JP5620310B2 - 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 - Google Patents
拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 Download PDFInfo
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- JP5620310B2 JP5620310B2 JP2011054766A JP2011054766A JP5620310B2 JP 5620310 B2 JP5620310 B2 JP 5620310B2 JP 2011054766 A JP2011054766 A JP 2011054766A JP 2011054766 A JP2011054766 A JP 2011054766A JP 5620310 B2 JP5620310 B2 JP 5620310B2
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- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- CPOFMOWDMVWCLF-UHFFFAOYSA-N methyl(oxo)alumane Chemical compound C[Al]=O CPOFMOWDMVWCLF-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000199 molecular distillation Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C09J7/02—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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| JP2011054766A JP5620310B2 (ja) | 2011-03-11 | 2011-03-11 | 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2011054766A JP5620310B2 (ja) | 2011-03-11 | 2011-03-11 | 拡張性粘着フィルム、半導体用ダイシングフィルム、及びそれを用いた半導体装置の製造方法 |
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| Publication Number | Publication Date |
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| JP2012188597A JP2012188597A (ja) | 2012-10-04 |
| JP2012188597A5 JP2012188597A5 (enrdf_load_stackoverflow) | 2014-02-27 |
| JP5620310B2 true JP5620310B2 (ja) | 2014-11-05 |
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|---|---|
| JP (1) | JP5620310B2 (enrdf_load_stackoverflow) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6542502B2 (ja) * | 2013-11-15 | 2019-07-10 | 三井化学株式会社 | 拡張性基材フィルム、ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法 |
| JP6303754B2 (ja) * | 2014-04-21 | 2018-04-04 | 住友ベークライト株式会社 | ダイシングフィルム |
| JP2015214658A (ja) * | 2014-05-12 | 2015-12-03 | 三井化学株式会社 | 拡張性基材フィルム、拡張性粘着フィルム、ダイシングフィルム、拡張性基材フィルムの製造方法、及び半導体装置の製造方法 |
| JP2016162787A (ja) * | 2015-02-27 | 2016-09-05 | 住友ベークライト株式会社 | ダイシングフィルム用基材フィルムおよびダイシングフィルム |
| TW201901847A (zh) * | 2017-05-11 | 2019-01-01 | 日商三井化學東賽璐股份有限公司 | 零件製造用具以及零件製造方法 |
| JP2018076517A (ja) * | 2017-12-01 | 2018-05-17 | 三井化学株式会社 | ダイシングフィルム、半導体用表面保護フィルム、及び半導体装置の製造方法 |
| JP7236366B2 (ja) * | 2019-09-25 | 2023-03-09 | 日東電工株式会社 | 表面保護フィルム |
| JP2022041827A (ja) * | 2020-08-31 | 2022-03-11 | ダイヤプラスフィルム株式会社 | 熱可塑性樹脂フィルム、粘着フィルム、化粧フィルム、化粧用粘着フィルム |
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| JP4545379B2 (ja) * | 2003-01-06 | 2010-09-15 | グンゼ株式会社 | ダイシング用粘着シート |
| JP5448430B2 (ja) * | 2007-12-18 | 2014-03-19 | 古河電気工業株式会社 | ウエハ貼着用貼着シートおよびウエハの加工方法 |
| JP2010092945A (ja) * | 2008-10-03 | 2010-04-22 | Mitsui Chemicals Inc | 半導体ウェハ保護用粘着フィルム及びそれを用いた半導体ウェハの保護方法 |
| JP2012153775A (ja) * | 2011-01-25 | 2012-08-16 | Mitsui Chemicals Inc | フィルム、前記フィルムの製造方法及びそれを用いたｌｅｄパッケージの製造方法 |
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| JP2012188597A (ja) | 2012-10-04 |
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