin-Nakamura Chemical Co., Ltd.)), ε-caprolactone-modified tris- (2-acryloxyethyl) isocyanurate (A-9300-1CL (made by Shin-Nakamura Chemical Co., Ltd.)), isocyanuric acid EO-modified And a mixture of diacrylate and isocyanuric acid EO-modified triacrylate (Aronix M-315 (manufactured by Toagosei Co., Ltd.)).
Of these, isocyanuric acid EO-modified triacrylate (A-9300 (manufactured by Shin-Nakamura Chemical Co., Ltd.)) is particularly preferable.

  The content of the isocyanurate skeleton-containing compound (C) is preferably 3 to 40% by weight, more preferably 5 to 30% by weight, based on the total solid content in the photosensitive composition. When the isocyanurate skeleton-containing compound (C) exceeds 40% by weight, the addition amount of resin, photopolymerization initiator and the like is limited, and sufficient developability and sensitivity cannot be ensured, and adhesion is poor. There is. Conversely, when the isocyanurate skeleton-containing compound (C) is contained in less than 5 parts by weight, the hardness, adhesion, and etchant resistance imparting effect may be insufficient.

<Photoinitiator (B)>
As photopolymerization initiator (B), 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one 1-hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-methyl-1- [4- (methylthio) phenyl] -2-morpho Acetophenone photopolymerization initiators such as linopropan-1-one, 1,2-octanedione-1- [4- (phenylthio) phenyl-, 2- (o-benzoyloxime)], ethanone, 1- [9- Ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (o-acetyloxy) Oxime ester photopolymerization initiators such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyldimethyl ketal and other benzoin photopolymerization initiators, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4 -Benzophenone photopolymerization initiators such as phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4'-methyldiphenyl sulfide, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, Thioxanthone photopolymerization initiators such as 2,4-diisopropylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -S-triazine, 2- (p-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2-piperonyl-4,6-bis (trichloromethyl) -s-triazine, 2,4-bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphth-1-yl) -4,6- Bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2,4-trichloromethyl- (piperonyl) -6 -Triazine photopolymerization initiators such as triazine and 2,4-trichloromethyl (4'-methoxystyryl) -6-triazine, borate photopolymerization initiators, carbazole photopolymerization initiation , Imidazole-based photopolymerization initiator and the like are used, can be used as a mixture thereof alone, or two or more.

Among them, acetophenone photopolymerization initiators and oxime ester photopolymerization initiators are preferable because they have high sensitivity and can be added in a small amount, so that the transmittance increases.
Among acetophenone photopolymerization initiators and oxime ester photopolymerization initiators, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 1 , 2-octanedione-1- [4- (phenylthio) phenyl-, 2- (o-benzoyloxime)], especially 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one 1,2-octanedione-1- [4- (phenylthio) phenyl-, 2- (o-benzoyloxime)] does not turn yellow during the heating step, and thus has a high transmittance as an insulating film, particularly at a wavelength of 400 nm. Since a photosensitive resin composition having high transmittance in the vicinity can be provided, it is more preferable. These may be used alone or in combination.
The photopolymerization initiator (B) is preferably used in an amount of 1 to 30% by weight in a total of 100% by weight of the solid content of the photosensitive resin composition, and in an amount of 1 to 10% by weight from the viewpoint of transmittance. More preferably, it is used.

The photosensitive resin composition of the present invention further includes α-acyloxy ester, acylphosphine oxide, methylphenylglyoxylate, benzyl, 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone as sensitizers. 4,4′-diethylisophthalophenone, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, 4,4′-diethylaminobenzophenone, and the like can be used in combination.
The sensitizer can be used in an amount of 0.1 to 150 parts by weight with respect to 100 parts by weight of the photopolymerization initiator (B).

<Monomer>
The monomer includes a monomer or oligomer that is cured by ultraviolet rays or heat to produce a transparent resin. However, when the monomer contains an isocyanurate skeleton, it corresponds to the isocyanurate skeleton-containing compound (C).

  As monomers, ω-carboxy-polycaprolactone monoacrylate, ω-carboxy-polycaprolactone monomethacrylate, 2-acryloyloxyethyl succinic acid, 2-methacryloyloxyethyl succinic acid, 2-acryloyloxypropyl succinic acid, 2-methacryloyloxy Propyl succinic acid, methoxyethylene glycol acrylate, methoxyethylene glycol methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, methoxypropylene glycol acrylate, methoxypropylene glycol methacrylate, methoxydipropylene glycol acrylate , Methoxydipropylene glycol methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl methacrylate, and commercially available products such as 2-acryloyloxyethyl succinic acid (trade name M-5300), polyethylene Glycol di (meth) acrylate, epoxy (meth) acrylate, EO-modified bisphenol A di (meth) acrylate, 1,4-butanediol di (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di ( (Meth) acrylate, neopentyl glycol di (meth) acrylate, polyester (meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone-modified dipentaerythritol hex Acrylate, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ethylene oxide modified trimethylol Monomers having acidic groups such as propane tri (meth) acrylate and propylene oxide-modified trimethylolpropane tri (meth) acrylate, and other monomers having an acidic group, or photopolymerization in which polymerization is partially induced by radicals Monomers and the like can be raised.

<< Monomer having an acidic group >>
Examples of the monomer having an acidic group include esterified products of poly (meth) acrylates containing free hydroxyl groups of polyhydric alcohol and (meth) acrylic acid and dicarboxylic acids; polyhydric carboxylic acids and monohydroxyalkyl (meth) ) Esterified products with acrylates. Specific examples include monomethyl oligoacrylates or monohydroxy oligomethacrylates such as trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol pentamethacrylate. And monoesterified products containing free carboxyl groups with dicarboxylic acids such as malonic acid, succinic acid, glutaric acid, terephthalic acid; propane-1,2,3-tricarboxylic acid (tricarbaryl acid), butane-1,2,4 -Tricarboxylic acids, such as benzene-1,2,3-tricarboxylic acid, benzene-1,3,4-tricarboxylic acid, benzene-1,3,5-tricarboxylic acid And a free carboxyl group-containing oligoester product of monohydroxy monoacrylate or monohydroxy monomethacrylate such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, etc. be able to.

Moreover, the compound represented by following General formula (10) can also be used preferably.
General formula (10)
_{(H 2 C = C (R} 16) COO) m1 -X- (OCOCH (R 16) CH 2 S (R 17) COOH) n1
[In General Formula (10), R ₁₆ is a hydrogen atom or a methyl group, R ₁₇ is a hydrocarbon group having 1 to 12 carbon atoms, X is an (m1 + n1) -valent organic group having 3 to 60 carbon atoms, m1 is 2 to 2 The integer of 18 and n1 show the integer of 1-3. ]
Here, the compound represented by the following general formula (10) can be easily obtained by, for example, the following method.

(1) A method of adding a mercapto compound to an obtained compound after esterifying the compound giving an organic group represented by X with acrylic acid to acrylate, and (2) a compound giving an organic group represented by X Is modified with a polyisocyanate compound, and then the obtained compound is acrylated with an acrylate compound having a hydroxyl group, and then a mercapto compound is added to the obtained compound (3) to give an organic group represented by X A method in which a compound is esterified with acrylic acid to be acrylated, then modified with a polyisocyanate compound, and a mercapto compound is added to the obtained compound.

  Examples of the compound that gives an organic group represented by X include pentaerythritol, pentaerythritol-modified caprolactone, pentaerythritol-modified polyisocyanate, dipentaerythritol, dipentaerythritol-modified caprolactone, and dipentaerythritol polyisocyanate. Denatured products can be mentioned.

  Examples of mercapto compounds include mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, o-mercaptobenzoic acid, 2-mercaptonicotinic acid, mercaptosuccinic acid, and the like.

  When using a monomer, it is preferable to use the content of 1 to 500 parts by weight with respect to 100 parts by weight of the isocyanurate skeleton-containing compound (C). When the amount is more than 1 part by weight, the effect of increasing hardness and adhesion can be easily obtained. When the amount is 500 parts by weight or less, the transmittance and developability are excellent. More preferably, it is 5 to 200 parts by weight.

<Inorganic fine particles (D)>
By including the inorganic fine particles (D), the photosensitive resin composition of the present invention can obtain a coating film with higher hardness and excellent wet heat resistance. Further, by selecting inorganic fine particles having a high refractive index, an effect of improving bone appearance can be obtained.
Preferably, inorganic fine particles of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, indium, tin, antimony, and cerium, and more preferably in terms of refractive index, transparency, and dispersibility. In terms of superiority, it is an inorganic fine particle of zirconium or titanium.

Examples of the inorganic fine particles include zirconium oxide (ZrO ₂ ), titanium oxide (TiO ₂ ), silicon oxide (SiO ₂ ), aluminum oxide (Al ₂ O ₃ ), iron oxide (Fe ₂ O ₃ , FeO, Fe ₃ O). _4), copper oxide (CuO, _Cu 2 O), zinc oxide (ZnO), yttrium oxide _{(Y 2 O} 3), niobium oxide _{(Nb 2 O} 5), molybdenum oxide _(MoO 3), indium oxide _(In 2 O ₃ , In ₂ O), tin oxide (SnO ₂ ), tantalum oxide (Ta ₂ O ₅ ), tungsten oxide (WO ₃ , W ₂ O ₅ ), lead oxide (PbO, PbO ₂ ), bismuth oxide (Bi ₂ O) ₃ ), metal such as cerium oxide (CeO ₂ , Ce ₂ O ₃ ), antimony oxide (Sb ₂ O ₅ , Sb ₂ O ₅ ), germanium oxide (GeO ₂ , GeO) There are nitrides such as oxide fine particles, silicon nitride, and boron nitride. In addition, composite oxides composed of two or more metal elements such as titanates such as barium titanate, titanium / silicon composite oxide, yttrium-stabilized zirconia, and the like can also be used.

  Of these, zirconium oxide, titanium oxide, antimony oxide, and cerium oxide are preferred from the viewpoints of refractive index and transparency. Furthermore, zirconium oxide (ZrO2) and titanium oxide (TiO2) are particularly preferable from the viewpoint of dispersibility.

As the inorganic fine particles, a compound in which a metal oxide is doped with a different element can also be used. Examples of such a compound include tantalum-doped titanium oxide and niobium-doped titanium oxide. These compounds may be used alone or in combination of two or more.
Such composite oxides have a core-shell structure in which not only compounds and solid solutions composed of multi-component elements but also metal oxide fine particles around the core are covered with metal oxides composed of other metal elements. One having a multi-component dispersion type structure in which a plurality of other metal oxide fine particles are dispersed in one metal oxide fine particle is included.
The inorganic fine particles may be used alone or in combination of two or more.

In the present invention, the inorganic fine particles may be surface-treated. Surface treatment refers to treatment for bonding a compound capable of reacting with a hydroxyl group present on the surface of fine particles. Such a surface treatment can be performed by dispersing inorganic fine particles in a solvent, mixing the surface treatment agent under heating or acidic conditions, and allowing them to act.
The surface treatment agent for hydrophobizing the surface is not particularly limited, but includes aliphatic systems such as stearic acid, oleic acid and linoleic acid, surfactant systems such as aliphatic soap, coupling agents described later, silicone compounds or fluorine. Some use compounds.
Examples of the silicone compound include dimethicone, methicone, alkyl-modified silicone, and silicone resin.
Examples of the fluorine compound include a fluorine-modified alkyl compound and a fluorine-modified silicone compound, and examples thereof include perfluoroalkyl phosphate esters and salts thereof, perfluoroalkyl silanes, and perfluoroalkyl carboxylic acids. Moreover, you may perform the hydrophobization process used together with an alkyl acrylate, an (alkyl acrylate / dimethicone) copolymer, etc. with a fluorine compound.

  In general, as a method for producing inorganic fine particles, three types are generally known: a solid phase method, a liquid phase method, and a gas phase method. As a method for obtaining nano-sized fine particles, a liquid phase method or a gas phase method is generally used. Examples of the liquid phase method include a sol-gel method in which a chemical reaction is caused in a solution to grow crystals to obtain fine particles, and a mechanical pulverization method in which a crystal is mechanically pulverized in a liquid medium using a liquid such as water as a medium. Gas phase methods include laser pyrolysis, combustion, plasma vaporization, spray combustion, gasification combustion, and instantaneous gas phase generation. Reactions are generated in the gas phase to synthesize inorganic fine particles. Say how to do.

  The average primary particle diameter of the inorganic fine particles is preferably 1 nm to 200 nm, more preferably 3 nm to 100 nm, and particularly preferably 5 nm to 30 nm. When the average primary particle diameter exceeds 1000 nm, the transparency when cured is reduced, or the surface state when coated is liable to deteriorate. Various surfactants and amines may be added to improve the dispersibility of the particles.

  The average primary particle diameter of the inorganic fine particles is measured by a method of directly measuring the size of primary particles from an electron micrograph using a transmission (TEM) electron microscope. Specifically, the short axis diameter and the long axis diameter of the primary particles of each pigment are measured, and the average is the particle diameter of the primary particles of the inorganic fine particles. Next, for 100 or more pigment particles, the volume (weight) of each particle is obtained by approximating the obtained particle size cube, and the volume average particle size is defined as the average primary particle size.

  The inorganic fine particles are preferably used as an organic solvent dispersion. When used as an organic solvent dispersion, the dispersion medium is preferably an organic solvent from the viewpoint of compatibility with other components and dispersibility. Examples of such an organic solvent include alcohols such as methanol, ethanol, isopropanol, butanol, and octanol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ethyl acetate, butyl acetate, ethyl lactate, and γ-butyrolactone , Esters such as propylene glycol monomethyl ether acetate and propylene glycol monoethyl ether acetate; ethers such as ethylene glycol monomethyl ether and diethylene glycol monobutyl ether; aromatic hydrocarbons such as benzene, toluene and xylene; dimethylformamide, dimethylacetamide, Examples thereof include amides such as N-methylpyrrolidone. Of these, methanol, isopropanol, butanol, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, butyl acetate, toluene and xylene are preferred.

(titanium)
Commercially available products of titanium oxide particles particularly preferably used in the present invention include SA-TTO-S-4 (10%) MiBridge Powder (fine particles hydrophobized with dimethicone (30 nm) titanium oxide) (Miyoshi Kasei Co., Ltd.), MT-02 (fine particles hydrophobized with methicone (20 nm) titanium oxide) (manufactured by Teika Co., Ltd.), MT-01 (fine particles hydrophobized with aluminum oxide, aluminum hydroxide and stearic acid ( 10 nm) titanium oxide) (manufactured by Teika), MT-10EX (fine particles (10 nm) titanium oxide hydrophobized with aluminum oxide, aluminum hydroxide and isostearic acid) (manufactured by Teika), MT-100TV (aluminum oxide) Hydrophobized with aluminum hydroxide and stearic acid Fine particles (15 nm) titanium oxide (manufactured by Teika Co., Ltd.), MT-100Z (fine particles (15 nm) titanium oxide hydrophobized with aluminum oxide, aluminum hydroxide and stearic acid) (manufactured by Teika Co., Ltd.), MT-150EX ( Fine particles (15 nm) titanium oxide hydrophobized with aluminum oxide, aluminum hydroxide and isostearic acid) (manufactured by Teika Co., Ltd.), MTY-02 (hydrophobic with aluminum oxide, aluminum hydroxide, silicon oxide, silicon hydroxide and silicone oil) Treated fine particles (10 nm) titanium oxide) (manufactured by Teika), MTY-110M3S (fine particles (10 nm) titanium oxide hydrophobized with aluminum oxide, aluminum hydroxide, silicon oxide, silicon hydroxide and silicone oil) ( Manufactured by Takeka Co., Ltd.), MT-5 0SAS (fine particles hydrophobized with aluminum oxide, aluminum hydroxide, silicon oxide, silicon hydroxide and silicone oil (30 nm) titanium oxide) (manufactured by Teika Co., Ltd.), MTY-700BS (fine particles hydrophobized with silicone oil ( 80 nm) titanium oxide) (manufactured by Teika), STR-60C-LP (fine particles (30 × 90 nm) titanium oxide hydrophobized with almina and organicpolysiloxane) (manufactured by Sakai Chemical Industry Co., Ltd.), STR-100C-LP ( microparticles (20 × 100 nm) titanium oxide hydrophobized with alumina and organicpolysiloxanes (manufactured by Sakai Chemical Industry Co., Ltd.), STR-100A-LP (D. silica, alumina and organicpolysiloxane) In hydrophobized particles (20 × 100 nm) Titanium oxide) (manufactured by Sakai Chemical Industry Co., Ltd.), D-962 (manufactured by Sakai Chemical Industry Co., Ltd.), NanoTek (manufactured by CI Kasei Co., Ltd.), and the like. In addition, a titanium oxide fine particle dispersion can be obtained by the method described in Japanese Patent No. 469630.

(Zirconia)
Commercially available products as zirconia oxide fine particle dispersions preferably used in the present invention include ZR-40BL, ZR-30BS, ZR-30AL, ZR-30AH, etc. manufactured by Nissan Chemical Industries, Ltd., Sumitomo Osaka Cement ( HXU-110JC manufactured by Co., Ltd. can be mentioned. In addition, an oxide fine particle dispersion of zirconia can be obtained by the method described in Japanese Patent No. 469630.

(Antimony)
Examples of commercially available antimony oxide particles that are particularly preferably used in the present invention include PATOX-U (30 nm; antimony trioxide) manufactured by Nippon Seiko Co., Ltd. As a product marketed as an antimony oxide fine particle dispersion liquid preferably used in the present invention, CELNAX CX-Z330H manufactured by Nissan Chemical Industries, Ltd. can be mentioned.

(cerium)
Examples of products that are commercially available as oxide fine particles of cerium that are particularly preferably used in the present invention include TECNAPOW-CEO2 (10 nm; cerium dioxide) manufactured by Air Brown Co., Ltd. Examples of commercially available cerium oxide fine particle dispersions that are preferably used in the present invention include SI01-5 seriguard SC6832 (fine particles hydrophobized with methicone (35 nm) cerium oxide) (manufactured by Daito Kasei Kogyo Co., Ltd.), etc. Is mentioned.

Other commercially available inorganic fine particle dispersions that can be used in combination are shown below.
(aluminum)
Commercially available products as the aluminum oxide fine particle dispersion used in the present invention include Alumina Sol-100, Alumina Sol-200, Alumina Sol-520 manufactured by Nissan Chemical Industries, Ltd., and AS-150I manufactured by Sumitomo Osaka Cement Co., Ltd. AS-150T.
(Silicon)
Commercially available products as silicon oxide fine particle dispersions used in the present invention include MA-ST-MS, IPA-ST, IPA-ST-MS, IPA-ST-L, manufactured by Nissan Chemical Industries, Ltd. IPA-ST-ZL, IPA-ST-UP, EG-ST, NPC-ST-30, MEK-ST, MEK-ST-L, MIBK-ST, NBA-ST, XBA-ST, DMAC-ST, ST- Examples include UP, ST-OUP, ST-20, ST-40, ST-C, ST-N, ST-O, ST-50, ST-OL, etc., hollow silica CS60-IPA manufactured by Catalyst Kasei Kogyo Co., Ltd. be able to. As the powdered silica, Aerosil 130, Aerosil 300, Aerosil 380, Aerosil TT600, Aerosil OX50, Silex H31, H32, H51, H52, H121, H122, Asahi Glass Co., Ltd., Nippon Silica Industry, Nippon Aerosil Co., Ltd. Examples include E220A and E220 manufactured by Fuji Electric, SYLYSIA470 manufactured by Fuji Silysia Co., Ltd., SG flake manufactured by Nippon Sheet Glass Co., Ltd., and the like.

(zinc)
Commercially available products as zinc oxide fine particle dispersions used in the present invention include MZ-505S (fine particles (30 nm) zinc oxide hydrophobized with (dimethicone / methicone) copolymer) (manufactured by Teika Co., Ltd.), FINEX-K2-LP2 (fine particles hydrophobized with (dimethicone / methicone) copolymer (30 nm) zinc oxide) (manufactured by Sakai Chemical Industry Co., Ltd.), Z-COTE HP1 (fine particles hydrophobized with dimethicone (25 nm) zinc oxide ) (Manufactured by BASF Japan), SAMTUZO-450 (13%) (fine particles (40 nm) zinc oxide hydrophobized with dimethicone and myristic acid) (manufactured by Miyoshi Kasei Co., Ltd.), SAS-UFZO-450 (13%) (Dimethicone and fine particle (40 nm) zinc oxide hydrophobized with methicone) (Miyoshi Kasei MZY-303S (fine particles hydrophobized with silicone oil (35 nm) zinc oxide) (manufactured by Teika Co., Ltd.), MZ-306X (fine particles hydrophobized with silicone oil (35 nm) zinc oxide) (Taika) MZY-505S (fine particles hydrophobized with silicone oil (25 nm) zinc oxide) (manufactured by Teika Co., Ltd.), MZY-510M3S (fine particles hydrophobized with silicone oil (25 nm) zinc oxide) (Taika) MZ-506X (fine particles hydrophobized with silicone oil (25 nm) zinc oxide) (manufactured by Teika Co., Ltd.), MZ-510HPSX (fine particles hydrophobized with silicon oxide, silicon hydroxide and silicone oil) 25 nm) zinc oxide) (manufactured by Teika Co., Ltd.), FINEX-30S-LP (Fine particles (35 nm) zinc oxide hydrophobized with organicpolysiloxane) (manufactured by Sakai Chemical Industry Co., Ltd.), FINEX-30W-LP2 (fine particles (35 nm) zinc oxide hydrophobized with D. silica and organicpolysiloxane) (Sakai Chemical Industry) Co., Ltd.), FINEX-50S-LP2 (fine particles (20 nm) zinc oxide hydrophobized with organicpolysiloxane) (manufactured by Sakai Chemical Industry Co., Ltd.), FINEX-50W-LP2 (fine particles hydrophobized with D. silica and organicpolysiloxane) (20 nm) zinc oxide) (manufactured by Sakai Chemical Industry Co., Ltd.), nanotech (Cai Kasei Co., Ltd.) and the like.

  The added amount of the inorganic fine particles (D) is preferably 5 to 80% by weight, more preferably 10 to 60% by weight, and particularly preferably 15 to 50% by weight in the total solid content of 100% by weight in the photosensitive resin composition. When the addition amount is less than 5% by weight, it is difficult to obtain effects such as improvement in hardness and etchant resistance. On the other hand, when the addition amount exceeds 80% by weight, problems such as deterioration in developability and adhesion may occur. is there.

  The coating film in this invention can be used also for the improvement of the bone appearance phenomenon which appears on the touch panel etc. which laminated | stacked the transparent conductive film of high refractive indexes, such as ITO. The bone appearance phenomenon can be improved by adjusting the kind, particle size, content, and the like of the inorganic fine particles described above. The coating film of the present invention uses such inorganic fine particles, and by increasing the refractive index, it is possible to reduce the difference in refractive index from the adjacent laminate and to reduce the reflectance. It can use suitably also for the laminated body use adjacent to 53 or more transparent conductive films.

  For example, when the inorganic fine particles (D) are mixed with a material having a refractive index of 1.5, if the zirconium oxide (ZrO 2), approximately 20 wt% in the solid content, and if the titanium oxide (TiO 2), the solid content When the content is about 10% by weight, a coating film having a refractive index of 1.53 or more can be obtained.

<Dispersant>
When inorganic fine particles are used in powder form, an acrylic dispersant or a polyester dispersant may be used to disperse the fine particles.
In general, a dispersant has a structure of a site that adsorbs to inorganic fine particles and a site that has a high affinity for the inorganic fine particle carrier or the solvent that is the dispersion medium, and the performance of the dispersant is determined by the balance between these two sites. That is, in order to develop dispersibility, both the ability of the dispersant to adsorb to the inorganic fine particles and the affinity to the solvent as the dispersion medium are very important.
Among them, the polyester dispersant is preferable because it has a high adsorbability on the surface of the inorganic fine particles, and can obtain high transparency and good development patterning properties, and is not limited as long as it has a polyester skeleton. .

  Among polyester dispersants, a dispersant having an acidic group is preferable, and an acidic resin type dispersant having an aromatic carboxyl group is particularly preferable. Of these, a dispersant obtained by reacting a polymer having a hydroxyl group at one end with an aromatic tricarboxylic acid anhydride and / or aromatic tetracarboxylic dianhydride is most preferable. Examples of such resin-type dispersants include Japanese Patent No. 40201050, Japanese Patent Application Laid-Open No. 2007-140487, International Publication No. 2008/007776, Japanese Patent Application Laid-Open No. 2010-163500, and Japanese Patent Application Laid-Open No. 2010-223888. And exhibits excellent effects such as compatibility between fluidity and dispersibility.

  From the viewpoint of adsorptivity to inorganic fine particles, tetracarboxylic dianhydride having two or more aromatic rings is preferable because it is a suitable skeleton and excellent in dispersion stability.

As a preferable resin type dispersant described in JP-A-2007-140487, a polyester dispersant represented by the following formula can be given.
(HOOC-) _m -R ₅₄ -(-COO-[-R ₅₆ -COO-] _q -R ₅₅ ) _t
[Wherein R ₅₄ is a tetravalent tetracarboxylic acid compound residue, R ₅₅ is a monoalcohol residue, R ₅₆ lactone residue, m is 2 or 3, q is an integer of 1 to 50, and t is (4- m). ]

Moreover, as a preferable resin-type dispersing agent described in WO2008 / 007776 pamphlet and the like, a polyol moiety formed by reacting the hydroxyl group of the polyol (a) with the acid anhydride group of the polycarboxylic acid anhydride (b). In the polyester dispersant having (A) and the polycarboxylic acid part (B) alternately, a part or all of the polyol part (A) radicalizes the ethylenically unsaturated monomer (c) through an S atom. A polyester dispersant having a vinyl polymer portion (C) obtained by polymerization is raised.
At this time, the polycarboxylic acid part (B) of the main chain acts as an inorganic fine particle adsorbing group, and the vinyl polymer part (C) of the side chain acts as an inorganic fine particle carrier affinity group.

  The polyester dispersant is a radical polymerization of an ethylenically unsaturated monomer (c) that forms a vinyl polymer site (C) in the presence of a compound (a1) having two hydroxyl groups and one thiol group in the molecule. In a polycarboxylic acid anhydride (b) containing at least a hydroxyl group in a polyol (a3) containing at least a vinyl polymer (a2) having two hydroxyl groups at one end and a tetracarboxylic dianhydride (b1) It is obtained by reacting with an acid anhydride group.

  Moreover, the polycarboxylic acid compound (b) containing at least the hydroxyl group in the polyol (a4) containing at least the compound (a1) having two hydroxyl groups and one thiol group in the molecule and the tetracarboxylic dianhydride (b1). ) In the presence of a polyester (D) obtained by reacting with an acid anhydride group in the above), it can also be obtained by radical polymerization of an ethylenically unsaturated monomer (c) that forms a vinyl polymer site (C). .

  Examples of the ethylenically unsaturated monomer (c) used in the polyester dispersant include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n- Butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, tetrahydrofurfuryl ( (Meth) acrylate, isobornyl (meth) acrylate, 2-methyl-2-adamantyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, Noxydiethylene glycol (meth) acrylate, oxetane (meth) acrylate, etc., methoxypolypropylene glycol (meth) acrylate, alkoxypolyalkylene glycol (meth) acrylates such as ethoxypolyethylene glycol (meth) acrylate, (meth) acrylamide, and N, N-substituted (meth) acrylamides such as N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, diacetone (meth) acrylamide, acryloylmorpholine, N, N- Amino group-containing (meth) acrylates such as dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, and nitriles such as (meth) acrylonitrile And mixtures thereof.

  Furthermore, in this invention, the monomer represented by following General formula (18) can be used from an ethylenically unsaturated monomer illustrated above from a viewpoint of inorganic fine particle dispersibility. It is preferable that the usage-amount of the monomer represented by following General formula (18) is contained 5weight% or more with respect to the whole monomer. If it is less than 5% by weight, the effect of affinity for the solvent is lost. From the viewpoint of the balance between the dispersibility of the inorganic fine particles and the development resistance, 10 to 40% by weight is more preferable, and 15 to 35% by weight is most preferable.

[In General Formula (18), R ³² is a linear, branched or cyclic alkyl group having 1 to 20 carbon atoms which may have a substituent, and 1 carbon atom which may have a substituent. -20 alkenyl groups, a phenyl group which may have a substituent, or a compound represented by the following general formula (19), R ³¹ is a hydrogen atom or a methyl group. ]

[In General Formula (19), R ³³ is a linear or branched alkylene group having 1 to 8 carbon atoms, and R ³⁴ is a linear chain having 1 to 20 carbon atoms that may have a substituent. Or a branched or cyclic alkyl group, an alkenyl group having 1 to 20 carbon atoms which may have a substituent, or a phenylene group which may have a substituent, and n2 is 1 to 30 It is an integer. ]

  Examples of the compound having two hydroxyl groups and one thiol group in the molecule used in the present invention include 1-mercapto-1,1-methanediol, 1-mercapto-1,1-ethanediol, 3-mercapto- 1,2-propanediol (thioglycerin), 2-mercapto-1,2-propanediol, 2-mercapto-2-methyl-1,3-propanediol, 2-mercapto-2-ethyl-1,3-propane Examples include diol, 1-mercapto-2,2-propanediol, 2-mercaptoethyl-2-methyl-1,3-propanediol, 2-mercaptoethyl-2-ethyl-1,3-propanediol, and the like.

  The vinyl polymer having two hydroxyl groups at one end and used in the above-mentioned polyester dispersant and having two hydroxyl groups and one thiol group in the molecule is used as a vinyl polymer. According to the molecular weight of the polymer, it can be obtained by mixing one or more ethylenically unsaturated monomers and optionally a polymerization initiator and heating. The compound having two hydroxyl groups and one thiol group is preferably subjected to bulk polymerization or solution polymerization using 0.5 to 30 parts by weight with respect to 100 parts by weight of the ethylenically unsaturated monomer. Preferably it is 3-12 weight part, More preferably, it is 4-12 weight part, Most preferably, it is 5-9 weight part. If the amount is less than 0.5 part by weight, the molecular weight of the vinyl polymer portion is too high, and the absolute amount increases as an affinity portion for the inorganic fine particle carrier and the solvent, and the dispersibility effect itself may decrease. If it exceeds 30% by weight, the molecular weight of the vinyl polymer part is too low, and as an affinity part for the inorganic fine particle carrier and the solvent, the effect of steric repulsion is lost and it is difficult to suppress the aggregation of the inorganic fine particles. Become.

  The polycarboxylic acid anhydride used in the present invention contains at least a tetracarboxylic dianhydride. The two anhydride groups of tetracarboxylic dianhydride react with the hydroxyl groups of the polyol, so that the carboxyl groups that serve as the inorganic fine particle adsorption groups can be regularly arranged in the main chain of the polyester dispersant. Is advantageous.

  Examples of the tetracarboxylic dianhydride used in the polyester dispersant include 1,2,3,4-butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 3-dimethyl-1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1,2,3,4-cyclopentanetetracarboxylic dianhydride, 2,3,5-tricarboxycyclopentylacetic acid dianhydride 3,5,6-tricarboxynorbornane-2-acetic acid dianhydride, 2,3,4,5-tetrahydrofurantetracarboxylic dianhydride, 5- (2,5-dioxotetrahydrofural) -3-methyl Fats such as -3-cyclohexene-1,2-dicarboxylic dianhydride, bicyclo [2,2,2] -oct-7-ene-2,3,5,6-tetracarboxylic dianhydride Tetracarboxylic dianhydride, pyromellitic dianhydride, ethylene glycol ditrimellitic anhydride ester, propylene glycol ditrimellitic anhydride ester, butylene glycol ditrimellitic anhydride ester, 3,3 ′, 4,4 '-Benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6 , 7-naphthalenetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyl ether tetracarboxylic dianhydride, 3,3 ′, 4,4′-dimethyldiphenylsilanetetracarboxylic dianhydride, 3,3 ′, 4,4′-tetraphenylsilanetetracarboxylic dianhydride, 1,2,3,4-furantetracarboxylic acid Anhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenylsulfone dianhydride, 4,4′- Bis (3,4-dicarboxyphenoxy) diphenylpropane dianhydride, 3,3 ′, 4,4′-perfluoroisopropylidenediphthalic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic Acid dianhydride, bis (phthalic acid) phenylphosphine oxide dianhydride, p-phenylene-bis (triphenylphthalic acid) dianhydride, m-phenylene-bis (triphenylphthalic acid) dianhydride, bis (tri Phenylphthalic acid) -4,4′-diphenyl ether dianhydride, bis (triphenylphthalic acid) -4,4′-diphenylmethane dianhydride, 9,9- Bis (3,4-dicarboxyphenyl) fluorene dianhydride, 9,9-bis [4- (3,4-dicarboxyphenoxy) phenyl] fluorene dianhydride, 3,4-dicarboxy-1,2, Aromatic tetra such as 3,4-tetrahydro-1-naphthalene succinic dianhydride, 3,4-dicarboxy-1,2,3,4-tetrahydro-6-methyl-1-naphthalene succinic dianhydride Carboxylic dianhydrides are mentioned.

  The tetracarboxylic dianhydride used in the present invention is not limited to the compounds exemplified above, and may have any structure as long as it has two carboxylic anhydride groups. These may be used alone or in combination. Since tetracarboxylic dianhydride forms a dispersant having two carboxyl groups in one unit of polyester by reaction with a polyol, it is preferable as a component of the polyester dispersant from the viewpoint of adsorbing inorganic fine particles.

  Furthermore, what is preferably used in the present invention is an aromatic tetracarboxylic dianhydride, more preferably a tetracarboxylic dianhydride having two or more aromatic rings, from the viewpoint of adsorptivity to inorganic fine particles. It is. Aromatic carboxylic acids have a higher ability to adsorb inorganic fine particles than aliphatic carboxylic acids, and carboxylic acids having two or more aromatic rings are skeletons suitable for adsorbing inorganic fine particles and have high heat resistance.

<Silane coupling agent (I)>
The photosensitive resin composition of the present invention improves adhesion with a base material, chemical resistance, wet heat and heat resistance, compatibility with the isocyanurate skeleton-containing compound (C) by including a silane coupling agent, Developability can be imparted.

The silane coupling agent can be used both as a surface treatment agent for inorganic fine particles and as an adhesion promoter for the photosensitive resin composition.
When used as a surface treatment agent for inorganic fine particles, the effects described in the section of inorganic fine particles can be expected.
When used as an adhesion promoter for the photosensitive resin composition, it is preferable because adhesion to a substrate such as glass or ITO is improved.

As the silane coupling agent (I), known ones are used without particular limitation, and specifically, vinyl group, epoxy group, styryl group, (meth) acryloxy group, amino group, ureido group, mercapto group, sulfide group. , A silane coupling agent having a carbamate group or an isocyanate group.
Among these, it is preferable that the silane coupling agent (I) includes a silane coupling agent having a (meth) acryloxy group, an epoxy group, a carbamate group, or an isocyano group because of excellent adhesion to the organic layer. . Most preferred is a silane coupling agent having an epoxy group.
Particularly preferred is a silane coupling agent containing at least one organic group selected from a (meth) acryloxy group, an epoxy group, and the like.

Specifically, as such a silane coupling agent (I),
Silane coupling agents having a vinyl group such as vinyltris (β-methoxyethoxy) silane, vinylethoxysilane, vinyltrimethoxysilane, vinyltrichlorosilane,
β- (3,4-epoxycyclohexyl) methyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) methyltriethoxysilane, γ-glycidoxy Silane coupling agents having an epoxy group such as propyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane,
a silane coupling agent having a styryl group such as p-styryltrimethoxysilane,
Silane coupling agents having a (meth) acryloxy group such as γ-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane,
N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyldimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, N-β (aminoethyl) ) -Γ-aminopropylmethyldiethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-phenyl-γ-aminopropyltriethoxysilane , 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane hydrochloride, etc. Silane coupling agent,
A silane coupling agent having a ureido group such as 3-ureidopropyltriethoxysilane;
Silane coupling agents having a mercapto group such as γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane,
Silane coupling agents having sulfide groups such as bis (triethoxysilylpropyl) tetrasulfide,
A silane coupling agent having an isocyano group such as 3-isocyanatopropyltriethoxysilane;
3-carbamateethyl) propyltrimethoxysilane, (3-carbamateethyl) propyltripropoxysilane, (3-carbamatepropyl) propyltriethoxysilane, (3-carbamatepropyl) propyltrimethoxysilane, (3-carbamatepropyl) Propyltripropoxysilane, (3-carbamatebutyl) propyltriethoxysilane, (3-carbamatebutyl) propyltrimethoxysilane, (3-carbamatebutyl) propyltripropoxysilane, (3-carbamatebutyl) butyltripropoxy Silane, (3-carbamatebutyl) propylmethyldiethoxysilane, (3-carbamatepentyl) propyltriethoxysilane, (3-carbamatehexyl) propyltriethoxysilane, (3 Carbamate octyl) pentyl riboxysilane, (3-carbamateethyl) propylsilyltrichloride, (3-carbamateethyl) propyltrimethylsilane, (3-carbamateethyl) propyldimethylsilane, (3-carbamateethyl) propyltributylsilane, ( Examples thereof include silane coupling agents having a carbamate group such as 3-carbamateethyl) ethyl-p-xylenetriethoxysilane and (3-carbamateethyl) -p-phenylenetriethoxysilane.
These silane coupling agents (I) can be used alone or in admixture of two or more at any ratio as required.

  Among these, it is preferable that the silane coupling agent (I) includes a silane coupling agent having a (meth) acryloxy group, an epoxy group, or a carbamate group. Specifically, a (meth) acryloxy group is added. 3-methacryloxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyltrimethoxysilane having an epoxy group, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, having a carbamate group (3-carbamateethyl) Propyltriethoxysilane and the like are preferable because of good adhesion.

  The silane coupling agent may be a silanol compound produced by hydrolysis of the above compound or a polyorganosiloxane compound condensed with them.

  When used as a surface treatment agent for inorganic fine particles, it preferably has a reactive functional group and is cured together with the resin of the photosensitive resin composition of the present invention, so that the inorganic fine particles can be easily fixed in the cured film and the molded body. -Epoxysilanes such as (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, (Meth) such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane Acryloxysilanes.

  The addition amount of the surface treatment agent is preferably 0.1 to 30 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the inorganic fine particles.

When used as an adhesion promoter for a photosensitive resin composition, it preferably has a reactive functional group, is cured together with the resin of the photosensitive resin composition of the present invention, has excellent stability, and is a metal substrate such as glass or ITO. From the viewpoint of excellent adhesion, epoxy silanes, (meth) acryloxy silanes, or carbamate silanes are preferable, and more preferably,
Epoxysilanes such as 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 3-glycidoxypropyltriethoxysilane ,
3- (meth) acryloxypropylmethyldimethoxysilane, 3- (meth) acryloxypropyltrimethoxysilane, 3- (meth) acryloxypropylmethyldiethoxysilane, 3- (meth) acryloxypropyltriethoxysilane, etc. (Meth) acryloxysilanes,
(3-carbamateethyl) propyltriethoxysilane, (3-carbamateethyl) propyltrimethoxysilane, (3-carbamateethyl) propyltripropoxysilane, (3-carbamatepropyl) propyltriethoxysilane, (3-carbamatepropyl) ) Propyltrimethoxysilane, (3-carbamatepropyl) propyltripropoxysilane, (3-carbamatebutyl) propyltriethoxysilane, (3-carbamatebutyl) propyltrimethoxysilane, (3-carbamatebutyl) propyltripropoxy Silane, (3-carbamatebutyl) butyltripropoxysilane, (3-carbamatebutyl) propylmethyldiethoxysilane, (3-carbamatepentyl) propyltriethoxysilane, (3 Carbamatehexyl) propyltriethoxysilane, (3-carbamate octyl) pentyl riboxysilane, (3-carbamateethyl) propylsilyltrichloride, (3-carbamateethyl) propyltrimethylsilane, (3-carbamateethyl) propyldimethylsilane, Carbamate silanes such as (3-carbamateethyl) propyltributylsilane, (3-carbamateethyl) ethyl-p-xylenetriethoxysilane, and (3-carbamateethyl) -p-phenylenetriethoxysilane are preferred.

  Among them, from the viewpoint of reactivity with the resin contained in the photosensitive resin composition, 3-glycidoxypropyltrimethoxysilane, 3- (meth) acryloxypropyltrimethoxysilane, and (3-carbamateethyl) propyl Triethoxysilane or (3-carbamateethyl) propyltrimethoxysilane is preferred, and 3-glycidoxypropyltrimethoxysilane is particularly preferred.

  The weight average molecular weight (Mw) of the silane coupling agent is more preferably 50 or more and less than 5000 from the viewpoint of adhesion to a glass substrate, ITO, or other metal film, and the content of the silane coupling agent is From the viewpoint of adhesion to glass substrates, ITO, and other metal films, it is more preferable that the content is 100% by weight or more and less than 30% by weight in the total solid content of the photosensitive resin composition. More preferably, they are 1 weight% or more and less than 10 weight%.

  When the weight average molecular weight (Mw) of the silane coupling agent is 50 or more, it is preferable from the viewpoint of availability. When the weight average molecular weight is less than 5000, the adhesion to the glass substrate, ITO, and other metal films is improved. preferable. Further, when the content is 1% by weight or more, the transparency and the development patterning property are excellent, and when it is less than 30% by weight, not only the adhesion and hardness to the base material but also the development patterning property is preferable.

<Solvent>
Examples of the solvent include 1,2,3-trichloropropane, 1,3-butanediol, 1,3-butylene glycol, 1,3-butylene glycol diacetate, 1,4-dioxane, 2-heptanone, and 2-methyl. -1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutyl acetate, 3-methoxybutanol, 3-methoxybutyl acetate, 4-heptanone, m-xylene, m-diethylbenzene, m-dichlorobenzene N, N-dimethylacetamide, N, N-dimethylformamide, n-butylal N-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, o-chlorotoluene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotertiary butyl ether, Ethylene glycol monobutyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether Ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol Monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, cyclopentanone, dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl acetate Dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene Glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol Methyl isobutyl ketone, methyl cyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, dibasic acid ester, 3-methoxy-3-methyl-1-butanol, 1,3-butanediol 3-methyl-1,3-butanediol, 2-methyl-1,3-propanediol, diisobutylketone, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monobutyl ether acetate, ethylene glycol dibutyl ether, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol monoisopropyl ether, propylene glycol monobutyl ether Ter, propylene glycol diacetate, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol dimethyl ether, tripropylene glycol monomethyl ether, 3-methoxybutyl acetate, 3-methoxy-3- Methyl butyl acetate, γ-butyrolactone, N, N-dimethylacetamide, N-methylpyrrolidone, p-chlorotoluene, o-diethylbenzene, m-diethylbenzene, p-diethylbenzene, o-dichlorobenzene, m-dichlorobenzene, n-butyl Benzene, sec-butylbenzene, tert-butylbenzene, cyclohexanol, cyclohexyl acetate, methylcyclohexanol And the like, used alone or in combination.
Among these, 1,3-butylene glycol diacetate, ethyl 3-ethoxypropionate, and cyclohexanol acetate are preferable from the viewpoint of the dispersibility stability of the inorganic fine particles.

  The solvent can be used in an amount of 200 to 4000 parts by weight with respect to 100 parts by weight of the total solid content in the photosensitive resin composition.

<Colorant (H)>
By using the colorant (H), the photosensitive resin composition of the present invention can correct the hue of the photosensitive resin composition in order to adjust the chromaticity of the panel.
In particular, depending on the coating film forming step and the constituent components of the photosensitive resin composition, the coating film may shift to a yellowish hue. In such a case, the hue is adjusted by developing the colorant. This is preferable because a superior protective film and an insulating film for a touch panel can be formed.

Examples of the colorant (H) include pigments (H1) such as inorganic pigments and organic pigments, and dyes (H2) such as oil-soluble dyes, acid dyes, direct dyes, basic dyes, mordant dyes, acid mordant dyes, Pigment (H1) is preferable from the viewpoint of heat resistance Among the colorants (H), the pigment (H1) has a large effect of correcting the chromaticity shift, and among them, a group consisting of a red pigment, a blue pigment, and a purple pigment The inclusion of at least one selected from the above is preferable because the hue of the coating film can be easily adjusted to an appropriate chromaticity range, and a more excellent protective film and touch panel insulating film can be formed.

For example, when the photosensitive resin composition contains oxide fine particles (D), although depending on the type and content of the oxide fine particles (D), a * is −0.7 to −0. In some cases, b * shifts by about +0.01 to 2.4.
In such a case, since the hue of the photosensitive resin composition is a * <0, b *> 0, in order to set the hue to a * = 0 and b * = 0, redness (a * is in the + direction) ) And bluish (b * is in the negative direction), it is preferable to use a pigment containing at least one selected from the group consisting of a red pigment, a blue pigment, and a purple pigment, When a blue pigment and a red pigment are used, it is preferable because a coating film with more excellent hue can be obtained.

  The content of the colorant (H) is preferably 0.001% by weight or more and less than 1% by weight in the total solid content of 100% by weight of the resin composition. If the content is 0.001% by weight or more, a sufficient effect of adjusting the chromaticity is obtained, and if it is 1% by weight or less, the effect of adjusting the chromaticity is sufficient, and the transmittance is not lowered. It is preferable.

[Pigment (H1)]
As the pigment (H1), organic or inorganic pigments can be used alone or in admixture of two or more at any ratio as required. Among the pigments (H1), pigments having high color developability and high heat resistance, particularly organic pigments are preferable.
Further, among the pigments (H1)), the inclusion of at least one selected from the group consisting of a red pigment, a blue pigment, and a purple pigment makes it easy to make the hue of the coating film have an appropriate chromaticity range. ,preferable.

  Specific examples of organic pigments that can be preferably used in the photosensitive resin composition of the present invention are shown below by color index numbers, but are not limited thereto.

  Examples of red pigments include C.I. I. Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48: 1, 48: 2, 48: 3, 48: 4, 49, 49: 1, 49: 2, 50: 1, 52: 1, 52: 2, 53, 53: 1, 53: 2, 53: 3, 57, 57: 1, 57: 2, 58: 4, 60, 63, 63: 1, 63: 2, 64, 64: 1, 68, 69, 81, 81: 1, 81: 2, 81: 3, 81: 4, 83, 88, 90: 1, 101, 101: 1, 104, 108, 108: 1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 17 , 181, 184, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 260, 262, 263, 264, 265, 266, 267 268, 269, 270, 271, 272, 273, 274, 275, 276, and the like. Among these, from the viewpoint of obtaining a high contrast ratio and high brightness, C.I. I. Pigment Red 48: 1, 122, 168, 177, 202, 206, 207, 209, 224, 242, or 254, more preferably C.I. I. Pigment Red 177, 209, 224, 242, or 254.

  Examples of blue pigments include C.I. I. Pigment Blue 1, 1: 2, 9, 14, 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56: 1, 60, 61, 61: 1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79 and the like. Among these, from the viewpoint of obtaining a high contrast ratio and high brightness, C.I. I. Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, or 15: 6, and more preferably C.I. I. Pigment Blue 15: 6.

  Examples of purple pigments include C.I. I. Pigment Violet 1, 1: 1, 2, 2: 2, 3, 3: 1, 3: 3, 5, 5: 1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50 and the like. Among these, from the viewpoint of obtaining a high contrast ratio and high brightness, C.I. I. Pigment violet 19 or 23, more preferably C.I. I. Pigment Violet 23.

  Examples of the green pigment include C.I. I. Pigment green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 45, 48, 50, 51, 54, 55 or 58. Among these, from the viewpoint of obtaining a high contrast ratio and high brightness, C.I. I. Pigment Green 7, 36 or 58.

  Examples of yellow pigments include C.I. I. Pigment Yellow 1, 1: 1, 2, 3, 4, 5, 6, 9, 10, 12, 13, 14, 16, 17, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 41, 42, 43, 48, 53, 55, 61, 62, 62: 1, 63, 65, 73, 74, 75, 81, 83, 87, 93, 94, 95, 97, 100, 101, 104, 105, 108, 109, 110, 111, 116, 117, 119, 120, 126, 127, 127: 1, 128, 129, 133, 134, 136, 138, 139, 142, 147, 148, 150, 151, 153, 154, 155, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168, 169, 170, 172, 17 174, 175, 176, 180, 181, 182, 183, 184, 185, 188, 189, 190, 191, 191: 1, 192, 193, 194, 195, 196, 197, 198, 199, 200, 202 , 203, 204, 205, 206, 207, 208, and the like. Among these, from the viewpoint of obtaining a high contrast ratio and high brightness, C.I. I. Pigment Yellow 83, 117, 129, 138, 139, 150, 154, 155, 180, or 185, more preferably C.I. I. Pigment yellow 83, 138, 139, 150, or 180.

<< Refining of pigment (H1) >>
The pigment (H1) used in the photosensitive resin composition of the present invention is preferably used after being refined. There are no particular limitations on the method of miniaturization. For example, any of wet grinding, dry grinding, and dissolution precipitation can be used. As exemplified in the present invention, salt milling treatment by a kneader method, which is one type of wet grinding. Etc. can be made finer. It is preferable that the average primary particle diameter calculated | required by TEM (transmission electron microscope) of a pigment is the range of 5-90 nm. When the thickness is smaller than 5 nm, dispersion in an organic solvent becomes difficult. When the thickness is larger than 90 nm, a sufficient contrast ratio cannot be obtained. For these reasons, a more preferable average primary particle size is in the range of 10 to 70 nm.

  Salt milling is a process in which a mixture of pigment, water-soluble inorganic salt and water-soluble organic solvent is heated using a kneader such as a kneader, two-roll mill, three-roll mill, ball mill, attritor, or sand mill. After kneading, the water-soluble inorganic salt and the water-soluble organic solvent are removed by washing with water. The water-soluble inorganic salt serves as a crushing aid, and the pigment is crushed using the high hardness of the inorganic salt during salt milling. By optimizing the conditions for salt milling the pigment, it is possible to obtain a pigment having a sharp particle size distribution with a very fine primary particle diameter and a wide distribution range.

  As the water-soluble inorganic salt, sodium chloride, barium chloride, potassium chloride, sodium sulfate and the like can be used, but sodium chloride (salt) is preferably used from the viewpoint of cost. The water-soluble inorganic salt is preferably used in an amount of 50 to 2000 parts by weight, and most preferably 300 to 1000 parts by weight with respect to 100 parts by weight of the pigment (H1), from the viewpoints of processing efficiency and production efficiency.

  The water-soluble organic solvent functions to wet the pigment and the water-soluble inorganic salt, and is not particularly limited as long as it dissolves (mixes) in water and does not substantially dissolve the inorganic salt to be used. However, a high boiling point solvent having a boiling point of 120 ° C. or higher is preferable from the viewpoint of safety because the temperature rises during salt milling and the solvent is easily evaporated. For example, 2-methoxyethanol, 2-butoxyethanol, 2- (isopentyloxy) ethanol, 2- (hexyloxy) ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, Liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, liquid polypropylene glycol and the like are used. The water-soluble organic solvent is preferably used in an amount of 5 to 1000 parts by weight, and most preferably 50 to 500 parts by weight, based on 100 parts by weight of the pigment (H1).

  When the salt is milled, a resin may be added as necessary. The type of resin used is not particularly limited, and natural resins, modified natural resins, synthetic resins, synthetic resins modified with natural resins, and the like can be used. The resin used is solid at room temperature, preferably insoluble in water, and more preferably partially soluble in the organic solvent. It is preferable that the usage-amount of resin is the range of 5-200 weight part with respect to 100 weight part of pigments (H1).

  When preparing a pigment dispersion, it is preferable to add a pigment derivative in order to prevent aggregation of the pigment and maintain a finely dispersed state of the pigment. The content of the pigment derivative is preferably 0.5 parts by weight or more, more preferably 1 part by weight or more, and most preferably 3 parts by weight or more with respect to 100 parts by weight of the pigment. Further, from the viewpoint of heat resistance and light resistance, it is preferably 40 parts by weight or less, and most preferably 35 parts by weight or less with respect to 100 parts by weight of the pigment (H1).

[Dye (H2)]
In the colored photosensitive resin composition of the present invention, a dye (H2) is also preferably used as the colorant (H). The dye (H2) may be used alone, or two or more dyes may be mixed at an optional ratio as necessary, or may be used in combination with the pigment (H1) described above. Furthermore, it is preferable to include at least one selected from the group consisting of a red dye, a blue dye, and a purple dye, particularly from the viewpoint of correcting the chromaticity of the touch panel constituent member, such as titanium oxide added as necessary.

Examples of the form of the dye (H2) include those having any form of various dyes such as oil-soluble dyes, acid dyes, direct dyes, basic dyes, mordant dyes, and acid mordant dyes.
The dye may be used in the form of a lake, or may be in the form of a salt-forming compound of a dye and a nitrogen-containing compound.

  The dye (H2) is not particularly limited as long as it is generally referred to as a dye. Among them, triphenylmethane dyes, diphenylmethane dyes, quinoline dyes, thiazine dyes, thiazole dyes, xanthene dyes Dyes, flavin dyes, auramine dyes, safranine dyes, phloxine dyes, methylene blue dyes, and the like can be used.

Dye (H2) has good spectral characteristics and excellent color developability, but has problems in light resistance and heat resistance, and its characteristics are sufficient for use as a component of touch panels that require high reliability. It may not be something.
Therefore, in order to improve these disadvantages, in the case of a basic dye, it is preferable to use a salt-forming compound salted with an organic acid or perchloric acid. As the organic acid, organic sulfonic acid or organic carboxylic acid is preferably used. Of these, naphthalenesulfonic acid such as tobias acid and perchloric acid are preferably used in terms of resistance.
In the case of acidic dyes and direct dyes, a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, a primary amine compound, and the like, and a salt formed using a resin component having these functional groups It is preferable in terms of resistance to use as a salt compound or as a salt-forming compound obtained by sulfonamidation to obtain a sulfonic acid amide compound.

<Method of adding colorant (H)>
As a method of adding the colorant (H), any method such as adding the colorant as it is to the resin composition of the present invention, or adding it as a color composition mixed in a colorant carrier and / or a solvent such as a resin, etc. Even if it uses, it is not restrict | limited, However, It is preferable to add as a coloring composition at the point which is excellent in the transparency of the photosensitive resin composition especially.

  The coloring composition includes the thermoplastic resin described above as the other resin that can be used in combination with the acid group-containing resin (A) and the acid group-containing resin (A), if necessary, a resin having an ethylenically unsaturated double bond, and the like. Various dispersions such as a kneader, a two-roll mill, a three-roll mill, a ball mill, a horizontal sand mill, a vertical sand mill, an annular bead mill, or an attritor, preferably in a colorant carrier and / or solvent It can be produced by finely dispersing using means (colorant dispersion). When two or more colorants are included, these colorants and the like may be simultaneously dispersed in the colorant carrier, or those separately dispersed in the colorant carrier may be mixed. In addition, when the colorant has high solubility due to dyes or the like, specifically, it is highly soluble in the solvent to be used. There is no need to manufacture.

(Dispersing aid)
When dispersing the colorant in the colorant carrier, a dispersion aid such as a pigment derivative, a resin-type dispersant, or a surfactant may be appropriately contained. Since the dispersion aid has a large effect of preventing re-aggregation of the colorant after dispersion, the color composition obtained by dispersing the colorant in the colorant carrier using the dispersion aid has brightness, contrast ratio, and Viscosity stability is improved.

  Examples of the dye derivative include a compound obtained by introducing a basic substituent, an acidic substituent, or a phthalimidomethyl group which may have a substituent into an organic pigment, anthraquinone, acridone, or triazine. 63-305173, JP-B-57-15620, JP-B-59-40172, JP-B-63-17102, JP-B-5-9469, JP-A-2001-335717, JP-A-2003 128669, JP-A-2004-091497, JP-A-2007-156395, JP-A-2008-094773, JP-A-2008-094986, JP-A-2008-095007, JP-A-2008-195916 Gazettes, Japanese Patent No. 4585781 etc. can be used. These may be used alone or in combination of two or more.

  The content of the pigment derivative is preferably 0.5 parts by weight or more, more preferably 1 part by weight or more, and most preferably 3 parts by weight or more with respect to 100 parts by weight of the colorant (H) from the viewpoint of improving dispersibility. is there. Further, from the viewpoint of heat resistance and light resistance, it is preferably 40 parts by weight or less, more preferably 35 parts by weight or less.

The resin-type dispersant has a colorant affinity part having a property of adsorbing to the colorant and a part compatible with the colorant carrier, and adsorbs to the colorant to disperse the colorant to the colorant carrier. It works to stabilize. Specific examples of resin-type dispersants include polycarboxylic acid esters such as polyurethane and polyacrylate, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, and polycarboxylic acid alkylamine salts. , Polysiloxane, long-chain polyaminoamide phosphate, hydroxyl group-containing polycarboxylic acid ester, modified products thereof, amides formed by reaction of poly (lower alkyleneimine) and polyester having a free carboxyl group, and salts thereof Oil-soluble dispersants such as, (meth) acrylic acid-styrene copolymer, (meth) acrylic acid- (meth) acrylic acid ester copolymer, styrene-maleic acid copolymer, polyvinyl alcohol, polyvinylpyrrolidone, etc. Resin, water-soluble polymer, polyester, modified poly Acrylate-based, ethylene oxide / propylene oxide addition compound, phosphate ester-based and the like are used, they can be used alone or in admixture of two or more, not necessarily limited thereto.
Moreover, the dispersing agent mentioned above can also be used as a dispersing agent of inorganic fine particles.

  Commercially available resin-type dispersants include Disperbyk-101, 103, 107, 108, 110, 111, 116, 130, 140, 154, 161, 162, 163, 164, 165, 166, 167, 168 manufactured by Big Chemie. 170, 171, 174, 180, 181, 182, 183, 184, 185, 2000, 2001, 2009, 2020, 2025, 2050, 2070, 2095, 2150, 2155, 2163, 2164 or Anti-Terra-U, 203 204, or BYK-P104, P104S, 220S, 6919, 21116 or LACTIMON or BYKUMEN, etc., SOLPERSE-3000, 9000, 13000, 13240, 13650, 139 manufactured by Nippon Lubrizol Corporation 0, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53955, 55000, 56000, EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, manufactured by BASF Japan 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 50 6,5070,7500,7554,1101,120,150,1501,1502,1503, etc., Ajinomoto Fine-Techno Co., Ltd. of AJISPER PA111, PB711, PB821, PB822, PB824, and the like.

  Surfactants include sodium lauryl sulfate, polyoxyethylene alkyl ether sulfate, sodium dodecylbenzene sulfonate, alkali salt of styrene-acrylic acid copolymer, sodium stearate, sodium alkyl naphthalene sulfonate, sodium alkyl diphenyl ether disulfonate Anionic surfactants such as lauryl sulfate monoethanolamine, lauryl sulfate triethanolamine, ammonium lauryl sulfate, monoethanolamine stearate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate; Polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene Nonionic surfactants such as alkyl ether phosphates, polyoxyethylene sorbitan monostearate and polyethylene glycol monolaurate; chaotic surfactants such as alkyl quaternary ammonium salts and their ethylene oxide adducts; alkyldimethylamino Examples include amphoteric surfactants such as alkylbetaines such as betaine acetate and alkylimidazolines, and these can be used alone or in admixture of two or more, but are not necessarily limited thereto.

  When a resin-type dispersant and a surfactant are added, the amount is preferably 0.1 to 55 parts by weight, more preferably 0.1 to 45 parts by weight with respect to 100 parts by weight of the colorant (H). When the blending amount of the resin-type dispersant and the surfactant is less than 0.1 parts by weight, it is difficult to obtain the added effect. When the content is more than 55 parts by weight, the dispersion is affected by an excessive dispersant. May affect.

<Other ingredients>
In the photosensitive resin composition of the present invention, a storage stabilizer, a light stabilizer, an antioxidant and the like can be used as necessary.

(Leveling agent)
In order to improve the leveling property of the composition on the transparent substrate, it is preferable to add a leveling agent to the photosensitive resin composition of the present invention. Generally, the leveling agent includes dimethylsiloxane having a polyether structure or a polyester structure in the main chain. Specific examples of dimethylsiloxane having a polyether structure in the main chain include FZ-2122 manufactured by Toray Dow Corning, BYK-330, BYK-323, BYK-348 manufactured by BYK Chemie. Specific examples of dimethylsiloxane having a polyester structure in the main chain include BYK-310 and BYK-370 manufactured by BYK Chemie. Dimethylsiloxane having a polyether structure in the main chain and dimethylsiloxane having a polyester structure in the main chain can be used in combination. In general, the leveling agent is preferably used in an amount of 0.003 to 0.5% by weight in a total of 100% by weight of the photosensitive resin composition.

Among dimethylsiloxanes having a polyether structure in the main chain, a leveling agent represented by the following general formula (20) is preferable.

[In General formula (20), m2 is an integer of 1-10, p1 is an integer of 5-30, X is an alkylene group, Y is an alkyl group. ]
By including the leveling agent represented by the general formula (20), the compatibility between the inorganic fine particles and the resin is improved, and the cloudiness of the coating liquid can be improved.
Specific examples include BYK-348 manufactured by Big Chemie.

An anionic, cationic, nonionic or amphoteric surfactant can be supplementarily added to the leveling agent. Two or more kinds of surfactants may be mixed and used.
Anionic surfactants added to the leveling agent as auxiliary agents include polyoxyethylene alkyl ether sulfate, sodium dodecylbenzene sulfonate, alkali salt of styrene-acrylic acid copolymer, sodium alkyl naphthalene sulfonate, alkyl diphenyl ether disulfonic acid Sodium, lauryl sulfate monoethanolamine, lauryl sulfate triethanolamine, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymer, polyoxyethylene alkyl ether phosphate Examples include esters.

  Examples of the chaotic surfactant that is supplementarily added to the leveling agent include alkyl quaternary ammonium salts and their ethylene oxide adducts. Nonionic surfactants added to the leveling agent as auxiliary agents include polyoxyethylene oleyl ether, polyoxyethylene lauryl ether, polyoxyethylene nonylphenyl ether, polyoxyethylene alkyl ether phosphate ester, polyoxyethylene sorbitan monostearate And amphoteric surfactants such as alkyl dimethylamino acetic acid betaine and alkylimidazolines, and fluorine-based and silicone-based surfactants.

  The leveling agent is preferably used in an amount of 0.1 to 10% by weight in a total of 100% by weight of the solid content of the photosensitive resin composition. If the amount is less than 0.1% by weight, it is difficult to obtain a compatibility improving effect due to the small amount added. If the amount exceeds 10% by weight, the resin, polyfunctional monomer, photopolymerization initiator, etc. in the photosensitive resin composition may be present. Since it decreases relatively, characteristics such as hardness and development patterning property tend to deteriorate.

(Antioxidant)
The photosensitive resin composition of the present invention preferably contains an antioxidant. The antioxidant can suppress a decrease in transmittance due to yellowing or the like due to the heating process. Therefore, by including an antioxidant, yellowing during the heating step can be prevented, and a coating film having a high transmittance can be obtained.

  The “antioxidant” in the present invention may be a compound having an ultraviolet absorbing function, a radical scavenging function, or a peroxide decomposing function. Specifically, as an antioxidant, a hindered phenol type, a hindered amine type are used. , Phosphorus-based, sulfur-based, benzotriazole-based, benzophenone-based, hydroxylamine-based, salicylate-based, and triazine-based compounds, and known ultraviolet absorbers, antioxidants, and the like can be used. The antioxidant of the present invention is particularly preferably a phenol-based antioxidant, a phosphorus-based antioxidant and a sulfur-based antioxidant from the viewpoint of achieving both transmittance and sensitivity of the coating film. Among phenol-based compounds, hindered phenol-based antioxidants having high steric hindrance are particularly preferable.

[Phenolic antioxidant]
For example, 2,6-di-t-butyl-4-ethylphenol, 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1,3 , 5-triazine, 2,2-thio-diethylenebis {3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate}, N, N'-hexamethylenebis (3,5-di- t-butyl-4-hydroxy-hydrocinnamide), 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, tris- (3,5-di-t-butyl-4-hydroxybenzyl) -Isocyanurate, 2,6-di-t-butylphenol, 2,6-di-t-butyl-p-cresol, 2,6-di-t-butyl-4-methoxyphenol, triethylene glycol- Bis {3- (3-t-butyl-5-methyl-4-hydroxyphenyl) propionate}, 1,6-hexanediol-bis {3- (3,5-di-t-butyl-4-hydroxyphenyl) Propionate}, pentaerythrityl-tetrakis {3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate}, octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) Examples include propionate and 1,3,5-trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxyphenyl) benzene. .

  Among them, 2,4-bis- (n-octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, pentaerythritol tetrakis [3- (3 5-di-tert-butyl-4-hydroxyphenyl) propionate], N, N′-hexamethylenebis (3,5-di-tert-butyl-4-hydroxy-hydrocinnamide), 3,5-di-t- A hindered phenolic antioxidant selected from the group consisting of butyl-4-hydroxybenzylphosphonate-diethyl ester and tris- (3,5-di-t-butyl-4-hydroxybenzyl) -isocyanurate is: It is preferable from the viewpoint of photocurability.

[Phosphorus antioxidant]
Although what is marketed can be used as phosphorus antioxidant, Tris [2,4-di- (tert) -butylphenyl] phosphinetris [2-[[2,4,8,10-tetrakis ( 1,1-dimethylethyl) dibenzo [d, f] [1,3,2] dioxaphosphin-6-yl] oxy] ethyl] amine, tris [2-[(4,6,9,11- Tetra-tert-butyldibenzo [d, f] [1,3,2] dioxaphosphin-2-yl) oxy] ethyl] amine, ethylbisphosphite (2,4-ditert-butyl-6-) Methylphenyl), and at least one compound selected from the group consisting of these is preferable, and one or more of these can be used.

[Sulfur antioxidants]
A sulfur-based antioxidant is an antioxidant containing sulfur in the molecule. As such a sulfur-containing antioxidant, commercially available ones can be used, but dioctadecyl 3,3′-thiodipropanoate, dimyristyl-3,3′-thiodipropionate, dipalmityl-3,3′- Thiodipropionate, distearyl-3,3′-thiodipropionate, 4,4′-thiobis-3-methyl-6-tert-butylphenol, thiodiethylenebis [3- (3,5-di-tert- Butyl-4-hydroxyphenyl) propionate], and is preferably at least one compound selected from the group consisting of these, and one or more of these may be used.

  These antioxidants can be used singly or in combination of two or more at any ratio as required.

  The content of the antioxidant is preferably 0.1% by weight or more and 4% by weight or less in the total solid content of 100% by weight of the photosensitive resin composition. When the amount is less than 0.1% by weight, it is difficult to obtain a yellowing prevention effect due to insufficient antioxidant, and when the amount is more than 4% by weight, the radicals generated at the time of UV exposure are captured. Curing of the composition may be insufficient.

(Storage stabilizer)
The photosensitive resin composition of the present invention can contain a storage stabilizer. Examples of the storage stabilizer include quaternary ammonium chlorides such as benzyltrimethyl chloride and diethylhydroxyamine, organic acids such as lactic acid and oxalic acid, and organic acids such as methyl ether, t-butylpyrocatechol, triethylphosphine, and triphenylphosphine. Examples thereof include phosphine and phosphite. The storage stabilizer can be used in an amount of 0.1 to 5% by weight in a total of 100% by weight of the photosensitive resin composition.

<Production method of photosensitive resin composition>
The photosensitive resin composition of the present invention comprises an alkali-soluble resin (A), a silane coupling agent (I), an isocyanurate skeleton-containing compound (C), and a photopolymerization initiator (B) added as necessary. And inorganic fine particles (D), a solvent and the like can be obtained by stirring and mixing.
The photosensitive resin composition of the present invention is a coarse particle having a size of 5 μm or more, preferably a coarse particle having a size of 1 μm or more, more preferably a coarse particle having a size of 0.5 μm or more, by means of centrifugation, sintered filter, membrane filter or the like. It is preferable to remove the mixed dust and foreign matter.

<< Coating film >>
The photosensitive resin composition of the present invention is suitable for touch panels, liquid crystal display devices, organic EL devices, and the like because it can form a coating film having excellent hardness, adhesion, etchant resistance, and moist heat resistance.

  The photosensitive resin composition according to the present invention is applied to glass substrates, ITO, molybdenum, other metal films, organic films, etc. by spin coating such as spin coating, casting coating such as die coating, coating by roll coating, roll A coating film can be formed by application by a transfer method or the like, and can be produced by a printing method or a photolithography method. Among these, it is preferable to manufacture by a photolithography method.

  When forming a coating film by photolithography, a photosensitive resin composition prepared as a solvent development type or an alkali development type is applied on a transparent substrate by spray coating, spin coating, slit coating, die coating, roll coating, etc. Apply by the method. If necessary, the dried coating film is exposed to ultraviolet rays through a mask having a predetermined pattern provided in contact with or non-contact with the coating film. Thereafter, the uncured portion can be removed by dipping in a solvent or an alkali developer or spraying the developer with a spray or the like to form a cured coating film. Furthermore, in order to accelerate | stimulate superposition | polymerization of the photosensitive resin composition, it can also heat as needed.

In development, an aqueous solution of sodium carbonate, sodium hydroxide, potassium hydroxide or the like is used as an alkali developer, and an organic alkali such as tetramethylammonium hydroxide (TMAH), dimethylbenzylamine, triethanolamine or the like can also be used. . Moreover, an antifoamer and surfactant can also be added to a developing solution.
In order to increase the UV exposure sensitivity, after applying and drying the photosensitive resin composition, a water-soluble or alkaline water-soluble resin such as polyvinyl alcohol or water-soluble acrylic resin is applied and dried to prevent polymerization inhibition by oxygen. Ultraviolet exposure can also be performed after forming a film.

  Further, the photosensitive resin composition of the present embodiment may be used for any of protective film applications, flat film applications, insulating film applications, antireflection film applications, and coating film formation is also a touch panel, a liquid crystal display device, Since it may be formed by any organic EL device and has high hardness, high adhesion, and good transparency, it can be used in combination as a protective film, a flat film, an insulating film, or an antireflection film.

  Hereinafter, the present invention will be described by way of examples. In the examples, “parts” and “%” represent “parts by weight” and “% by weight”, respectively. “PGMEA” means propylene glycol monomethyl ether acetate.

  Prior to the examples, a method for measuring the weight average molecular weight of the resin, the acid value of the resin, and the average primary particle diameter of the pigment, the method of calculating the double bond equivalent of the resin, and the hydroxyl equivalent will be described.

(Weight average molecular weight of resin)
The weight average molecular weight (Mw) of the resin was measured in terms of polystyrene measured using TSKgel column (manufactured by Tosoh Corporation) and GPC (manufactured by Tosoh Corporation, HLC-8120GPC) equipped with an RI detector using THF as a developing solvent. It is a weight average molecular weight (Mw).

(Resin acid value)
80 ml of acetone and 10 ml of water are added to 0.5 to 1 g of the resin solution and stirred to dissolve uniformly, and an automatic titrator ("COM-555" manufactured by Hiranuma Sangyo Co., Ltd.) is used with a 0.1 mol / L KOH aqueous solution as a titrant. ), And the acid value (mgKOH / g) of the resin solution was measured. Then, the acid value per solid content of the resin was calculated from the acid value of the resin solution and the solid content concentration of the resin solution.

(Average primary particle diameter of pigment)
The average primary particle diameter was measured by a method of directly measuring the size of primary particles from an electron micrograph using a transmission (TEM) electron microscope. Specifically, the minor axis diameter and major axis diameter of the primary particles of each pigment are measured, and the average is used as the particle diameter of the primary pigment particles. Next, for 100 or more pigment particles, the volume (weight) of each particle was obtained by approximating the obtained particle size cube, and the volume average particle size was defined as the average primary particle size.

(Double bond equivalent of resin)
Double bond equivalent is a measure of the amount of double bonds contained in a molecule. If the compounds have the same molecular weight, the amount of double bonds introduced increases as the double bond equivalent value decreases. . The double bond equivalent was calculated by the following formula.
[Double bond equivalent] = [Molecular weight of monomer component having double bond] / [Composition ratio of monomer component having double bond in resin]

(Hydroxyl equivalent of resin)
The hydroxyl group equivalent is a measure of the amount of hydroxyl group contained in the molecule. If the compounds have the same molecular weight, the amount of hydroxyl group introduced increases as the value of the hydroxyl group equivalent decreases. The hydroxyl equivalent was calculated by the following formula.
[Hydroxyl equivalent] = [Molecular weight of monomer component having hydroxyl group] / [Composition ratio of monomer component having hydroxyl group in resin]

  Subsequently, the resin solution, the silane coupling agent, the inorganic fine particle dispersant, the inorganic fine particle dispersion, the fine pigment, and the pigment dispersion used in the examples and comparative examples will be described.

<Method for producing resin solution>
(Resin solution (A1-a1))
Put 100 parts of PGMEA in a reaction vessel equipped with a thermometer, cooling tube, nitrogen gas inlet tube, and stirring device in a separable four-necked flask, and heat it to 120 ° C. while injecting nitrogen gas into the vessel. A mixture of 5.2 parts of styrene, 35.5 parts of glycidyl methacrylate, 41.0 parts of dicyclopentanyl methacrylate and 1.0 part of azobisisobutyronitrile was added dropwise over 2.5 hours to carry out a polymerization reaction.
Next, the inside of the flask was purged with air, 0.3 parts of trisdimethylaminomethylphenol and 0.3 part of hydroquinone were added to 17.0 parts of acrylic acid, and the reaction was continued at 120 ° C. for 5 hours. The reaction was terminated when the ratio reached 0.8, and a resin solution having a weight average molecular weight of about 12,000 was obtained.
Further, 30.4 parts of tetrahydrophthalic anhydride and 0.5 part of triethylamine were added and reacted at 120 ° C. for 4 hours, and PGMEA was added so that the nonvolatile content was 40% to prepare a resin solution (A1-a1).

(Resin solution (A1-a2))
Put 182 parts of PGMEA in a reaction vessel equipped with a thermometer, cooling tube, nitrogen gas inlet tube, and stirring device in a separable four-necked flask, and heat to 100 ° C. while injecting nitrogen gas into the vessel. A mixture of 70.5 parts of benzyl methacrylate, 22.0 parts of dicyclopentanyl methacrylate, 43.0 parts of methacrylic acid, 136 parts of PGMEA, and 3.6 parts of azobisisobutyronitrile is added dropwise over 2 hours, and further 100 The polymerization reaction was carried out by stirring for 5 hours at ° C.
Next, the inside of the flask was purged with air, 0.9 part of trisdimethylaminomethylphenol and 0.145 part of hydroquinone were added to 35.5 parts of glycidyl methacrylate, the reaction was continued at 110 ° C. for 6 hours, and the solid content acid value = 0. The reaction was terminated when it reached 0.8, and PGMEA was added so that the nonvolatile content was 40% to prepare a resin solution (A1-a2). The weight average molecular weight was about 13,000.

(Resin solution (A1-a3))
A reactor equipped with a separable four-necked flask equipped with a thermometer, a cooling tube, a nitrogen gas inlet tube, and a stirring device was charged with 70.0 parts of PGMEA, heated to 80 ° C., and the inside of the reaction vessel was purged with nitrogen. A mixture of 67.2 parts of benzyl methacrylate, 18.4 parts of methacrylic acid, 14.4 parts of dicyclopentanyl methacrylate, and 0.4 parts of 2,2′-azobisisobutyronitrile is added dropwise over 2 hours to polymerize the reaction. Went. After completion of the dropping, the reaction was continued for 3 hours to obtain an acrylic resin solution having a solid content of 30% by weight.
After cooling to room temperature, sample 2 parts of the resin solution, heat dry at 180 ° C for 20 minutes, measure the nonvolatile content, and add PGMEA to the previously synthesized resin solution so that the nonvolatile content is 20 wt% Thus, a resin solution (A1-a3) was prepared. The solid content acid value was 46.8 mgKOH / g, and the weight average molecular weight was 32,000.

(Resin solution (A1-b1))
A separable flask equipped with a cooling tube as a reaction tank was prepared, while as a monomer dropping tank, 30 parts of dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, 22.7 parts of methacrylic acid, 30 parts of benzyl methacrylate, 4 parts of t-butyl peroxy-2-ethylhexanoate (Nippon Yushi "Perbutyl O") and 100 parts of PGMEA were prepared and mixed well. As a chain transfer agent dropping tank, n- What mixed 8 parts dodecanethiol and 32 parts PGMEA well was prepared.
After charging 30 parts of PGMEA into the reaction vessel and replacing with nitrogen, the reaction vessel was heated in an oil bath while stirring to raise the temperature of the reaction vessel to 90 ° C. After the temperature of the reaction vessel was stabilized at 90 ° C., dropping was started from the monomer dropping vessel and the chain transfer agent dropping vessel. The dropwise addition was performed for 135 minutes each while maintaining the temperature at 90 ° C. Sixty minutes after the completion of dropping, the temperature was raised and the reaction vessel was brought to 110 ° C. After maintaining at 110 ° C. for 3 hours, a gas introduction tube was attached to the separable flask, and bubbling of oxygen / nitrogen = 5/95 (volume ratio) mixed gas was started. Next, 26.4 parts of glycidyl methacrylate, 0.4 part of 2,2′-methylenebis (4-methyl-6-tert-butylphenol) and 0.8 part of triethylamine were charged into the reaction vessel and reacted at 110 ° C. for 9 hours. I let you. Thereafter, 30 parts of PGMEA was added and cooled to room temperature, about 2 parts of the resin solution was sampled, heated and dried at 180 ° C. for 20 minutes to measure the nonvolatile content, and the previously synthesized resin solution had a nonvolatile content of 40% by weight. Thus, PGMEA was added to obtain a resin solution (A1-b1). The weight average molecular weight of the resin was 10,000, and the acid value per solid content was 80 mgKOH / g. The double bond equivalent was 800 and the hydroxyl equivalent was 800.

(Resin solution (A2-1))
Process 1
PGMEA 100 parts in a reaction vessel equipped with a stirrer, thermometer, dropping device, reflux condenser, gas introduction pipe, heated to 70 ° C. while injecting nitrogen gas into the vessel, 5.0 parts of styrene at the same temperature, A mixture of 15.9 parts of cyclohexyl methacrylate, 31.7 parts of methacrylic acid, and 1 part of 2,2′-azobisisobutyronitrile was added dropwise over 1 hour to carry out a polymerization reaction. After completion of the dropwise addition, the mixture was further reacted at 70 ° C. for 3 hours, and then 0.2 parts of azobisisobutyronitrile dissolved in 40 parts of PGMEA was added, followed by stirring at the same temperature for 3 hours. Got.
Process 2
Next, dry air was introduced into the reaction vessel, charged with 50.0 parts of glycidyl methacrylate, 37.0 parts of PGMEA, 0.3 part of dimethylbenzylamine, and 0.1 part of methoquinone, and then continued stirring at the same temperature for 10 hours. It was. After cooling to room temperature, a resin solution (B-1) having a solid content of 40% by weight, a weight average molecular weight of 45,000, an acid value of 20, and a double bond equivalent of 300 was obtained by dilution with PGMEA.

<Method for producing silane coupling agent (I)>
(Silane coupling agent (I-1))
Prepare a flask equipped with a cooling tube as a reaction tank, and thoroughly stir and mix 100 g of 3-isocyanatopropyltriethoxysilane (“KBE-9007” manufactured by Shin-Etsu Chemical Co., Ltd.) and 100 g of ethanol (manufactured by Kishida Chemical Co., Ltd.). After substituting with nitrogen, the temperature of the reaction vessel was raised to 60 ° C. by heating in an oil bath while stirring. After the temperature of the reaction vessel was stabilized at 60 ° C., the mixture was stirred for 6 hours. After confirming the completion of the reaction by FT-IR spectrum, the temperature of the reaction vessel was lowered to room temperature, and the sample was taken out and stored in a container purged with nitrogen. As a result of analyzing the molecular weight distribution with a gel permeation chromatography (GPC) analyzer (Shodex GPC system manufactured by Showa Denko KK), the weight average molecular weight (Mw) was about 293.

<Method for producing dispersant for inorganic fine particles (D)>
(Dispersant 1)
A reaction vessel equipped with a gas inlet tube, a thermometer, a condenser, and a stirrer was charged with 62.6 parts of 1-dodecanol, 287.4 parts of ε-caprolactone, and 0.1 part of monobutyltin (IV) oxide as a catalyst. After replacing with nitrogen gas, the mixture was heated and stirred at 120 ° C. for 4 hours. It was confirmed that 98% had reacted by solid content measurement, and the first step was completed. The weight average molecular weight of this reaction product was 2000.
To the reaction product, 36.6 parts of pyromellitic dianhydride was added and reacted at 100 ° C. for 5 hours. The acid value was measured to confirm that 97% or more of the acid anhydride had been half-esterified, and the second step was completed. A solution with a non-volatile content of 50% by weight was prepared by adjusting the solid content with cyclohexanone to obtain a cyclohexanone solution of Dispersant 1 having a weight average molecular weight of 4000 and an acid value of 49 mgKOH / g.

(Dispersant 2)
A reaction vessel equipped with a gas introduction tube, a thermometer, a condenser, and a stirrer was charged with 5 parts of n-butyl acrylate, 20 parts of tert-butyl methacrylate, 50 parts of 2-methoxyethyl acrylate, and 15 parts of methyl methacrylate. Replaced. A solution obtained by heating the inside of the reaction vessel to 80 ° C. and dissolving 0.1 part of 2,2′-azobisisobutyronitrile in 45.7 parts of cyclohexanone in 6 parts of 3-mercapto-1,2-propanediol. And reacted for 10 hours. It was confirmed that 95% had reacted by solid content measurement. At this time, the weight average molecular weight was 4000. Next, 9.7 parts of pyromellitic dianhydride, 70 parts of cyclohexanone, and 0.20 part of 1,8-diazabicyclo- [5.4.0] -7-undecene as a catalyst were added, and the mixture was heated at 120 ° C. for 7 hours. Reacted. The reaction was terminated after confirming that 98% or more of the acid anhydride had been half-esterified by measuring the acid value. After completion of the reaction, the nonvolatile content was adjusted to 50% by weight to obtain a cyclohexanone solution of Dispersant 2 having a weight average molecular weight of 8,100 and an acid value of 50 mgKOH / g.

<Method for producing dispersion of inorganic fine particles (D)>
(Inorganic fine particle dispersion (D-1 to 5))
Using Dispersant 1 and Dispersant 2, inorganic fine particles were dispersed according to the composition and blending amount (parts by weight) shown in Table 1 to prepare a dispersion. Dispersion method is pre-dispersion (using zirconia beads (1.25 mm) as media and dispersing for 1 hour with a paint shaker) and main dispersion (using zirconia beads (0.1 mm) as media). (Dispersion with machine UAM-015). The obtained inorganic fine particle dispersion was diluted with PGMEA and adjusted to the solid content of Table 1.

TiO ₂ : “MT-05” (average primary particle size: 10 nm) manufactured by Teika Co., Ltd.
ZrO ₂ : “PCS-60” manufactured by Nippon Electric Works Co., Ltd. (average primary particle size: 20 nm)
Sb ₂ O _3: Nihonseiko Co. PATOX-U, etc. (average primary particle diameter: 30 nm)
CeO ₂ : TECNAPOW-CEO2 manufactured by Air Brown Co., Ltd. (average primary particle size: 10 nm)

<Production method of fine pigment>
(Blue refined pigment (H1-1))
Phthalocyanine blue pigment C.I. I. Pigment Blue 15: 6 (Toyocolor "Rionol Blue ES") 100 parts, ground salt 800 parts, and diethylene glycol 100 parts were charged into a stainless steel 1 gallon kneader (Inoue Seisakusho) and kneaded at 70 ° C for 12 hours. did. The mixture was poured into 3000 parts of warm water, stirred at a high speed mixer for about 1 hour while being heated to about 70 ° C. to form a slurry, filtered and washed repeatedly to remove salt and solvent, and then at 80 ° C. for 24 hours. It dried and obtained 98 parts of blue refinement | purification pigments (H1-1). The average primary particle diameter of the obtained pigment was 28.3 nm.

(Red fine pigment (H1-2))
Diketopyrrolopyrrole red pigment C.I. I. 120 parts of Pigment Red 254 (“IRGAZIN RED 2030” manufactured by BASF Japan Ltd.), 1000 parts of crushed salt and 120 parts of diethylene glycol were charged into a 1 gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 60 ° C. for 10 hours. The mixture was added to 2000 parts of warm water, heated to about 80 ° C. and stirred with a high speed mixer for about 1 hour to form a slurry, filtered and washed repeatedly to remove salt and solvent, and then at 80 ° C. for 24 hours. It dried and obtained 115 parts of red refined pigment (H1-2). The average primary particle diameter of the obtained pigment was 24.8 nm.

(Purple refined pigment (H1-3))
Dioxazine-based purple pigment C.I. I. 120 parts of Pigment Violet 23 (“Fast Violet RL” manufactured by Clariant), 1600 parts of ground sodium chloride, and 100 parts of diethylene glycol were charged into a stainless 1 gallon kneader (manufactured by Inoue Seisakusho) and kneaded at 90 ° C. for 18 hours. The mixture was poured into 5000 parts of warm water, stirred at a high speed mixer for about 1 hour while being heated to about 70 ° C. to form a slurry, filtered and washed repeatedly to remove salt and solvent, and then at 80 ° C. for 24 hours. It dried and obtained 118 parts of purple refinement | purification pigments (H1-3). The average primary particle diameter of the obtained pigment was 26.4 nm.

<Method for producing pigment dispersion>
(Blue pigment dispersion (H-1))
The mixture having the composition shown below was uniformly stirred and mixed, and then dispersed with an Eiger mill (“Mini Model M-250 MKII” manufactured by Eiger Japan) for 5 hours using zirconia beads having a diameter of 1 mm, followed by a 5 μm filter. Filtration gave a blue pigment dispersion (H-1).

Blue refined pigment (H1-1): 18.0 parts Copper phthalocyanine derivative: 2.0 parts


-Resin type pigment dispersant: 8.0 parts (BYK-111 manufactured by BYK Japan)
Resin solution (A2-1): 60.0 parts Cyclohexanone: 12.0 parts

(Red pigment dispersion (H-2))
A red pigment dispersion (H-2) was obtained in the same manner as the blue pigment dispersion (H-1) using a mixture having the following composition.

-Red fine pigment (H1-2): 10.0 parts-Anthraquinone pigment (CI Pigment Red 177): 2.0 parts (BASF Japan "Chromophthal Red A2B")
・ Diketopyrrolopyrrole pigment derivative: 4.0 parts

-Resin type pigment dispersant: 8.0 parts ("Solsperse 20000" manufactured by Nippon Lubrizol)
Resin solution (A2-1): 60.0 parts Cyclohexanone: 12.0 parts

(Purple pigment dispersion (H-3))
A purple pigment dispersion (H-3) was obtained in the same manner as the blue pigment dispersion (H-1) using a mixture having the following composition.

・ Purple refined pigment (H1-3): 20.0 parts ・ Resin type pigment dispersant: 8.0 parts (BYK-111 manufactured by BYK Japan)
Resin solution (A2-1): 60.0 parts Cyclohexanone: 12.0 parts

[Example 1]
(Photosensitive resin composition (R1))
A mixture having the following composition was stirred and mixed so as to be uniform, and then filtered through a 1 μm filter to obtain a photosensitive resin composition (R1).

Alkali-soluble resin (A); A1-a1: 47.22 parts Silane coupling agent (I); KBM-403: 0.10 parts isocyanate skeleton-containing compound (C): 0.80 parts Trichloroisocyanuric acid
Photopolymerization initiator; OXE-01: 0.20 part Irgacure OXE-01 (manufactured by BASF Japan Ltd.)
1,2-octanedione-1- [4- (phenylthio) phenyl-, 2- (o-benzoyloxime)]
Leveling agent: BYK-330 2%: 1.00 part BYK-330 2% (manufactured by Big Chemie);
PGMEA solution of polyether structure-containing dimethylsiloxane (adjusted to 2 wt% nonvolatile content)
Solvent; PGMEA: 50.68 parts Propylene glycol monomethyl ether acetate

[Examples 2-31, Comparative Examples 1-4]
(Photosensitive resin composition (R2-33))
1 μm filter after stirring and mixing the mixture to be uniform in the same manner as the photosensitive resin composition (R1) except that the composition and amount (parts by weight) shown in Tables 2 to 9 were changed. To obtain a photosensitive resin composition (R2 to 33).

Abbreviations in Tables 2-9 are shown below.
<Resin solution>
UC-3000: Alfon UC-3000 (manufactured by Toagosei Co., Ltd.); PGMEA solution of acrylic resin having acid groups (solid content 40%)
UH-2000: Alfon UH-2000 (manufactured by Toagosei Co., Ltd.); PGMEA solution of acrylic resin having a hydroxyl group (solid content 40%)

<< Silane coupling agent (I) >>
<Silane coupling agent having epoxy group>
KBM-303; KBM-303 (manufactured by Shin-Etsu Chemical Co., Ltd.); β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; KBM-403; KBM-403 (manufactured by Shin-Etsu Chemical Co., Ltd.); γ-glycid Xylpropyltrimethoxysilane <Silane coupling agent having (meth) acryloxy group>
KBM-503; KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd.); γ-methacryloxypropyltrimethoxysilane <silane coupling agent having an amino group>
KBM-573; KBM-573 (manufactured by Shin-Etsu Chemical Co., Ltd.); N-phenyl-γ-aminopropyltrimethoxysilane

<< Silane compound >>
・ KF-96: KF-96 (manufactured by Shin-Etsu Chemical Co., Ltd.); silicone oil

<< Isocyanurate skeleton-containing compound (C) >>
Trichloroisocyanuric acid; Neochlor-90 (manufactured by Shikoku Chemicals); 1,3,5-trichloro-1,3,5-triazinetrione

TEPIC-VL; TEPIC-VL (manufactured by Nissan Chemical Industries); Tris (epoxypentyl) isocyanurate In general formula (101), all of R ₁ , R ₂ and R ₃ are represented by general formula (6)

A-9300; A-9300 (manufactured by Shin-Nakamura Chemical Co., Ltd.); isocyanuric acid EO-modified triacrylate In general formula (101), all of R ₁ , R ₂ and R ₃ are represented by general formula (3)

M-315; Aronix M-315 (manufactured by Toagosei Co., Ltd.); a mixture of isocyanuric acid EO-modified diacrylate and isocyanuric acid EO-modified triacrylate In the general formula (101),
R ₁ , R ₂ , and R ₃ are all represented by the general formula (3)
Alternatively, _{two of} R ₁ , R ₂ and R ₃ are represented by the general formula (3), and one is represented by the general formula (8)



A-9300-1CL; A-9300-1CL (manufactured by Shin-Nakamura Chemical Co., Ltd.); ε-caprolactone-modified tris- (2-acryloxyethyl) isocyanurate In the general formula (101), R ₁ , R ₂ , and R All _three are general formulas (4)

"monomer";
M-402; Aronix M-402 (manufactured by Toagosei Co., Ltd.); a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate

<Inorganic fine particle (D) dispersion>
-Inorganic fine particle dispersion; (D-1) Titanium oxide dispersion-Inorganic fine particle dispersion; (D-2) Zirconium oxide dispersion-Inorganic fine particle dispersion; (D-3) Antimony oxide dispersion-Inorganic fine particle dispersion (D-4) cerium oxide dispersion / inorganic fine particle dispersion; (D-5) titanium oxide dispersion;

<< Photopolymerization initiator (B) >>
OXE-01; Irgacure OXE-01 (manufactured by BASF Japan); 1,2-octanedione-1- [4- (phenylthio) phenyl-, 2- (o-benzoyloxime)]

《Leveling agent (F)》
-BYK-330 2% (manufactured by BYK-Chemie); polyether structure-containing dimethylsiloxane PGMEA solution (adjusted to 2 wt% nonvolatile content)

<< Solvent (E) >>
・ PGMEA; Propylene glycol monomethyl ether acetate

<Evaluation of photosensitive resin composition>
The photosensitive resin compositions (R1 to R33) were evaluated by the following evaluation methods. The results are shown in Tables 10-17.

(Measurement of pencil hardness)
The finished film thickness after heating the photosensitive resin composition (R1 to R33) to a glass substrate of 100 mm × 100 mm, 0.7 mm thickness (Corning Glass Eagle 2000) at 230 ° C. for 20 minutes using a spin coater is 2 A substrate coated to a thickness of 0.0 μm was obtained. Next, after holding for 2 minutes on a hot plate heated to 100 ° C., ultraviolet exposure was performed using an ultrahigh pressure mercury lamp at an illuminance of 20 mW / cm ² and an exposure amount of 100 mJ / cm ² . The coated substrate was heated at 230 ° C. for 20 minutes and allowed to cool. The substrate returned to room temperature was heated at 260 ° C. for 60 minutes and allowed to cool. With respect to this substrate, the pencil surface hardness of the protective film was measured by the 8.4.1 pencil scratch test of JIS K-5400-1990. When this value is 3H or more, it is a very good level (◎), 2H is a good level (○), H is a practical level (Δ), and F or less is a level not suitable for practical use (x).

(Measurement of substrate adhesion)
The photosensitive resin composition (R1 to R33) is heated at 230 ° C. for 20 minutes using a spin coater on a Mo substrate (manufactured by Toho Kaken Co., Ltd.) on a 100 mm × 100 mm, 0.7 mm thick ITO substrate (manufactured by Geomatech). The board | substrate apply | coated so that the finished film thickness after that might be set to 2.0 micrometers was obtained. Next, after holding for 2 minutes on a hot plate heated to 100 ° C., ultraviolet exposure was performed using an ultrahigh pressure mercury lamp at an illuminance of 20 mW / cm ² and an exposure amount of 100 mJ / cm ² . The coated substrate was heated at 230 ° C. for 20 minutes and allowed to cool to produce an evaluation substrate. The obtained substrate was evaluated for the adhesion of the coating film by an adhesion (cross-cut method) test according to JIS K5600-5-6, and the number of peels in 25 grids was counted.

○: Number of cross-cuts peeled 0: Δ; Number of cross-cuts peeled: 1 or more and less than 3 ×; Number of cross-cuts peeled: 3 or more

(Measurement of etchant resistance)
ITO etchant resistance After being applied on the ITO substrate by the same method as that prepared for transmittance measurement, it was immersed in ITO etchant; nitric acid / hydrochloric acid / water = 0.1 / 1/1 at 40 ° C. for 5 minutes, After washing with pure water, it was left for 24 hours. The obtained substrate was evaluated for substrate adhesion of the coating film by an adhesion (cross-cut method) test according to JIS K5600-5-6, and the number of peels in 25 grids was counted.

Number of cross-cuts peeled off 0 → Practical level (Judgment ○)
Number of peeled grids 1 or more and less than 3 → Practical level (judgment △)
Number of cross-cuts 3 or more → Practical hindrance (judgment ×)

Mo etchant resistance After applying on Mo substrate by the same method as that prepared for transmittance measurement, Mo etchant; phosphoric acid / acetic acid / nitric acid / water = 80/5/5/10 at 40 ° C. for 5 minutes After immersing and washing with pure water, it was left for 24 hours. The obtained substrate was evaluated for substrate adhesion of the coating film by an adhesion (cross-cut method) test according to JIS K5600-5-6, and the number of peels in 25 grids was counted.

Number of cross-cuts peeled off 0 → Practical level (Judgment ○)
Number of peeled grids 1 or more and less than 3 → Practical level (judgment △)
Number of cross-cuts 3 or more → Practical hindrance (judgment ×)

(Measurement of wet heat resistance)
Finished film after photosensitive resin composition (R1 to R33) is heated at 230 ° C. for 20 minutes on a 100 mm × 100 mm, 0.7 mm thick ITO substrate (manufactured by Geomatek) or Mo base using a spin coater A substrate coated so as to have a thickness of 2.0 μm was obtained. Next, after holding for 2 minutes on a hot plate heated to 100 ° C., ultraviolet exposure was performed using an ultrahigh pressure mercury lamp at an illuminance of 20 mW / cm ² and an exposure amount of 100 mJ / cm ² . The coated substrate was heated at 230 ° C. for 20 minutes and allowed to cool to produce an evaluation substrate. The advanced accelerated life test apparatus EHS-411M manufactured by ESPEC CORP. Was set at a temperature of 120 ° C. and a relative humidity of 100%, and left in the furnace for 48 hours, and then the obtained substrate was attached according to JIS K5600-5-6. The adhesion of the coating film was evaluated by a property (cross-cut method) test, and the number of peels in 25 grids was counted.

○: Number of cross-cuts peeled 0: Δ; Number of cross-cuts peeled: 1 or more and less than 3 ×; Number of cross-cuts peeled: 3 or more

(Bone appearance evaluation)
A substrate was prepared by sputtering ITO on glass. Thereafter, ITO was patterned using a hydrochloric acid-nitric acid etching solution. The resin composition (R1 to R33) was applied to the ITO pattern substrate by the same method as “Measurement of transmittance”. However, the finished film thickness was adjusted to 0.05, 0.40, 0.60, and 2.0 μm. The obtained board | substrate was confirmed visually from both sides, and the difficulty of seeing the boundary of the part with ITO and the part without ITO was determined.

◎: Not visible at all ○: Almost invisible △: Looks thin ×: Visible

  As shown in Tables 10 to 17, by including the alkali-soluble resin (A), the silane coupling agent (I), and the isocyanurate skeleton-containing compound (C), which are features of the present invention, the hardness, ITO, and Mo are improved. The overcoat resin composition was excellent in adhesion, etchant resistance, moisture and heat resistance, etc.

  In particular, when inorganic oxide fine particles are included, there is a better effect on bone appearance, and even when the inorganic oxide is different, the effect of improving bone appearance is obtained by setting the refractive index to a value greater than a certain value. there were.

  In Comparative Examples 1 to 4, examples deviating from the requirements of the present invention are given, and any of the practical properties such as low adhesion, etchant resistance, and low heat-and-moisture resistance were deteriorated.

From the above results, the overcoat resin composition of the present application can provide a coating film with high hardness, adhesion, etchant resistance, heat and humidity resistance, and bone appearance improving effect. It was confirmed that this was a high-quality cured coating suitable for coating.

Claims (11)

  An overcoat resin composition comprising an alkali-soluble resin (A), a silane coupling agent (I), and an isocyanurate skeleton-containing compound (C). The photosensitive resin composition for overcoat according to claim 1, wherein the isocyanurate skeleton-containing compound (C) contains an isocyanurate skeleton-containing compound (C1) represented by the following general formula (101).
[In General Formula (101), R ₁ , R ₂ and R ₃ are each independently a hydrogen atom, a chlorine atom, a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent, or a general formula It is group represented by (1)-(8), and at least 1 is any group represented by general formula (1)-(8). ]


[In General Formulas (1) to (8), R ₄ , R ₅ and R ₆ are each independently either H or CH ₃ . n is an integer of 0-10. m is an integer of 1-20 each independently. l is an integer of 1-5. ]   The isocyanurate skeleton-containing compound (C1) represented by the general formula (101) has at least one group represented by any of the general formulas (1), (3) and (4). The photosensitive resin composition for overcoats according to claim 2.   4. The isocyanurate skeleton-containing compound (C1) represented by the general formula (101) is contained in an amount of 5 to 30% by weight in the entire solid content of the overcoat photosensitive resin composition. A photosensitive resin composition for overcoat. The alkali-soluble resin (A) contains a resin (A1) having at least one structural unit selected from the group consisting of the following structural units (a), (b) and (c). The photosensitive resin composition for overcoats of any one of -4.

(A) Structural unit having an aromatic ring group represented by general formula (11) or general formula (12):
[In General Formula (11) and General Formula (12), R ⁵⁶ represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms which may have a benzene ring. ]
(B) A structural unit having an aliphatic cyclic group represented by chemical formula (14) or chemical formula (15):

(C) Structural unit having a compound represented by the following general formula (40) as a precursor:
[In General Formula (40), R ₂₁ and R ₂₂ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]
[In General Formula (41), R ₂₃ and R ₂₄ each independently represent a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent. ]   The alkali-soluble resin (A) is at least one selected from the group consisting of a resin (A1-a) having the structural units (a) and (b) and a resin (A1-b) having the structural unit (c). The photosensitive resin composition for overcoat according to claim 5, comprising:   The photosensitive resin composition for overcoat according to any one of claims 1 to 6, wherein the silane coupling agent (I) is contained in an amount of 0.5 to 30% by weight in the whole solid content.   Furthermore, inorganic fine particles (D) of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, indium, tin, antimony and cerium are contained. Item 1. A photosensitive resin composition for overcoat according to item 1.   The photosensitive resin composition for overcoat according to claim 8, wherein the inorganic fine particles (D) are inorganic fine particles of zirconium or titanium.   The overcoat according to any one of claims 1 to 9, wherein the silane coupling agent (I) contains at least one organic group selected from a (meth) acryloxy group, an epoxy group, and a carbamate group. Photosensitive resin composition.   The coating film formed from the photosensitive resin composition for overcoats of any one of Claims 1-10.