JP5647194B2 - フレキシブルプリント基板及びその製造方法 - Google Patents
フレキシブルプリント基板及びその製造方法 Download PDFInfo
- Publication number
- JP5647194B2 JP5647194B2 JP2012176921A JP2012176921A JP5647194B2 JP 5647194 B2 JP5647194 B2 JP 5647194B2 JP 2012176921 A JP2012176921 A JP 2012176921A JP 2012176921 A JP2012176921 A JP 2012176921A JP 5647194 B2 JP5647194 B2 JP 5647194B2
- Authority
- JP
- Japan
- Prior art keywords
- bus bar
- eyelet
- connection terminal
- flexible printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/24—Electric supply or control circuits therefor
- B23K11/25—Monitoring devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/10—Spot welding; Stitch welding
- B23K11/11—Spot welding
- B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/36—Auxiliary equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
22 ベース
23 銅箔部(回路部の接続端子)
24 カバー
25 フレキシブルプリント基板
26 ハトメ
27 電極
28 電極
29 プッシュロッド
30 電流経路
Claims (3)
- バスバーに接合される接続端子を備えた回路部を有するフレキシブルプリント基板において、前記回路部の接続端子にハトメを止着すると共に、該ハトメと前記バスバー間、前記ハトメと前記接続端子間、及び該接続端子と前記バスバー間を夫々溶接により接合したことを特徴とするフレキシブルプリント基板。
- バスバーに接合される接続端子を備えた回路部を有するフレキシブルプリント基板の製造方法において、
前記回路部の接続端子にハトメを止着する工程と、
前記フレキシブルプリント基板を前記バスバーに載置して、該バスバーの片面に前記ハトメ及び前記接続端子を接触させる工程と、
一対の電極の一方を前記ハトメに押し当てると共に、他方の電極を前記バスバーの片面に押し当て、且つ、一対の電極間に配設したプッシュロッドにより前記回路部の接続端子を前記バスバーに押し付ける工程と、
一対の電極間に通電して前記ハトメと前記バスバー間、前記ハトメと前記接続端子間、及び該接続端子と前記バスバー間を夫々溶接により接合する工程と、
を備えることを特徴とするフレキシブルプリント基板の製造方法。 - バスバーに接合される接続端子を備えた回路部を有するフレキシブルプリント基板の製造方法において、
前記回路部の接続端子にハトメを止着する工程と、
前記フレキシブルプリント基板を前記バスバーに載置して、該バスバーの片面に前記ハトメ及び前記接続端子を接触させる工程と、
前記ハトメと前記バスバー間に絶縁体を介在させた状態で、一対の電極の一方を前記ハトメに押し当てると共に、他方の電極を前記バスバーの片面に押し当て、且つ、一対の電極間に配設したプッシュロッドにより前記回路部の接続端子を前記バスバーに押し付ける工程と、
一対の電極間に通電して、前記ハトメと前記接続端子間、及び該接続端子と前記バスバー間を溶接により接合する工程と、
溶接後、前記絶縁体を取り除いて、前記ハトメと前記バスバー間を溶接により接合する工程と、
を備えることを特徴とするフレキシブルプリント基板の製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012176921A JP5647194B2 (ja) | 2012-08-09 | 2012-08-09 | フレキシブルプリント基板及びその製造方法 |
DE112013000132.2T DE112013000132T5 (de) | 2012-08-09 | 2013-04-23 | Flexible Leiterplatte sowie Verfahren zu deren Herstellung |
CN201380002840.5A CN103766012B (zh) | 2012-08-09 | 2013-04-23 | 柔性印刷电路板及其制造方法 |
PCT/JP2013/061875 WO2014024524A1 (ja) | 2012-08-09 | 2013-04-23 | フレキシブルプリント基板及びその製造方法 |
TW102116779A TWI495407B (zh) | 2012-08-09 | 2013-05-10 | Flexible printed circuit board and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012176921A JP5647194B2 (ja) | 2012-08-09 | 2012-08-09 | フレキシブルプリント基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014036131A JP2014036131A (ja) | 2014-02-24 |
JP5647194B2 true JP5647194B2 (ja) | 2014-12-24 |
Family
ID=50067770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012176921A Active JP5647194B2 (ja) | 2012-08-09 | 2012-08-09 | フレキシブルプリント基板及びその製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5647194B2 (ja) |
CN (1) | CN103766012B (ja) |
DE (1) | DE112013000132T5 (ja) |
TW (1) | TWI495407B (ja) |
WO (1) | WO2014024524A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6513453B2 (ja) * | 2015-03-31 | 2019-05-15 | 株式会社ユーシン | ドアロック装置及びドアロック装置の製造方法 |
CN106552990B (zh) * | 2016-09-13 | 2019-03-01 | 武汉理工大学 | 一种贴片电位器的内部微焊接方法 |
US11695189B2 (en) | 2020-01-09 | 2023-07-04 | Samsung Sdi Co., Ltd. | Battery system with flexible printed circuit |
DE102021117573B4 (de) | 2021-07-07 | 2023-04-13 | Tdk Electronics Ag | Verfahren zur Herstellung einer elektrischen Verbindung zu einem elektronischen Bauteil und einer Chip-Baugruppe |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1141753A (ja) * | 1997-07-18 | 1999-02-12 | Harness Sogo Gijutsu Kenkyusho:Kk | 電気接続箱 |
JPH1146426A (ja) * | 1997-07-28 | 1999-02-16 | Harness Sogo Gijutsu Kenkyusho:Kk | 電気接続箱 |
JP2000263248A (ja) * | 1999-03-16 | 2000-09-26 | Harness Syst Tech Res Ltd | 溶接方法 |
JP2002078150A (ja) * | 2000-08-25 | 2002-03-15 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP2002208788A (ja) * | 2001-01-12 | 2002-07-26 | Rohm Co Ltd | 回路基板、およびその製造方法 |
JP4135516B2 (ja) * | 2003-01-23 | 2008-08-20 | ソニー株式会社 | リード端子及び電源装置 |
JP3776907B2 (ja) * | 2003-11-21 | 2006-05-24 | ローム株式会社 | 回路基板 |
CN101998764B (zh) * | 2009-08-20 | 2012-08-08 | 中达电通股份有限公司 | 一种矩阵式金属氧化物压敏电阻电路板结构及其制造方法 |
KR101075304B1 (ko) * | 2009-10-09 | 2011-10-19 | 삼성에스디아이 주식회사 | 배터리 팩 및 그 제조 방법 |
-
2012
- 2012-08-09 JP JP2012176921A patent/JP5647194B2/ja active Active
-
2013
- 2013-04-23 CN CN201380002840.5A patent/CN103766012B/zh not_active Expired - Fee Related
- 2013-04-23 WO PCT/JP2013/061875 patent/WO2014024524A1/ja active Application Filing
- 2013-04-23 DE DE112013000132.2T patent/DE112013000132T5/de not_active Ceased
- 2013-05-10 TW TW102116779A patent/TWI495407B/zh active
Also Published As
Publication number | Publication date |
---|---|
DE112013000132T5 (de) | 2014-08-21 |
JP2014036131A (ja) | 2014-02-24 |
TW201408146A (zh) | 2014-02-16 |
CN103766012B (zh) | 2017-05-24 |
TWI495407B (zh) | 2015-08-01 |
WO2014024524A1 (ja) | 2014-02-13 |
CN103766012A (zh) | 2014-04-30 |
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