JP5647316B2 - フレキシブル回路基板 - Google Patents

フレキシブル回路基板 Download PDF

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Publication number
JP5647316B2
JP5647316B2 JP2013209389A JP2013209389A JP5647316B2 JP 5647316 B2 JP5647316 B2 JP 5647316B2 JP 2013209389 A JP2013209389 A JP 2013209389A JP 2013209389 A JP2013209389 A JP 2013209389A JP 5647316 B2 JP5647316 B2 JP 5647316B2
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JP
Japan
Prior art keywords
film
circuit board
flexible circuit
base film
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013209389A
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English (en)
Japanese (ja)
Other versions
JP2014013940A (ja
Inventor
服部　好弘
好弘 服部
正三 浅井
正三 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Components Inc
Original Assignee
Canon Components Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Components Inc filed Critical Canon Components Inc
Priority to JP2013209389A priority Critical patent/JP5647316B2/ja
Publication of JP2014013940A publication Critical patent/JP2014013940A/ja
Application granted granted Critical
Publication of JP5647316B2 publication Critical patent/JP5647316B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2013209389A 2012-03-02 2013-10-04 フレキシブル回路基板 Expired - Fee Related JP5647316B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013209389A JP5647316B2 (ja) 2012-03-02 2013-10-04 フレキシブル回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012046914 2012-03-02
JP2012046914 2012-03-02
JP2013209389A JP5647316B2 (ja) 2012-03-02 2013-10-04 フレキシブル回路基板

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012281408A Division JP2013211523A (ja) 2012-03-02 2012-12-25 フレキシブル回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014225444A Division JP5823595B2 (ja) 2012-03-02 2014-11-05 フレキシブル回路基板

Publications (2)

Publication Number Publication Date
JP2014013940A JP2014013940A (ja) 2014-01-23
JP5647316B2 true JP5647316B2 (ja) 2014-12-24

Family

ID=50109404

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013209389A Expired - Fee Related JP5647316B2 (ja) 2012-03-02 2013-10-04 フレキシブル回路基板
JP2014225444A Expired - Fee Related JP5823595B2 (ja) 2012-03-02 2014-11-05 フレキシブル回路基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014225444A Expired - Fee Related JP5823595B2 (ja) 2012-03-02 2014-11-05 フレキシブル回路基板

Country Status (1)

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JP (2) JP5647316B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013211523A (ja) 2012-03-02 2013-10-10 Canon Components Inc フレキシブル回路基板
JP5647316B2 (ja) * 2012-03-02 2014-12-24 キヤノン・コンポーネンツ株式会社 フレキシブル回路基板
KR101588659B1 (ko) * 2014-12-02 2016-01-27 제이앤디써키트주식회사 발광 소자가 실장가능한 인쇄 회로 기판의 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0575219A (ja) * 1991-07-25 1993-03-26 Sharp Corp フレキシブル回路基板及びフレキシブル回路基板の製造方法
ES2276850T3 (es) * 2000-10-25 2007-07-01 Velcro Industries B.V. Fijacion de conductores electricos.
JP2006024906A (ja) * 2004-06-10 2006-01-26 Showa Denko Kk プリント回路用アルミニウム基板及びその製造方法、並びにプリント基板及びその製造方法
JP2010225943A (ja) * 2009-03-24 2010-10-07 Toshiba Corp 半導体装置
JP2011199090A (ja) * 2010-03-23 2011-10-06 Shindo Denshi Kogyo Kk フレキシブルプリント配線板の製造方法、半導体装置の製造方法、ディスプレイ装置の製造方法、フレキシブルプリント配線板、半導体装置及びディスプレイ装置
JP5274586B2 (ja) * 2011-01-17 2013-08-28 キヤノン・コンポーネンツ株式会社 フレキシブル回路基板
JP5647316B2 (ja) * 2012-03-02 2014-12-24 キヤノン・コンポーネンツ株式会社 フレキシブル回路基板

Also Published As

Publication number Publication date
JP2014013940A (ja) 2014-01-23
JP5823595B2 (ja) 2015-11-25
JP2015046625A (ja) 2015-03-12

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