JP5655244B2 - 配線基板およびその製造方法、並びに半導体装置およびその製造方法 - Google Patents

配線基板およびその製造方法、並びに半導体装置およびその製造方法 Download PDF

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Publication number
JP5655244B2
JP5655244B2 JP2010245359A JP2010245359A JP5655244B2 JP 5655244 B2 JP5655244 B2 JP 5655244B2 JP 2010245359 A JP2010245359 A JP 2010245359A JP 2010245359 A JP2010245359 A JP 2010245359A JP 5655244 B2 JP5655244 B2 JP 5655244B2
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Japan
Prior art keywords
opening
wiring
layer
wiring board
hole
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JP2010245359A
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Japanese (ja)
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JP2012099610A (ja
JP2012099610A5 (https=
Inventor
芳樹 奥島
芳樹 奥島
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2010245359A priority Critical patent/JP5655244B2/ja
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Publication of JP2012099610A5 publication Critical patent/JP2012099610A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2010245359A 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法 Active JP5655244B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010245359A JP5655244B2 (ja) 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010245359A JP5655244B2 (ja) 2010-11-01 2010-11-01 配線基板およびその製造方法、並びに半導体装置およびその製造方法

Publications (3)

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JP2012099610A JP2012099610A (ja) 2012-05-24
JP2012099610A5 JP2012099610A5 (https=) 2013-09-05
JP5655244B2 true JP5655244B2 (ja) 2015-01-21

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JP (1) JP5655244B2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849232B2 (en) 2019-02-11 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
US11355426B2 (en) 2020-07-31 2022-06-07 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116548A (ja) 2012-12-12 2014-06-26 Ngk Spark Plug Co Ltd 多層配線基板およびその製造方法
JP5462404B1 (ja) * 2013-09-12 2014-04-02 太陽誘電株式会社 部品内蔵基板及び部品内蔵基板用コア基材
KR102306719B1 (ko) * 2015-04-22 2021-09-30 삼성전기주식회사 인쇄회로기판, 그 제조방법, 및 전자부품 모듈
KR101666757B1 (ko) * 2015-07-13 2016-10-24 앰코 테크놀로지 코리아 주식회사 반도체 패키지
JP2017123459A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
KR102767455B1 (ko) 2020-01-20 2025-02-14 삼성전자주식회사 차단층을 포함하는 반도체 패키지
US11257742B2 (en) 2020-07-02 2022-02-22 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same
WO2026033955A1 (ja) * 2024-08-07 2026-02-12 株式会社村田製作所 配線基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3894640B2 (ja) * 1997-12-25 2007-03-22 大日本印刷株式会社 配線基板の製造方法
JP2005197763A (ja) * 1999-03-30 2005-07-21 Ngk Spark Plug Co Ltd コンデンサ付属配線基板、配線基板、及びコンデンサ
JP3582645B2 (ja) * 2000-05-16 2004-10-27 日立エーアイシー株式会社 立体形配線板の製造方法
JP2004235222A (ja) * 2003-01-28 2004-08-19 Airex Inc プリント配線板の製造方法
JP4581768B2 (ja) * 2005-03-16 2010-11-17 ソニー株式会社 半導体装置の製造方法
JP4906903B2 (ja) * 2009-10-20 2012-03-28 新光電気工業株式会社 電子部品内蔵基板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10849232B2 (en) 2019-02-11 2020-11-24 Samsung Electro-Mechanics Co., Ltd. Printed circuit board
US11355426B2 (en) 2020-07-31 2022-06-07 Advanced Semiconductor Engineering, Inc. Wiring structure and method for manufacturing the same

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Publication number Publication date
JP2012099610A (ja) 2012-05-24

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