JP5640742B2 - 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 - Google Patents

熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 Download PDF

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Publication number
JP5640742B2
JP5640742B2 JP2010530801A JP2010530801A JP5640742B2 JP 5640742 B2 JP5640742 B2 JP 5640742B2 JP 2010530801 A JP2010530801 A JP 2010530801A JP 2010530801 A JP2010530801 A JP 2010530801A JP 5640742 B2 JP5640742 B2 JP 5640742B2
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conductive pressure
sensitive adhesive
heat conductive
meth
adhesive composition
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JPWO2010035614A1 (ja
Inventor
亮子 西岡
亮子 西岡
拓朗 熊本
拓朗 熊本
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Zeon Corp
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Zeon Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
JP2010530801A 2008-09-26 2009-09-01 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品 Active JP5640742B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010530801A JP5640742B2 (ja) 2008-09-26 2009-09-01 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008249045 2008-09-26
JP2008249045 2008-09-26
JP2010530801A JP5640742B2 (ja) 2008-09-26 2009-09-01 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品
PCT/JP2009/065238 WO2010035614A1 (ja) 2008-09-26 2009-09-01 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品

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JPWO2010035614A1 JPWO2010035614A1 (ja) 2012-02-23
JP5640742B2 true JP5640742B2 (ja) 2014-12-17

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JP2010530801A Active JP5640742B2 (ja) 2008-09-26 2009-09-01 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート、及び電子部品

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Country Link
JP (1) JP5640742B2 (zh)
KR (1) KR20110056375A (zh)
CN (1) CN102165028A (zh)
WO (1) WO2010035614A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012132657A1 (ja) * 2011-03-29 2012-10-04 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
JP2012233049A (ja) * 2011-04-28 2012-11-29 Hitachi Maxell Ltd 機能性粘着シートの製造方法
JP5652365B2 (ja) * 2011-09-28 2015-01-14 日本ゼオン株式会社 熱伝導性感圧接着剤組成物、熱伝導性感圧接着性シート状成形体、これらの製造方法、及び電子部品
KR20140126692A (ko) * 2012-02-14 2014-10-31 닛토덴코 가부시키가이샤 열전도성 점착 시트
JP6151245B2 (ja) * 2012-05-16 2017-06-21 荒川化学工業株式会社 伸縮性放熱シート及びこれが貼付された物品
JP6098289B2 (ja) * 2013-03-28 2017-03-22 デクセリアルズ株式会社 熱伝導性シート
US10040979B2 (en) 2013-09-13 2018-08-07 Dexerials Corporation Thermally conductive sheet
JP6557501B2 (ja) * 2014-10-31 2019-08-07 積水化学工業株式会社 粘着テープ
CN104371574B (zh) * 2014-11-18 2016-05-04 深圳市键键通科技有限公司 一种耐热抗老化导电粘胶及其制备方法
WO2019004459A1 (ja) * 2017-06-29 2019-01-03 日本ゼオン株式会社 電気化学素子用バインダー組成物、電気化学素子機能層用スラリー組成物、電気化学素子接着層用スラリー組成物、および複合膜
CN108307606A (zh) * 2017-12-24 2018-07-20 湛江正信科技服务有限公司 一种相变散热结构及其制作方法
JP7148965B2 (ja) * 2018-11-08 2022-10-06 北川工業株式会社 低誘電熱伝導材用組成物、及び低誘電熱伝導材
EP4053235A4 (en) * 2019-12-18 2023-01-04 LG Energy Solution, Ltd. ELECTRODE COVERING TAPE WITH INORGANIC LAYER AND METHOD OF MANUFACTURE THEREOF

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171557A (ja) * 1997-08-29 1999-03-16 Oji Paper Co Ltd ウェットティシュ用粘着シート
JP2000038785A (ja) * 1998-05-20 2000-02-08 Sekisui Chem Co Ltd 粘着性耐火シ―ト
JP2003041204A (ja) * 2001-07-27 2003-02-13 Fuji Clean:Kk 環境にやさしい塗装用マスキングフィルムロール体及びその製造方法
JP2005307130A (ja) * 2004-04-19 2005-11-04 Ks Shokai:Kk 熱伝導性アルミナ接合剤
JP2006233003A (ja) * 2005-02-24 2006-09-07 Nippon Zeon Co Ltd 熱伝導性感圧接着性シート状成形体及びそれを剥離する方法
JP2007084633A (ja) * 2005-09-21 2007-04-05 Cemedine Co Ltd 難燃性湿気硬化型組成物
JP2007332258A (ja) * 2006-06-14 2007-12-27 Cemedine Co Ltd 難燃性湿気硬化型接着剤組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171557A (ja) * 1997-08-29 1999-03-16 Oji Paper Co Ltd ウェットティシュ用粘着シート
JP2000038785A (ja) * 1998-05-20 2000-02-08 Sekisui Chem Co Ltd 粘着性耐火シ―ト
JP2003041204A (ja) * 2001-07-27 2003-02-13 Fuji Clean:Kk 環境にやさしい塗装用マスキングフィルムロール体及びその製造方法
JP2005307130A (ja) * 2004-04-19 2005-11-04 Ks Shokai:Kk 熱伝導性アルミナ接合剤
JP2006233003A (ja) * 2005-02-24 2006-09-07 Nippon Zeon Co Ltd 熱伝導性感圧接着性シート状成形体及びそれを剥離する方法
JP2007084633A (ja) * 2005-09-21 2007-04-05 Cemedine Co Ltd 難燃性湿気硬化型組成物
JP2007332258A (ja) * 2006-06-14 2007-12-27 Cemedine Co Ltd 難燃性湿気硬化型接着剤組成物

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KR20110056375A (ko) 2011-05-27
CN102165028A (zh) 2011-08-24
WO2010035614A1 (ja) 2010-04-01
JPWO2010035614A1 (ja) 2012-02-23

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