JP5640076B2 - ガラス基板の保持用膜体、及びガラス基板の研磨方法 - Google Patents

ガラス基板の保持用膜体、及びガラス基板の研磨方法 Download PDF

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Publication number
JP5640076B2
JP5640076B2 JP2012508252A JP2012508252A JP5640076B2 JP 5640076 B2 JP5640076 B2 JP 5640076B2 JP 2012508252 A JP2012508252 A JP 2012508252A JP 2012508252 A JP2012508252 A JP 2012508252A JP 5640076 B2 JP5640076 B2 JP 5640076B2
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JP
Japan
Prior art keywords
glass substrate
film body
holding film
polishing
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012508252A
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English (en)
Japanese (ja)
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JPWO2011122454A1 (ja
Inventor
充 古田
充 古田
横田　稔
稔 横田
孝 笹森
孝 笹森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujibo Holdins Inc
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Fujibo Holdins Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd, Fujibo Holdins Inc filed Critical Asahi Glass Co Ltd
Priority to JP2012508252A priority Critical patent/JP5640076B2/ja
Publication of JPWO2011122454A1 publication Critical patent/JPWO2011122454A1/ja
Application granted granted Critical
Publication of JP5640076B2 publication Critical patent/JP5640076B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2012508252A 2010-03-30 2011-03-24 ガラス基板の保持用膜体、及びガラス基板の研磨方法 Active JP5640076B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012508252A JP5640076B2 (ja) 2010-03-30 2011-03-24 ガラス基板の保持用膜体、及びガラス基板の研磨方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010077934 2010-03-30
JP2010077934 2010-03-30
PCT/JP2011/057256 WO2011122454A1 (ja) 2010-03-30 2011-03-24 ガラス基板の保持用膜体、及びガラス基板の研磨方法
JP2012508252A JP5640076B2 (ja) 2010-03-30 2011-03-24 ガラス基板の保持用膜体、及びガラス基板の研磨方法

Publications (2)

Publication Number Publication Date
JPWO2011122454A1 JPWO2011122454A1 (ja) 2013-07-08
JP5640076B2 true JP5640076B2 (ja) 2014-12-10

Family

ID=44712163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012508252A Active JP5640076B2 (ja) 2010-03-30 2011-03-24 ガラス基板の保持用膜体、及びガラス基板の研磨方法

Country Status (5)

Country Link
JP (1) JP5640076B2 (ko)
KR (1) KR101833560B1 (ko)
CN (1) CN102844152B (ko)
TW (1) TW201139056A (ko)
WO (1) WO2011122454A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101612928B1 (ko) * 2013-01-04 2016-04-15 주식회사 엘지화학 연마용 백패드에 유리판을 마운팅하는 장치 및 방법
JP7046539B2 (ja) * 2017-09-21 2022-04-04 富士紡ホールディングス株式会社 保持パッド及びその搬送又は保管方法
KR102607586B1 (ko) * 2018-11-05 2023-11-30 삼성디스플레이 주식회사 기판 지지 장치 및 이를 이용한 기판 연마 방법
JP7205423B2 (ja) * 2018-12-17 2023-01-17 Ａｇｃ株式会社 ガラス基板の保持用膜体、及びガラス基板の研磨方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220838A (ja) * 1989-02-22 1990-09-04 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
JP2001353663A (ja) * 2000-06-13 2001-12-25 Torataro Yoshida 家庭用包丁研ぎ、仕上用研摩板
JP2003324087A (ja) * 2002-04-26 2003-11-14 Toyobo Co Ltd 研磨材
JP2006294742A (ja) * 2005-04-07 2006-10-26 Nitto Denko Corp 被着体の加工方法、該方法により得られる電子素子、及び該方法に用いる両面粘着シート
US20080200105A1 (en) * 2007-02-15 2008-08-21 San Fang Chemical Industry Co., Ltd. Carrier film for mounting polishing workpiece and method for making the same
JP2009119533A (ja) * 2007-11-12 2009-06-04 Fujibo Holdings Inc 保持パッド

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
JP5078527B2 (ja) * 2007-09-28 2012-11-21 富士紡ホールディングス株式会社 研磨布

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220838A (ja) * 1989-02-22 1990-09-04 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
JP2001353663A (ja) * 2000-06-13 2001-12-25 Torataro Yoshida 家庭用包丁研ぎ、仕上用研摩板
JP2003324087A (ja) * 2002-04-26 2003-11-14 Toyobo Co Ltd 研磨材
JP2006294742A (ja) * 2005-04-07 2006-10-26 Nitto Denko Corp 被着体の加工方法、該方法により得られる電子素子、及び該方法に用いる両面粘着シート
US20080200105A1 (en) * 2007-02-15 2008-08-21 San Fang Chemical Industry Co., Ltd. Carrier film for mounting polishing workpiece and method for making the same
JP2009119533A (ja) * 2007-11-12 2009-06-04 Fujibo Holdings Inc 保持パッド

Also Published As

Publication number Publication date
CN102844152B (zh) 2015-09-09
TW201139056A (en) 2011-11-16
JPWO2011122454A1 (ja) 2013-07-08
KR20130018258A (ko) 2013-02-20
KR101833560B1 (ko) 2018-02-28
WO2011122454A1 (ja) 2011-10-06
CN102844152A (zh) 2012-12-26

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