JP5613100B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP5613100B2
JP5613100B2 JP2011095385A JP2011095385A JP5613100B2 JP 5613100 B2 JP5613100 B2 JP 5613100B2 JP 2011095385 A JP2011095385 A JP 2011095385A JP 2011095385 A JP2011095385 A JP 2011095385A JP 5613100 B2 JP5613100 B2 JP 5613100B2
Authority
JP
Japan
Prior art keywords
metal
metal substrate
bonding
semiconductor device
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011095385A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012227438A5 (https=
JP2012227438A (ja
Inventor
淳也 田中
淳也 田中
太一 中村
太一 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2011095385A priority Critical patent/JP5613100B2/ja
Publication of JP2012227438A publication Critical patent/JP2012227438A/ja
Publication of JP2012227438A5 publication Critical patent/JP2012227438A5/ja
Application granted granted Critical
Publication of JP5613100B2 publication Critical patent/JP5613100B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2011095385A 2011-04-21 2011-04-21 半導体装置の製造方法 Expired - Fee Related JP5613100B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011095385A JP5613100B2 (ja) 2011-04-21 2011-04-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011095385A JP5613100B2 (ja) 2011-04-21 2011-04-21 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2012227438A JP2012227438A (ja) 2012-11-15
JP2012227438A5 JP2012227438A5 (https=) 2014-03-20
JP5613100B2 true JP5613100B2 (ja) 2014-10-22

Family

ID=47277248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011095385A Expired - Fee Related JP5613100B2 (ja) 2011-04-21 2011-04-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP5613100B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7608717B2 (ja) * 2020-03-12 2025-01-07 富士電機株式会社 半導体装置の製造方法及び半導体装置
JP7729024B2 (ja) * 2020-03-12 2025-08-26 富士電機株式会社 半導体装置の製造方法及び半導体装置
CN116982153A (zh) * 2021-03-17 2023-10-31 三菱电机株式会社 半导体装置以及半导体装置的制造方法
CN117012656B (zh) * 2023-09-20 2023-12-05 广东气派科技有限公司 高密度大矩阵sot89封装结构的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05275481A (ja) * 1992-03-30 1993-10-22 Nec Corp 半導体装置の製造方法
JPH08288324A (ja) * 1995-04-15 1996-11-01 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
JP3299421B2 (ja) * 1995-10-03 2002-07-08 三菱電機株式会社 電力用半導体装置の製造方法およびリードフレーム
JP2001024012A (ja) * 1999-07-06 2001-01-26 Hitachi Cable Ltd モールド成型パッケージ及びその製造方法
JP3761857B2 (ja) * 2002-10-11 2006-03-29 三菱電機株式会社 半導体装置
JP2008041851A (ja) * 2006-08-04 2008-02-21 Hitachi Ltd パワー半導体装置
JP5035134B2 (ja) * 2008-06-20 2012-09-26 富士通株式会社 電子部品実装装置及びその製造方法
JP5465942B2 (ja) * 2009-07-16 2014-04-09 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5576627B2 (ja) * 2009-07-31 2014-08-20 富士通株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2012227438A (ja) 2012-11-15

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