JP6715024B2 - 基板内層用チップ抵抗器 - Google Patents
基板内層用チップ抵抗器 Download PDFInfo
- Publication number
- JP6715024B2 JP6715024B2 JP2016032409A JP2016032409A JP6715024B2 JP 6715024 B2 JP6715024 B2 JP 6715024B2 JP 2016032409 A JP2016032409 A JP 2016032409A JP 2016032409 A JP2016032409 A JP 2016032409A JP 6715024 B2 JP6715024 B2 JP 6715024B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- chip resistor
- pair
- resin layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 83
- 230000001681 protective effect Effects 0.000 claims description 23
- 229920005989 resin Polymers 0.000 description 50
- 239000011347 resin Substances 0.000 description 50
- 238000005452 bending Methods 0.000 description 11
- 239000010949 copper Substances 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
2 樹脂層
3,11,21 チップ抵抗器
4 配線パターン
5 接続ビア
5a ビアホール
6 絶縁基板
7 内部電極
8,23 抵抗体
9 保護膜
10 外部電極
22 放熱体
22a 貫通孔
24 粘着テープ
25 支持板
26 上側樹脂層
27 下側樹脂層
40,50,60 基板内層用チップ抵抗器
Claims (1)
- 直方体形状の絶縁基板と、この絶縁基板の一面である第1面に所定間隔を存して形成された一対の内部電極と、これら一対の内部電極間に形成された抵抗体と、この抵抗体と前記一対の内部電極を含めて前記第1面の全体を覆うように形成された絶縁性の保護膜と、前記第1面の長辺に隣接する前記絶縁基板の第2面に形成されて前記内部電極と接続する一対の外部電極とを備え、
前記一対の外部電極が前記絶縁基板の前記第2面のみに形成されていると共に、前記一対の外部電極の間隔が前記一対の内部電極の間隔よりも狭く設定されていることを特徴とする基板内層用チップ抵抗器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016032409A JP6715024B2 (ja) | 2016-02-23 | 2016-02-23 | 基板内層用チップ抵抗器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016032409A JP6715024B2 (ja) | 2016-02-23 | 2016-02-23 | 基板内層用チップ抵抗器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017152495A JP2017152495A (ja) | 2017-08-31 |
JP6715024B2 true JP6715024B2 (ja) | 2020-07-01 |
Family
ID=59739784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016032409A Active JP6715024B2 (ja) | 2016-02-23 | 2016-02-23 | 基板内層用チップ抵抗器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6715024B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110958758A (zh) | 2018-09-26 | 2020-04-03 | 奥特斯(中国)有限公司 | 部件承载件及板件 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09330802A (ja) * | 1996-06-07 | 1997-12-22 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JPH11162706A (ja) * | 1997-11-28 | 1999-06-18 | Taiyo Yuden Co Ltd | チップ抵抗器 |
JP5157178B2 (ja) * | 2006-02-02 | 2013-03-06 | パナソニック株式会社 | 角形チップ抵抗器 |
JP2011199188A (ja) * | 2010-03-23 | 2011-10-06 | Taiyosha Electric Co Ltd | チップ抵抗器 |
JP2012079994A (ja) * | 2010-10-05 | 2012-04-19 | Yamaichi Electronics Co Ltd | 部品内蔵プリント配線板およびその製造方法 |
WO2012133313A1 (ja) * | 2011-03-29 | 2012-10-04 | 株式会社村田製作所 | 部品内蔵樹脂基板の製造方法 |
JP6285096B2 (ja) * | 2011-12-26 | 2018-02-28 | ローム株式会社 | チップ抵抗器、および、電子デバイス |
JP5394560B2 (ja) * | 2012-11-27 | 2014-01-22 | 太陽誘電株式会社 | 複合多層基板およびそれを用いたモジュール |
-
2016
- 2016-02-23 JP JP2016032409A patent/JP6715024B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2017152495A (ja) | 2017-08-31 |
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