JP5663804B2 - 基板内蔵用チップ抵抗器およびその製造方法 - Google Patents
基板内蔵用チップ抵抗器およびその製造方法 Download PDFInfo
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- JP5663804B2 JP5663804B2 JP2013241416A JP2013241416A JP5663804B2 JP 5663804 B2 JP5663804 B2 JP 5663804B2 JP 2013241416 A JP2013241416 A JP 2013241416A JP 2013241416 A JP2013241416 A JP 2013241416A JP 5663804 B2 JP5663804 B2 JP 5663804B2
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- chip resistor
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- protective film
- electrode
- internal electrodes
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- 239000000758 substrate Substances 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title description 7
- 230000001681 protective effect Effects 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Images
Description
Claims (4)
- 表面と裏面とを有する絶縁性基板と、
該基板の表面に形成された一対の内部電極と、
該一対の内部電極間に形成された抵抗膜と、
該抵抗膜が形成された領域を覆い、前記内部電極の少なくとも一部が露出するように形成された第1保護膜と、前記抵抗膜が形成された領域の少なくとも一部を覆う第2保護膜と、
前記内部電極の露出部と接続され、前記第2保護膜の端部を覆うように形成された一対の第2内部電極と、該第2内部電極を被覆する外部電極とを備え、
該外部電極は広く且つ平坦な電極面を有し、前記一対の第2内部電極の間隔は、前記一対の内部電極の間隔よりも狭く、前記外部電極の表面が前記第2保護膜の表面よりも高い、基板内蔵用チップ抵抗器。 - 前記外部電極はCuメッキ層からなる、請求項1に記載の基板内蔵用チップ抵抗器。
- 前記外部電極はNiメッキ層および該Niメッキ層を被覆するCuメッキ層からなる、請求項1に記載の基板内蔵用チップ抵抗器。
- 前記第2内部電極は導電性樹脂で形成された、請求項1に記載の基板内蔵用チップ抵抗器。
Priority Applications (1)
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JP2013241416A JP5663804B2 (ja) | 2013-11-22 | 2013-11-22 | 基板内蔵用チップ抵抗器およびその製造方法 |
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JP2013241416A JP5663804B2 (ja) | 2013-11-22 | 2013-11-22 | 基板内蔵用チップ抵抗器およびその製造方法 |
Related Parent Applications (1)
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JP2009242203A Division JP5481675B2 (ja) | 2009-10-21 | 2009-10-21 | 基板内蔵用チップ抵抗器およびその製造方法 |
Publications (2)
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JP2014057096A JP2014057096A (ja) | 2014-03-27 |
JP5663804B2 true JP5663804B2 (ja) | 2015-02-04 |
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JP2013241416A Active JP5663804B2 (ja) | 2013-11-22 | 2013-11-22 | 基板内蔵用チップ抵抗器およびその製造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190059910A (ko) | 2016-10-07 | 2019-05-31 | 세미텍 가부시키가이샤 | 용접용 전자 부품, 실장 기판 및 온도 센서 |
US10527501B2 (en) | 2015-09-16 | 2020-01-07 | Semitec Corporation | Resistor and temperature sensor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023056844A (ja) * | 2021-10-08 | 2023-04-20 | Koa株式会社 | チップ抵抗器およびチップ抵抗器の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58109201U (ja) * | 1982-01-19 | 1983-07-25 | 株式会社日立製作所 | チツプ抵抗器 |
JPH07111921B2 (ja) * | 1989-08-01 | 1995-11-29 | 釜屋電機株式会社 | チップ抵抗器 |
JP2559341B2 (ja) * | 1994-07-21 | 1996-12-04 | 釜屋電機株式会社 | チップ型抵抗器の製造方法 |
JP3766492B2 (ja) * | 1996-12-20 | 2006-04-12 | ローム株式会社 | チップ型抵抗器の構造及びその製造方法 |
JP2000299203A (ja) * | 1999-04-15 | 2000-10-24 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2003124010A (ja) * | 2001-10-18 | 2003-04-25 | Rohm Co Ltd | チップ型電子部品の製造方法、およびチップ型電子部品 |
CN1726565A (zh) * | 2002-12-16 | 2006-01-25 | 兴亚株式会社 | 电阻材料、电阻元件、电阻器及电阻器的制造方法 |
JP2004253467A (ja) * | 2003-02-18 | 2004-09-09 | Rohm Co Ltd | チップ抵抗器 |
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2013
- 2013-11-22 JP JP2013241416A patent/JP5663804B2/ja active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10527501B2 (en) | 2015-09-16 | 2020-01-07 | Semitec Corporation | Resistor and temperature sensor |
KR20190059910A (ko) | 2016-10-07 | 2019-05-31 | 세미텍 가부시키가이샤 | 용접용 전자 부품, 실장 기판 및 온도 센서 |
US11215514B2 (en) | 2016-10-07 | 2022-01-04 | Semitec Corporation | Electronic component for welding, mounted board and temperature sensor |
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JP2014057096A (ja) | 2014-03-27 |
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